公开(公告)号：US07396701B2

公开(公告)日：2008-07-08

申请号：US11281476

申请日：2005-11-18

申请人： Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

发明人： Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L25/162 ,  H01L23/3121 ,  H01L23/4824 ,  H01L23/5227 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L25/50 ,  H01L27/0617 ,  H01L27/0629 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2201/045 ,  H05K2203/081 ,  H05K2203/1476 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2924/01006

摘要： A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.

摘要翻译： 提供了一种可以提高使用PCB作为其模块基板的模块的可靠性的技术。 通过使用热块在低于280℃的温度下进行热处理，进行无铅焊料的单芯片部件43，集成芯片部件44和半导体芯片IC2的焊接。 通过高熔点焊料的半导体芯片IC1的焊接连接通过使用热喷射器在280℃以上的温度进行热处理来进行。 因此，可以使用高熔点焊料将半导体芯片IC 1焊接到PCB 38上，而不会有以下问题：由于热而导致的PCB 38的损坏，例如焊料抗蚀剂的燃烧; 和预浸料从芯材剥离。 因此，半导体芯片IC 1可以以高连接强度安装在PCB 38上。

公开(公告)号：US07005310B2

公开(公告)日：2006-02-28

申请号：US10651087

申请日：2003-08-29

申请人： Kenji Hanada ,  Masaki Nakanishi ,  Tomoo Matsuzawa ,  Koji Shida ,  Kazutoshi Takashima

发明人： Kenji Hanada ,  Masaki Nakanishi ,  Tomoo Matsuzawa ,  Koji Shida ,  Kazutoshi Takashima

IPC分类号： H01L21/00 ,  H04N5/225

CPC分类号： H01L24/97 ,  H01L24/45 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/01029 ,  H01L2924/12043 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/10977 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.

摘要翻译： 传感器芯片和容纳在其中的传感器芯片的透镜架安装在布线基板的表面上，并且在其中容纳透镜的透镜架与透镜安装座联接。 在布线基板的后表面上安装有逻辑芯片，存储芯片和无源部件，并用密封树脂密封。 传感器芯片的电极焊盘通过接合线电连接到布线基板的表面上的电极，但是在布线基板的表面上的电极上还形成有凸块，并且该凸块与接合 线。 在布线基板的表面上，用各向异性导电膜和接合材料粘结柔性基板。 当制造相机模块时，在组装布线基板的背面侧之后组装布线基板的表面侧。

公开(公告)号：US07168161B2

公开(公告)日：2007-01-30

申请号：US10659433

申请日：2003-09-11

申请人： Kenji Hanada ,  Akio Ishizu

发明人： Kenji Hanada ,  Akio Ishizu

IPC分类号： H05K3/30 ,  H01L21/48

CPC分类号： H01L27/14685 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14643 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/19105 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49171 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a method of manufacturing a camera module having a CMOS image sensor, a semiconductor chip to serve as a light sensor is mounted on a optical-component-mounting face of a wiring substrate mother board and, after bonding wires are connected to the semiconductor chip, a lens barrel is joined to the wiring substrate mother board so as to cover the semiconductor chip. A position adjustment pin and a through hole are provided on the lens barrel and the wiring substrate mother board respectively outside a junction face between the lens barrel and the wiring substrate mother board to be used for adjusting the position of the lens barrel with respect to the wiring substrate mother board by inserting the position adjustment pin into the through hole.

摘要翻译： 在制造具有CMOS图像传感器的相机模块的方法中，将用作光传感器的半导体芯片安装在布线基板母板的光学部件安装面上，并且在将导线连接到半导体芯片之后 将透镜筒接合到布线基板母板上以覆盖半导体芯片。 分别在透镜筒和布线基板母板之间的透镜筒和布线基板母板之间的接合面的外侧设置位置调节销和通孔，用于调整镜筒相对于镜筒的位置 通过将位置调整销插入通孔来布线母板。

公开(公告)号：US20060091487A1

公开(公告)日：2006-05-04

申请号：US11304618

申请日：2005-12-16

申请人： Kenji Hanada ,  Masaki Nakanishi ,  Tomoo Matsuzawa ,  Koji Shida ,  Kazutoshi Takashima

发明人： Kenji Hanada ,  Masaki Nakanishi ,  Tomoo Matsuzawa ,  Koji Shida ,  Kazutoshi Takashima

IPC分类号： H01L31/0232 ,  H01L31/062 ,  H01L33/00

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/81801 ,  H01L2224/82 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/86 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2224/85 ,  H01L2924/01079 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.

公开(公告)号：US20050116138A1

公开(公告)日：2005-06-02

申请号：US10946035

申请日：2004-09-22

申请人： Kenji Hanada ,  Masaki Nakanishi ,  Kunio Shigemura ,  Takaomi Nishi ,  Koji Shida ,  Izumi Tezuka ,  Shunichi Abe ,  Yoshihiro Tomita ,  Mitsuaki Seino ,  Tohru Komatsu

发明人： Kenji Hanada ,  Masaki Nakanishi ,  Kunio Shigemura ,  Takaomi Nishi ,  Koji Shida ,  Izumi Tezuka ,  Shunichi Abe ,  Yoshihiro Tomita ,  Mitsuaki Seino ,  Tohru Komatsu

IPC分类号： G02B7/02 ,  G01J1/00 ,  H01J40/14 ,  H01L21/76 ,  H01L27/00 ,  H01L27/14 ,  H04N5/225 ,  H04N5/335

CPC分类号： H01L24/97 ,  H01L24/45 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00

摘要： The reliability and production yield of a solid state image sensing device is improved. Over a surface of a wiring substrate, a sensor chip and a lens-barrel having the sensor chip housed therein are mounted. To the lens-barrel, a lens holder for retaining a lens is connected. Over a back surface of the wiring substrate, a logic chip, a memory chip and a passive part are mounted, and they are sealed with a sealing resin. The lens-barrel and lens holder are each threaded. They are thermally welded while the threads are fitted to each other. The passive part is bonded to the wiring substrate via a Sn—Ag type Pb-free solder. After the wiring substrate is subjected to plasma washing treatment, the sensor chip is mounted over the wiring substrate and an electrode pad of the sensor chip and an electrode of the wiring substrate are electrically connected via a bonding wire.

摘要翻译： 提高了固态摄像装置的可靠性和产量。 在布线基板的表面上安装传感器芯片和容纳有传感器芯片的透镜筒。 连接透镜镜筒，用于保持透镜的透镜保持器。 在布线基板的背面上安装有逻辑芯片，存储芯片和无源部件，并且用密封树脂密封。 透镜镜筒和镜头支架均为螺纹。 它们在螺纹彼此安装时被热焊接。 无源部分通过Sn-Ag型无铅焊料与布线基板接合。 在布线基板进行等离子体洗涤处理之后，将传感器芯片安装在布线基板上，并且传感器芯片的电极焊盘和布线基板的电极经由接合线电连接。

公开(公告)号：US20080253100A1

公开(公告)日：2008-10-16

申请号：US12137869

申请日：2008-06-12

申请人： Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

发明人： Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

IPC分类号： H05K7/06

CPC分类号： H01L25/162 ,  H01L23/3121 ,  H01L23/4824 ,  H01L23/5227 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L25/50 ,  H01L27/0617 ,  H01L27/0629 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2201/045 ,  H05K2203/081 ,  H05K2203/1476 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2924/01006

摘要： A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.

摘要翻译： 提供了一种可以提高使用PCB作为其模块基板的模块的可靠性的技术。 通过使用热块在低于280℃的温度下进行热处理，进行无铅焊料的单芯片部件43，集成芯片部件44和半导体芯片IC2的焊接连接。 通过高熔点焊料的半导体芯片IC1的焊接连接通过使用热喷射器在280℃以上的温度进行热处理来进行。 因此，可以使用高熔点焊料将半导体芯片IC 1焊接到PCB 38上，而不会有以下问题：由于热而导致的PCB 38的损坏，例如焊料抗蚀剂的燃烧; 和预浸料从芯材剥离。 因此，半导体芯片IC 1可以以高连接强度安装在PCB 38上。

公开(公告)号：US20080248611A1

公开(公告)日：2008-10-09

申请号：US12037984

申请日：2008-02-27

申请人： Kenji HANADA ,  Norihisa Toma ,  Masaki Nakanishi ,  Takahiro Naito ,  Naotaka Tanaka

发明人： Kenji HANADA ,  Norihisa Toma ,  Masaki Nakanishi ,  Takahiro Naito ,  Naotaka Tanaka

IPC分类号： H01L21/60

CPC分类号： H01L24/11 ,  H01L21/563 ,  H01L23/3128 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The quality and reliability of a semiconductor device can be improved by eliminating a warp of a chip and performing a chip-stack. A wiring substrate, the first semiconductor chip connected via the first gold bump on the wiring substrate, the second semiconductor chip stacked via the second gold bump on the first semiconductor chip, and a sealing body are comprised. A first gold bump is connected to the wiring substrate, heating, and injection by pressure welding of the first gold bump is done under normal temperature after that at the hole-like electrode of the first semiconductor chip. Since injection by pressure welding of the second gold bump of the second semiconductor chip is done under normal temperature into the hole-like electrode of the first semiconductor chip and the second semiconductor chip is stacked, the chip-stack can be performed under normal temperature. The chip after the second stage can be stacked in the state where there is no warp in the first stage chip, by this, and the quality and reliability of the semiconductor device (semiconductor package) can be improved.

摘要翻译： 可以通过消除芯片翘曲和执行芯片堆叠来提高半导体器件的质量和可靠性。 布线基板，经由布线基板上的第一金凸块连接的第一半导体芯片，经由第一半导体芯片上的第二金凸块堆叠的第二半导体芯片和密封体。 第一金凸块连接到布线基板，通过第一金凸块的压焊进行加热和注入，在第一半导体芯片的孔状电极之后的常温下进行。 由于通过第二半导体芯片的第二金凸块的压焊而进行的注入是在常温下进入第一半导体芯片的孔状电极而第二半导体芯片堆叠的，所以可以在常温下进行芯片堆叠。 由此，可以在第一级芯片中没有翘曲的状态下堆叠第二级之后的芯片，并且可以提高半导体器件（半导体封装）的质量和可靠性。

公开(公告)号：US06400019B1

公开(公告)日：2002-06-04

申请号：US09708597

申请日：2000-11-09

申请人： Toshinori Hirashima ,  Yasushi Takahashi ,  Kenji Hanada ,  Takao Sonobe

发明人： Toshinori Hirashima ,  Yasushi Takahashi ,  Kenji Hanada ,  Takao Sonobe

IPC分类号： H01L2348

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K1/0263 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/09481 ,  H05K2201/0949 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05655 ,  H01L2924/013

摘要： The junction strength between the external terminals and the wiring substrate of a semiconductor device is improved without creating a large size semiconductor device. In the outer periphery of the back surface of an interposer substrate 1Bi on which a semiconductor chip constructing a CSP type semiconductor device 1 is mounted, there are arranged a plurality of bump electrodes 1BB1 whose size in the direction intersecting the sides of the interposer substrate 1B1 is larger than that in the direction along the sides of the interposer substrate 1Bi.

摘要翻译： 在不产生大尺寸半导体器件的情况下，可以提高外部端子与半导体器件的布线基板之间的结合强度。 在其上安装有构成CSP型半导体器件1的半导体芯片的插入件基板1Bi的背面的外周，布置有多个凸起电极1BB1，该突起电极1BB1在与插入件基板1B1的侧面相交的方向上的尺寸 大于沿着插​​入件基板1Bi的侧面方向的尺寸。

公开(公告)号：US06335566B1

公开(公告)日：2002-01-01

申请号：US09646712

申请日：2000-11-30

申请人： Toshinori Hirashima ,  Takefumi Endo ,  Kazuo Watanabe ,  Kenji Hanada ,  Takao Sonobe

发明人： Toshinori Hirashima ,  Takefumi Endo ,  Kazuo Watanabe ,  Kenji Hanada ,  Takao Sonobe

IPC分类号： H01L2302

CPC分类号： H01L24/97 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/642 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/30107 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599

摘要： Disclosed herein is a semiconductor device in which a main surface of a semiconductor chip is placed over a first main surface of a wiring board so as to be opposed thereto and which includes a plurality of external terminals provided over a second main surface of the wiring board. The plurality of external terminals have a plurality of signal terminals and a plurality of power terminals. The signal terminals are arranged along the periphery of the wiring board and the power terminals are arranged along the inside of a row of the signal terminals. Chip capacitors are placed over the main surface of the semiconductor chip, which lies inside a row of the power terminals. The plurality of signal terminals and power terminals formed over the main surface of the semiconductor chip are connected to a plurality of wires formed over the wiring board respectively. The wiring board is provided with an opening or recess which extends therethrough. The chip capacitors are located within the opening or recess. Thus, a reduction in switching noise can be achieved.

摘要翻译： 这里公开了一种半导体器件，其中半导体芯片的主表面被布置在布线板的与其相对的第一主表面上方，并且包括设置在布线板的第二主表面上的多个外部端子 。 多个外部端子具有多个信号端子和多个电源端子。 信号端子沿着布线板的周边布置，并且电源端子沿着信号端子的一行的内侧布置。 芯片电容器放置在半导体芯片的主表面上，该主表面位于一排电源端子内。 形成在半导体芯片的主表面上的多个信号端子和电源端子分别连接到布线板上形成的多条电线。 布线板设置有从其延伸穿过的开口或凹槽。 芯片电容器位于开口或凹槽内。 因此，可以实现开关噪声的降低。

公开(公告)号：US08557633B2

公开(公告)日：2013-10-15

申请号：US13079939

申请日：2011-04-05

申请人： Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

发明人： Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

IPC分类号： H01L21/00

CPC分类号： H01L25/162 ,  H01L23/3121 ,  H01L23/4824 ,  H01L23/5227 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L25/50 ,  H01L27/0617 ,  H01L27/0629 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2201/045 ,  H05K2203/081 ,  H05K2203/1476 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2924/01006

摘要： A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.

摘要翻译： 提供了一种可以提高使用PCB作为其模块基板的模块的可靠性的技术。 通过使用热块在低于280℃的温度下进行热处理，进行无铅焊料的单芯片部件43，集成芯片部件44和半导体芯片IC2的焊接连接。 通过高熔点焊料的半导体芯片IC1的焊接连接通过使用热射流在280℃以上的温度进行热处理来进行。 因此，可以使用高熔点焊料将半导体芯片IC1焊接到PCB 38上，而不会有以下问题：由于热而导致的PCB 38的损坏，例如焊料抗蚀剂的燃烧; 和预浸料从芯材剥离。 因此，半导体芯片IC1可以以高连接强度安装在PCB 38上。