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    Method and apparatus for engineering a testability interposer for testing sockets and connectors on printed circuit boards
    2.
    发明授权
    Method and apparatus for engineering a testability interposer for testing sockets and connectors on printed circuit boards 失效
    用于测试印刷电路板上的插座和连接器的可测试性插入器的方法和装置

    公开(公告)号：US07307427B2

    公开(公告)日：2007-12-11

    申请号：US11188080

    申请日：2005-07-23

    申请人： Chris R. Jacobsen ,  Kenneth P. Parker ,  Myron J. Schneider ,  Tak Yee Kwan

    发明人： Chris R. Jacobsen ,  Kenneth P. Parker ,  Myron J. Schneider ,  Tak Yee Kwan

    IPC分类号： G01R31/08

    CPC分类号： G01R31/2853 ,  G01R1/0433 ,  G01R31/312

    摘要： A method and apparatus is presented for gaining socket testability through the use of a capacitive interposer engineered to create capacitive coupling between signal nodes of a circuit assembly that the tester has access to and nodes of the socket that would not otherwise have any coupling to a testable signal node of the socket. Generally, coupling capacitance is engineered into the interposer by trace and via routing between the signal node of the socket and a location in close proximity to the inaccessible socket node such that their proximity to each other couples them together.

    摘要翻译： 提出了一种方法和装置，通过使用设计用于在测试器可访问的电路组件的信号节点与插座的节点之间建立电容耦合的电容性插入器来获得插座可测试性，否则该插座的节点将不具有与可测试的任何耦合 信号节点的插座。 通常，耦合电容通过插座的信号节点和紧邻不可访问的插座节点的位置之间的跟踪和通路布线被设计到插入器中，使得它们彼此的接近度将它们耦合在一起。

    Method and apparatus for non-contact testing and diagnosing electrical paths through connectors on circuit assemblies
    3.
    发明授权
    Method and apparatus for non-contact testing and diagnosing electrical paths through connectors on circuit assemblies 失效
    用于非接触式测试和诊断通过电路组件上的连接器的电路的方法和装置

    公开(公告)号：US07123022B2

    公开(公告)日：2006-10-17

    申请号：US10836862

    申请日：2004-04-28

    申请人： Kenneth P. Parker ,  Chris R. Jacobsen ,  Myron J. Schneider

    发明人： Kenneth P. Parker ,  Chris R. Jacobsen ,  Myron J. Schneider

    IPC分类号： G01R31/02

    CPC分类号： G01R31/312 ,  G01R31/026 ,  G01R31/046

    摘要： A device for enabling testing of electrical paths through a circuit assembly is presented. The device may include a non-contact connector test probe for a testing a connector of the circuit assembly. A method for testing continuity of electrical paths through a circuit assembly is presented. In the method, one or more nodes of the circuit assembly are stimulated, connector pins of a connector on the circuit assembly are capacitively coupled to a non-contact connector test probe, and an electrical characteristic is measured by a tester coupled to the non-contact connector test probe to determine continuity of electrical paths through the circuit assembly.

    摘要翻译： 提出了一种能够通过电路组件测试电气路径的装置。 该装置可以包括用于测试电路组件的连接器的非接触式连接器测试探头。 提出了一种用于测试通过电路组件的电气路径的连续性的方法。 在该方法中，电路组件的一个或多个节点被激励，电路组件上的连接器的连接器引脚电容耦合到非接触式连接器测试探针，并且电特性由耦合到非接触式连接器的测试仪测量， 接触连接器测试探头，以确定通过电路组件的电气路径的连续性。

    Method for non-contact testing of fixed and inaccessible connections without using a sensor plate
    4.
    发明授权
    Method for non-contact testing of fixed and inaccessible connections without using a sensor plate 失效
    不使用传感器板的固定连接和不可接触连接的非接触式测试方法

    公开(公告)号：US07208957B2

    公开(公告)日：2007-04-24

    申请号：US11069406

    申请日：2005-03-01

    申请人： Myron J. Schneider ,  Kenneth P. Parker ,  Chris R. Jacobsen

    发明人： Myron J. Schneider ,  Kenneth P. Parker ,  Chris R. Jacobsen

    IPC分类号： G01R31/08

    CPC分类号： G01R31/312

    摘要： A method for testing for a defect condition on a node-under-implicit-test of an electrical device is presented. The technique according to the invention includes stimulating a first node of the electrical device that is capacitively coupled to the node-under-implicit-test with a known source signal, and capacitively sensing a signal on a second node of the electrical device that is capacitively coupled to the node-under-implicit-test. A defect condition such as a short or open can be determined from the capacitively sensed signal.

    摘要翻译： 提出了一种用于测试电气设备的隐式节点下的缺陷状况的方法。 根据本发明的技术包括利用已知的源信号刺激电容耦合到隐式测量节点的电气设备的第一节点，并电容地感测电容性的电子设备的第二节点上的信号 耦合到隐式测试节点。 诸如短路或开路的缺陷状况可以从电容感测信号确定。

    Methods and apparatus for non-contact testing and diagnosing of open connections on non-probed nodes
    5.
    发明授权
    Methods and apparatus for non-contact testing and diagnosing of open connections on non-probed nodes 有权
    用于非接触式测试和诊断非探测节点上的开放连接的方法和设备

    公开(公告)号：US07362106B2

    公开(公告)日：2008-04-22

    申请号：US11170365

    申请日：2005-06-29

    申请人： Kenneth P. Parker ,  Myron J. Schneider

    发明人： Kenneth P. Parker ,  Myron J. Schneider

    IPC分类号： G01R31/08 ,  G01R27/26 ,  G01R31/302 ,  G01R31/04

    CPC分类号： G01R31/312

    摘要： A method and apparatus for detecting open defects on non-probed node under test of an electrical device using capacitive lead frame technology is presented. In accordance with the method of the invention, a probed node neighboring the non-probed node under test is stimulated with a known source signal. A sensor of a capacitive sensing probe is capacitively coupled to at least the probed node and non-probed node under test of the electrical device, and a measuring device coupled to the capacitive sensing probe measures a capacitively coupled signal present between the sensor of the probe and at least the probed and non-probed node of the electrical device. Based on the value of the capacitively sensed signal, a known expected “defect-free” capacitively sensed signal measurement and/or a known expected “open” capacitively sensed signal measurement, a determination is made of whether an open defect exists on the non-probed node under test of the electrical device.

    摘要翻译： 提出了一种使用电容引线框架技术在电气设备测试下检测非探测节点上的开放缺陷的方法和装置。 根据本发明的方法，用已知的源信号来刺激与被测探测的非探测节点相邻的探测节点。 电容式感测探头的传感器电容耦合到至少被电气设备测试的探测节点和非探测节点，并且耦合到电容感测探头的测量装置测量存在于探针传感器之间的电容耦合信号 以及至少探测和未探测的电气设备的节点。 基于电容感测信号的值，已知的预期的“无缺陷”电容感测信号测量和/或已知的预期“开放”电容感测信号测量，确定在非易失性存储器 被检测的电气设备节点。