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公开(公告)号：US06352763B1
公开(公告)日：2002-03-05
申请号：US09221007
申请日：1998-12-23
申请人： Kenneth R. Dillon , Kyung H. Moh , Thomas Edward Wood , Raymond C. Chiu , Vincent Wen-Shiuan King , Richard P. Rusin , Timothy Lee Hoopman , Paul Edward Humpal
发明人： Kenneth R. Dillon , Kyung H. Moh , Thomas Edward Wood , Raymond C. Chiu , Vincent Wen-Shiuan King , Richard P. Rusin , Timothy Lee Hoopman , Paul Edward Humpal
IPC分类号： B32B1800
CPC分类号： H01J9/242 , C03C8/14 , C03C8/16 , C03C17/04 , H01J2211/36 , Y10T428/24413 , Y10T428/24421 , Y10T428/24545 , Y10T428/252 , Y10T428/2991 , Y10T428/31612
摘要： A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.
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2.发明授权Curable slurry for forming ceramic microstructures on a substrate using a mold 有权用于使用模具在基板上形成陶瓷微结构的可固化浆料公开(公告)号：US06713526B2
公开(公告)日：2004-03-30
申请号：US10057599
申请日：2002-01-24
申请人： Kenneth R. Dillon , Kyung H. Moh , Thomas Edward Wood , Raymond C. Chiu , Vincent Wen-Shiuan King , Richard P. Rusin
发明人： Kenneth R. Dillon , Kyung H. Moh , Thomas Edward Wood , Raymond C. Chiu , Vincent Wen-Shiuan King , Richard P. Rusin
IPC分类号： C08F246
CPC分类号： H01J9/242 , C03C8/14 , C03C8/16 , C03C17/04 , H01J2211/36 , Y10T428/24413 , Y10T428/24421 , Y10T428/24545 , Y10T428/252 , Y10T428/2991 , Y10T428/31612
摘要： A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.
摘要翻译： 一种用于使用模具在基底上形成陶瓷微结构的可固化浆料。 浆料是陶瓷粉末，短效粘合剂和稀释剂的混合物。 陶瓷粉末的软化温度低于约400℃至600℃，热膨胀系数与基材的热膨胀系数相当。 短暂的粘合剂能够辐射固化，电子束固化或热固化。 稀释剂在固化粘合剂之后使用模具促进脱模性能，或者在脱粘时快速且完全地烧结粘合剂。
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公开(公告)号：USRE40967E1
公开(公告)日：2009-11-10
申请号：US11393165
申请日：2006-03-29
申请人： Kenneth R. Dillon , Kyung H. Moh , Thomas E. Wood , Raymond C. Chiu , Vincent W. King , Richard P. Rusin
发明人： Kenneth R. Dillon , Kyung H. Moh , Thomas E. Wood , Raymond C. Chiu , Vincent W. King , Richard P. Rusin
IPC分类号： C08F2/46
CPC分类号： H01J9/242 , C03C8/14 , C03C8/16 , C03C17/04 , H01J2211/36 , Y10T428/24413 , Y10T428/24421 , Y10T428/24545 , Y10T428/252 , Y10T428/2991 , Y10T428/31612
摘要： A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.
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4.发明授权公开(公告)号：US06616887B2
公开(公告)日：2003-09-09
申请号：US09972655
申请日：2001-10-05
申请人： Raymond C. Chiu , Timothy Lee Hoopman , Paul Edward Humpal , Vincent Wen-Shiuan King , Kenneth R. Dillon
发明人： Raymond C. Chiu , Timothy Lee Hoopman , Paul Edward Humpal , Vincent Wen-Shiuan King , Kenneth R. Dillon
IPC分类号： B29C3342
CPC分类号： H01J9/242 , B29C33/303 , B29C33/40 , B29C33/424 , H01J9/241 , H01J2211/36 , H01J2217/49
摘要： A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
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5.发明授权公开(公告)号：US06984935B2
公开(公告)日：2006-01-10
申请号：US10936420
申请日：2004-09-08
申请人： Raymond C. Chiu , Timothy Lee Hoopman , Paul Edward Humpal , Vincent Wen-Shiuan King , Kenneth R. Dillon
发明人： Raymond C. Chiu , Timothy Lee Hoopman , Paul Edward Humpal , Vincent Wen-Shiuan King , Kenneth R. Dillon
IPC分类号： H01J17/49
CPC分类号： H01J9/242 , B29C33/303 , B29C33/40 , B29C33/424 , H01J9/241 , H01J2211/36 , H01J2217/49
摘要： A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
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6.发明授权Method for precise molding and alignment of structures on a substrate using a stretchable mold 失效使用可拉伸模具精确模制和对准基板上的结构的方法公开(公告)号：US06802754B2
公开(公告)日：2004-10-12
申请号：US10626285
申请日：2003-07-24
申请人： Raymond C. Chiu , Timothy Lee Hoopman , Paul Edward Humpal , Vincent Wen-Shiuan King , Kenneth R. Dillon
发明人： Raymond C. Chiu , Timothy Lee Hoopman , Paul Edward Humpal , Vincent Wen-Shiuan King , Kenneth R. Dillon
IPC分类号： H01J924
CPC分类号： H01J9/242 , B29C33/303 , B29C33/40 , B29C33/424 , H01J9/241 , H01J2211/36 , H01J2217/49
摘要： A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
摘要翻译： 使用微结构模具在图案化衬底上模制和对准微结构的方法。 将包含陶瓷粉末和可固化短效粘合剂的混合物的浆料放置在可拉伸模具的微结构和图案化基底之间。 可以拉伸模具以使模具的微结构与图案化基底的预定部分对准。 浆料在模具和基材之间硬化。 然后去除模具以留下粘附到基底上的微结构并与衬底的图案对准。 可以将微结构热加热以除去粘合剂并最佳地烧制以烧结陶瓷粉末。
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7.发明授权Apparatus for precise molding and alignment of structures on a substrate using a stretchable mold 失效用于使用可拉伸模具精确地模制和对准基底上的结构的装置公开(公告)号：US06325610B2
公开(公告)日：2001-12-04
申请号：US09779207
申请日：2001-02-08
申请人： Raymond C. Chiu , Timothy Lee Hoopman , Paul Edward Humpal , Vincent Wen-Shiuan King , Kenneth R. Dillon
发明人： Raymond C. Chiu , Timothy Lee Hoopman , Paul Edward Humpal , Vincent Wen-Shiuan King , Kenneth R. Dillon
IPC分类号： B29C3508
CPC分类号： H01J9/242 , B29C33/303 , B29C33/40 , B29C33/424 , H01J9/241 , H01J2211/36 , H01J2217/49
摘要： An apparatus for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
摘要翻译： 一种使用微结构模具在图案化衬底上模制和对准微结构的装置。 将包含陶瓷粉末和可固化短效粘合剂的混合物的浆料放置在可拉伸模具的微结构和图案化基底之间。 可以拉伸模具以使模具的微结构与图案化基底的预定部分对准。 浆料在模具和基材之间硬化。 然后去除模具以留下粘附到基底上的微结构并与衬底的图案对准。 可以将微结构热加热以除去粘合剂并最佳地烧制以烧结陶瓷粉末。
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8.发明授权Method for precise molding and alignment of structures on a substrate using a stretchable mold 失效使用可拉伸模具精确模制和对准基板上的结构的方法公开(公告)号：US06247986B1
公开(公告)日：2001-06-19
申请号：US09219803
申请日：1998-12-23
申请人： Raymond C. Chiu , Timothy Lee Hoopman , Parul Edward Humpal , Vincent Wen-Shiuan King , Kenneth R. Dillon
发明人： Raymond C. Chiu , Timothy Lee Hoopman , Parul Edward Humpal , Vincent Wen-Shiuan King , Kenneth R. Dillon
IPC分类号： H01J924
CPC分类号： H01J9/242 , B29C33/303 , B29C33/40 , B29C33/424 , H01J9/241 , H01J2211/36 , H01J2217/49
摘要： A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
摘要翻译： 使用微结构模具在图案化衬底上模制和对准微结构的方法。 将包含陶瓷粉末和可固化短效粘合剂的混合物的浆料放置在可拉伸模具的微结构和图案化基底之间。 可以拉伸模具以使模具的微结构与图案化基底的预定部分对准。 浆料在模具和基材之间硬化。 然后去除模具以留下粘附到基底上的微结构并与衬底的图案对准。 可以将微结构热加热以除去粘合剂并最佳地烧制以烧结陶瓷粉末。
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公开(公告)号：US4431449A
公开(公告)日：1984-02-14
申请号：US499412
申请日：1983-06-01
CPC分类号： B22F1/0048 , B22F3/26 , A61F2002/30968 , B22F2998/00 , B22F2998/10 , Y10T428/1216
摘要： A molded, non-refractory metal article is made by molding in a flexible mold a plastic mixture of non-refractory, spherical metal powders and a heat-fugitive binder comprising thermoplastic material to form a green article of predetermined shape and dimensions, heating the green article to remove said binder and consolidate the non-refractory spherical powders in the form of a porous, monolithic skeleton of necked particles of non-refractory metal, infiltrating the skeleton with a molten metal having a melting point that is at least 25.degree. C. less than the melting point of the lowest melting of said spherical, non-refractory metal particles, and cooling the infiltrated skeleton thereby forming a homogeneous, void-free, non-refractory metal article of two intermeshed metal matrices.
摘要翻译： 模制的非难熔金属制品通过在柔性模具中模塑非难熔性球形金属粉末的塑料混合物和包含热塑性材料的散热性粘合剂来形成预定形状和尺寸的绿色制品，加热绿色 制品，以去除所述粘合剂并将非难熔金属的颈缩颗粒的多孔整体骨架形式的非耐火球形粉末固化，用熔点至少为25℃的熔融金属渗透骨架。 小于所述球形，非难熔金属颗粒的最低熔点的熔点，并且冷却渗透的骨架，从而形成两个相互啮合的金属基体的均匀，无空隙的非难熔金属制品。
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10.发明授权
公开(公告)号：US4455354A
公开(公告)日：1984-06-19
申请号：US207196
申请日：1980-11-14
CPC分类号： B22F3/26 , C22C1/051 , B22F2998/00 , B22F2998/10 , Y10T428/1216 , Y10T428/12167
摘要： The shrinkage normally encountered when molding a mixture of spherical cobalt-containing particles and thermoplastic binder, heating the resulting molded article to degrade the binder and form a porous preform, and infiltrating the same is counteracted by adding finely divided elemental iron or elemental nickel to the spherical cobalt-containing particles. In addition to improving dimensional control, the elemental powder addition increases impact strength while maintaining hardness.
摘要翻译： 在模制球形含钴颗粒和热塑性粘合剂的混合物时通常遇到的收缩，加热所得模制品以降解粘合剂并形成多孔预型体，并且通过将细分的铁或元素镍加入到 球形含钴颗粒。 除了改善尺寸控制之外，元素粉末添加增加冲击强度同时保持硬度。
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