公开(公告)号：US20120012978A1

公开(公告)日：2012-01-19

申请号：US13244133

申请日：2011-09-23

申请人： Kentaro OCHI ,  Akira Mishima ,  Takuro Kanazawa ,  Tetsuo Iijima ,  Katsuo Ishizaka ,  Norio Kido

发明人： Kentaro OCHI ,  Akira Mishima ,  Takuro Kanazawa ,  Tetsuo Iijima ,  Katsuo Ishizaka ,  Norio Kido

IPC分类号： H01L23/48

CPC分类号： H01L23/3107 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/33 ,  H01L25/115 ,  H01L2224/32245 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.

摘要翻译： 提供了通过使用半导体封装形成的半导体器件。 半导体器件包括在感应导体上相邻布置的两个半导体封装。 两个半导体封装的端子由第三引线连接。 第三引线被布置成基本上平行于感应导体。 接头部分处的引线例如具有弯曲结构，并且第三引线布置成靠近感应导体。

公开(公告)号：US20110084359A1

公开(公告)日：2011-04-14

申请号：US12968534

申请日：2010-12-15

申请人： Kentaro OCHI ,  Akira Mishima ,  Takuro Kanazawa ,  Tetsuo Iijima ,  Katsuo Ishizaka ,  Norio Kido

发明人： Kentaro OCHI ,  Akira Mishima ,  Takuro Kanazawa ,  Tetsuo Iijima ,  Katsuo Ishizaka ,  Norio Kido

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/33 ,  H01L25/115 ,  H01L2224/32245 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.

摘要翻译： 提供了通过使用半导体封装形成的半导体器件。 半导体器件包括在感应导体上相邻布置的两个半导体封装。 两个半导体封装的端子由第三引线连接。 第三引线被布置成基本上平行于感应导体。 接头部分处的引线例如具有弯曲结构，并且第三引线布置成靠近感应导体。

公开(公告)号：US20100315786A1

公开(公告)日：2010-12-16

申请号：US12797317

申请日：2010-06-09

申请人： Kentaro OCHI ,  Akira MISHIMA ,  Takuro KANAZAWA ,  Tetsuo IIJIMA ,  Katsuo ISHIZAKA ,  Norio KIDO

发明人： Kentaro OCHI ,  Akira MISHIMA ,  Takuro KANAZAWA ,  Tetsuo IIJIMA ,  Katsuo ISHIZAKA ,  Norio KIDO

IPC分类号： H05K7/20 ,  H05K7/04

CPC分类号： H01L23/3107 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/33 ,  H01L25/115 ,  H01L2224/32245 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.

摘要翻译： 提供了通过使用半导体封装形成的半导体器件。 半导体器件包括在感应导体上相邻布置的两个半导体封装。 两个半导体封装的端子由第三引线连接。 第三引线被布置成基本上平行于感应导体。 接头部分处的引线例如具有弯曲结构，并且第三引线布置成靠近感应导体。