公开(公告)号：US20100315786A1

公开(公告)日：2010-12-16

申请号：US12797317

申请日：2010-06-09

申请人： Kentaro OCHI ,  Akira MISHIMA ,  Takuro KANAZAWA ,  Tetsuo IIJIMA ,  Katsuo ISHIZAKA ,  Norio KIDO

发明人： Kentaro OCHI ,  Akira MISHIMA ,  Takuro KANAZAWA ,  Tetsuo IIJIMA ,  Katsuo ISHIZAKA ,  Norio KIDO

IPC分类号： H05K7/20 ,  H05K7/04

CPC分类号： H01L23/3107 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/33 ,  H01L25/115 ,  H01L2224/32245 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.

摘要翻译： 提供了通过使用半导体封装形成的半导体器件。 半导体器件包括在感应导体上相邻布置的两个半导体封装。 两个半导体封装的端子由第三引线连接。 第三引线被布置成基本上平行于感应导体。 接头部分处的引线例如具有弯曲结构，并且第三引线布置成靠近感应导体。

公开(公告)号：US20080054422A1

公开(公告)日：2008-03-06

申请号：US11841955

申请日：2007-08-20

申请人： Nobuya KOIKE ,  Atsushi FUJIKI ,  Norio KIDO ,  Yukihiro SATO ,  Hiroyuki NAKAMURA

发明人： Nobuya KOIKE ,  Atsushi FUJIKI ,  Norio KIDO ,  Yukihiro SATO ,  Hiroyuki NAKAMURA

IPC分类号： H01L23/495

CPC分类号： H01L21/565 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/34 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/04042 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： It is made for the layout of the mounting wiring at the time of mounting to become efficient by changing the structure of a semiconductor device.A first chip is mounted on a first die pad, and a second chip is also mounted on a second die pad. A first die pad and a second die pad do division structure in parallel to the first side and second side of sealing body 40. As a result, the pin for an output from a first chip and the pin for control of the circuit for a drive can make it able to project from a counter direction, and can set the wiring layout at the time of mounting as the minimum route.

摘要翻译： 通过改变半导体器件的结构，安装时的安装布线的布局变得有效。 第一芯片安装在第一芯片焊盘上，第二芯片也安装在第二芯片焊盘上。 第一管芯焊盘和第二管芯焊盘与密封体40的第一侧面和第二侧平行地进行分割结构。 结果，用于从第一芯片输出的引脚和用于控制驱动电路的引脚可使其能够从相反方向突出，并且可以将安装时的布线布局设置为最小路线 。