Coating composition and hardened film obtained therefrom
    1.
    发明授权
    Coating composition and hardened film obtained therefrom 有权
    涂料组合物和由其获得的硬化膜

    公开(公告)号:US06660394B1

    公开(公告)日:2003-12-09

    申请号:US09711532

    申请日:2000-11-14

    IPC分类号: B32B2700

    摘要: Disclosed are a coating composition comprising a polymer dispersed in an aqueous medium, the polymer containing (a) a hydrolysate of an organosilane and/or a condensation product thereof and (b) a vinyl polymer containing a silyl group having a silicon atom bound to a hydrolytic group and/or a hydroxyl group, and further comprising (c) an oxazoline derivative as a crosslinking agent and a hardened film obtained therefrom. The above coating composition completes the hardening reaction of a coating film at low temperature for a short period of time, high in hardness immediately after hardening, and having water resistance, weather resistance, organic chemical resistance, acid resistance, alkali resistance, wear resistance and durable adhesion.

    摘要翻译: 公开了一种涂料组合物,其包含分散在水性介质中的聚合物,所述聚合物含有(a)有机硅烷和/或其缩合产物的水解产物和(b)含有具有硅原子的甲硅烷基的乙烯基聚合物, 水解基和/或羟基,并且还包含(c)作为交联剂的恶唑啉衍生物和由其获得的硬化膜。 上述涂料组合物在低温下短时间完成涂膜的硬化反应,硬化后刚刚硬化,耐水性,耐候性,耐有机化学性,耐酸性,耐碱性,耐磨性和耐酸性, 耐用的粘合力。

    Chemical mechanical polishing pad and chemical mechanical polishing method
    5.
    发明申请
    Chemical mechanical polishing pad and chemical mechanical polishing method 审中-公开
    化学机械抛光垫和化学机械抛光方法

    公开(公告)号:US20050260929A1

    公开(公告)日:2005-11-24

    申请号:US11132365

    申请日:2005-05-19

    IPC分类号: B24B37/04 B24D13/14 B24B1/00

    CPC分类号: B24B37/26

    摘要: A chemical mechanical polishing pad having a polishing surface, a non-polishing surface opposite to the polishing surface and a side surface for defining these surfaces, the polishing surface having (i) a first group of grooves which intersect a single virtual straight line extending from the center toward the peripheral portion of the polishing surface and do not cross one another, or a single first spiral groove which expands gradually from the center portion toward the peripheral portion of the polishing surface, and (ii) a second group of grooves which extend from the center portion toward the peripheral portion of the polishing surface, intersect the first group of grooves or the first spiral groove and do not cross one another. Since this chemical mechanical polishing pad fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate, it is advantageously used in a chemical mechanical polishing method.

    摘要翻译: 一种化学机械抛光垫,其具有抛光表面,与抛光表面相对的非抛光表面和用于限定这些表面的侧表面,所述抛光表面具有(i)第一组沟槽,其与从 所述中心朝向所述研磨面的周边部并且不会彼此交叉,或者从所述研磨面的中心部朝向所述周边部逐渐扩展的单个第一螺旋槽,以及(ii)延伸的所述第二组槽 从中心部朝向研磨面的周边部分,与第一组槽或第一螺旋槽相交,并且不会彼此交叉。 由于该化学机械抛光垫完全抑制在研磨表面上产生划痕并且具有优异的抛光速率,因此有利地用于化学机械抛光方法中。