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公开(公告)号：US5666263A
公开(公告)日：1997-09-09
申请号：US514110
申请日：1995-08-11
CPC分类号： G06F1/1605 , H04R5/02 , Y10S248/918
摘要： A coupling is configured to hold detachably a speaker on a computer component by a gravitational force acting on the speaker. The coupling may be a pocket on the component and a flange on the speaker. The coupling may include vertically aligned projecting elements on the component and corresponding receptacles on the speaker. The coupling may be hidden after the speaker has been mounted. To attach the speaker it is held near the component and then lowered with respect to the coupling mechanism to reach a position where the speaker is fixed relative to the component by a gravitational force.
摘要翻译： 联接器被配置为通过作用在扬声器上的重力来可拆卸地固定在计算机部件上的扬声器。 联接器可以是部件上的凹槽和扬声器上的凸缘。 联接器可以包括部件上的垂直对齐的突出元件和扬声器上的对应插座。 扬声器安装后可能会隐藏耦合。 为了安装扬声器，将其保持在部件附近，然后相对于联接机构降低，以到达扬声器通过重力相对于部件固定的位置。
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2.发明授权Ultra-quiet, thermally efficient cooling system for forced air cooled electronics 失效超静音，高效冷却系统，用于强制风冷电子
公开(公告)号：US5751550A
公开(公告)日：1998-05-12
申请号：US633134
申请日：1996-04-16
申请人： George K. Korinsky
发明人： George K. Korinsky
CPC分类号： G06F1/20
摘要： A computer housing is provided with enhanced interior cooling, to dissipate operating heat from its heat generating internal electronic components, using a single cooling fan disposed inside the housing. During operation thereof the fan draws ambient cooling air into the housing through a hollow support foot attached to the underside of the housing, and the bottom end opening of a hollow front bezel structure, flows the cooling air through the housing and then discharges it therefrom. A pull-out option card carrier defines an interior housing baffle that routes a large portion of the interior housing air flow across the processor portion of the computer motherboard. Additionally, a smaller quantity of ambient cooling air is drawn through side wall openings in the housing into an interior plenum upon the inner side wall of which the motherboard is mounted. The plenum air is passed into the main housing interior through a transfer opening in the inner side wall and then drawn along the balance of the motherboard through a gap between the motherboard and the installed option card carrier.
摘要翻译： 具有增强的内部冷却的计算机外壳，利用设置在壳体内的单个冷却风扇从其发热内部电子部件散发工作热量。 在其操作期间，风扇通过连接到壳体的下侧的中空支撑脚将周围的冷却空气吸入壳体，并且中空的前挡板结构的底端开口将冷却空气流过壳体，然后从其中排出。 拉出选项卡托架限定了内部壳体挡板，其将大部分内部壳体空气流穿过计算机主板的处理器部分。 此外，较少量的环境冷却空气通过壳体中的侧壁开口被吸入到安装有母板的内侧壁上的内部增压室中。 增压空气通过内侧壁中的转移开口进入主壳体内部，然后通过主板和安装的选件卡片托架之间的间隙沿主板的平衡被拉伸。
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公开(公告)号：US5185691A
公开(公告)日：1993-02-09
申请号：US670347
申请日：1991-03-15
申请人： George K. Korinsky
发明人： George K. Korinsky
IPC分类号： H05K7/20
CPC分类号： H05K7/20509
摘要： A natural convection cooled electronic device utilizing a box-like plastic enclosure surrounding the circuitry of the electronic device. The apparatus further includes aluminum heat sinks fastened in good thermal contact with heat dissipating components of the electronic device, wherein the heat sinks include heat fin members which run parallel to the inner walls of the enclosure and are separated from the walls by an air gap. The inner walls of the enclosure are lined with a layer of thermally conductive material, such as copper foil, which spreads the internal heat flux across the total surface area of the enclosure. The exposed surface of the heat flux spreader layer and the facing surface of the heat fin members are further made semi-rough and stained black to eliminate potential hot spots and to increase radiant heat transfer between the heat sinks and the enclosure.
摘要翻译： 使用围绕电子设备的电路的盒状塑料外壳的自然对流冷却电子设备。 该装置还包括与电子设备的散热部件良好热接触的铝散热器，其中散热器包括平行于外壳的内壁延伸并通过气隙与壁隔开的散热片部件。 外壳的内壁衬有一层导热材料，例如铜箔，其将内部热通量穿过外壳的整个表面区域。 散热片层的暴露表面和散热片构件的相对表面进一步制成半粗糙并且染成黑色，以消除潜在的热点并增加散热器与外壳之间的辐射热传递。
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4.发明授权公开(公告)号：US08243021B2
公开(公告)日：2012-08-14
申请号：US11394869
申请日：2006-03-31
CPC分类号： H04M1/0235 , H04M1/0227 , H04M1/0233 , H04M1/23
摘要： Apparatus, systems, and methods described herein may couple a base component associated with a portable electronic device (PED) to a display component associated with the PED such that the display component is capable of sliding and rotating relative to the base component. Other embodiments may be described and claimed.
摘要翻译： 本文所述的装置，系统和方法可以将与便携式电子设备（PED）相关联的基座部件耦合到与PED相关联的显示部件，使得显示部件能够相对于基部部件滑动和旋转。 可以描述和要求保护其他实施例。
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公开(公告)号：US5258888A
公开(公告)日：1993-11-02
申请号：US998783
申请日：1992-12-28
申请人： George K. Korinsky
发明人： George K. Korinsky
IPC分类号： H05K7/20
CPC分类号： H05K7/209
摘要： A natural convection cooled electronic device utilizing a box-like plastic enclosure surrounding the circuitry of the electronic device. The apparatus further includes aluminum heat sinks fastened in good thermal contact with heat dissipating components of the electronic device, wherein the heat sinks include heat fin members which run parallel to the inner walls of the enclosure and are separated from the walls by an air gap. The inner walls of the enclosure are lined with a layer of thermally conductive material, such as copper foil, which spreads the internal heat flux across the total surface area of the enclosure. The exposed surface of the heat flux spreader layer and the facing surface of the heat fin members are further made semi-rough and stained black to eliminate potential hot spots and to increase radiant heat transfer between the heat sinks and the enclosure. An alternative embodiment includes an electrical insulation layer between the electronic circuitry and the heat flux spreader layer. The insulation layer may include openings to allow contact of the heat flux spreader layer to the electronic circuitry at grounded locations.
摘要翻译： 使用围绕电子设备的电路的盒状塑料外壳的自然对流冷却电子设备。 该装置还包括与电子设备的散热部件良好热接触的铝散热器，其中散热器包括平行于外壳的内壁延伸并通过气隙与壁隔开的散热片部件。 外壳的内壁衬有一层导热材料，例如铜箔，其将内部热通量穿过外壳的整个表面区域。 散热片层的暴露表面和散热片构件的相对表面进一步制成半粗糙并且染成黑色，以消除潜在的热点并增加散热器与外壳之间的辐射热传递。 另一个实施例包括电子电路和热通量扩散器层之间的电绝缘层。 绝缘层可以包括允许热通量扩散层在接地位置与电子电路接触的开口。
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公开(公告)号：US5574667A
公开(公告)日：1996-11-12
申请号：US457039
申请日：1995-06-01
申请人： James S. Dinh , George K. Korinsky
发明人： James S. Dinh , George K. Korinsky
CPC分类号： G06F1/206
摘要： A computer system has control circuitry for detecting directly and independently of temperature the malfunctioning of a fan used for cooling the housing of the computer and for controlling the power supply voltage when malfunctions are detected so as to reduce the temperature within the housing of the computer system.
摘要翻译： 计算机系统具有控制电路，用于直接和独立地检测用于冷却计算机壳体的风扇的故障，并且用于当检测到故障时控制电源电压，以便降低计算机系统的壳体内的温度 。
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公开(公告)号：US5526289A
公开(公告)日：1996-06-11
申请号：US76466
申请日：1993-06-14
申请人： James S. Dinh , George K. Korinsky
发明人： James S. Dinh , George K. Korinsky
CPC分类号： G06F1/206
摘要： A personal computer has at least one heat producing element within its housing with a fan for cooling the inside of the housing. The fan is controlled by a temperature dependent fan control circuit. A heat sensing device within the fan control circuit adjusts the voltage applied to the fan in a substantially continuous relationship to the temperature inside the housing.
摘要翻译： 个人计算机在其壳体内具有至少一个发热元件，其具有用于冷却壳体内部的风扇。 风扇由温度依赖风扇控制电路控制。 风扇控制电路内的热感测装置以与壳体内部的温度基本上连续的关系调节施加到风扇的电压。
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公开(公告)号：US5419629A
公开(公告)日：1995-05-30
申请号：US187451
申请日：1994-01-27
申请人： George K. Korinsky
发明人： George K. Korinsky
摘要： An electronics chassis, preferably a personal computer ("PC") power supply chassis, having a construction free of secondary fabrication operations and a method of manufacture therefor. The chassis comprises: (1) a bendable chassis sheet having a central portion forming a chassis base wall and a plurality of peripheral portions bent with respect to the central portion to form chassis side walls, edges of the side walls having projections interlocking with corresponding projections on edges of the side wall to fix the side walls with respect to the side wall as against lateral displacement, the bendable chassis sheet thereby forming a chassis portion having an opening therein, (2) a second bendable chassis sheet mated to the first chassis sheet and covering the opening, the second chassis sheet having a portion forming a chassis cover wall and a second portion bent with respect to the portion to form a fourth chassis side wall, side edges of the cover wall and outer edges of the side walls having interlocking projections and recesses preventing the side walls from separating from the cover wall, (3) structures for removably attaching a cover wall to an outer edge of the second wall and a side wall to a base wall.
摘要翻译： 电子机箱，优选个人计算机（“PC”）电源底盘，具有无二次制造操作的结构及其制造方法。 底盘包括：（1）可弯曲底盘，其具有形成底盘底座的中心部分和相对于中心部分弯曲的多个周边部分，以形成底盘侧壁，该侧壁的边缘具有与相应突出部互锁的突起 在侧壁的边缘上，以防侧壁相对于侧壁固定侧壁，因此可弯曲底盘由此形成其中具有开口的底架部分，（2）与第一底盘片材配合的第二可弯曲底盘片 并且覆盖所述开口，所述第二机架板具有形成底盘盖壁的部分和相对于所述部分弯曲的第二部分，以形成第四底盘侧壁，所述盖壁的侧边缘和所述侧壁的外边缘具有互锁 防止侧壁与盖壁分离的突出和凹陷，（3）用于将盖壁可拆卸地附接到外缘的结构 e第二个墙壁和一个侧壁到底壁。
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公开(公告)号：US07652882B2
公开(公告)日：2010-01-26
申请号：US11218916
申请日：2005-09-02
申请人： George K. Korinsky , Craig Crawford
发明人： George K. Korinsky , Craig Crawford
CPC分类号： G06F1/20 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for dissipating heat from an electronic device is described. The method and apparatus provides a scalable, cost effective, highly efficient, universally applied thermal solution for high heat generating electronic components. In one embodiment, a housing attaches over a heat sink for an electronic device. Various cooling attachments can be attached to this housing to provide a multitude of air flow enhancers. The cooling attachments are designed to provide a thermal engineer or a system integrator with several options for cooling an electronic component. The cooling attachments can be placed in multiple configurations to provide unique thermal solutions. In another embodiment, a kit of parts for a cooling system is provided. The kit of parts includes a housing and a variety of cooling attachments.
摘要翻译： 描述了从电子设备散热的方法和装置。 该方法和装置为高发热电子部件提供了可扩展的，成本有效的，高效的，普遍应用的热解决方案。 在一个实施例中，壳体附接在用于电子设备的散热器上。 可以将各种冷却附件附接到该壳体以提供多种气流增强器。 冷却附件设计用于为热工程师或系统集成商提供多种冷却电子元件的选项。 冷却附件可以放置在多种配置中，以提供独特的热解决方案。 在另一个实施例中，提供了一套用于冷却系统的部件。 该套件包括一个外壳和各种冷却附件。
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公开(公告)号：US06940716B1
公开(公告)日：2005-09-06
申请号：US09615922
申请日：2000-07-13
申请人： George K. Korinsky , Craig Crawford
发明人： George K. Korinsky , Craig Crawford
IPC分类号： G06F1/20 , H01L23/467 , H05K7/20
CPC分类号： G06F1/20 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for dissipating heat from an electronic device is described. The method and apparatus provides a scalable, cost effective, highly efficient, universally applied thermal solution for high heat generating electronic components. In one embodiment, a housing attaches over a heat sink for an electronic device. Various cooling attachments can be attached to this housing to provide a multitude of air flow enhancers. The cooling attachments are designed to provide a thermal engineer or a system integrator with several options for cooling an electronic component. The cooling attachments can be placed in multiple configurations to provide unique thermal solutions. In another embodiment, a kit of parts for a cooling system is provided. The kit of parts includes a housing and a variety of cooling attachments.
摘要翻译： 描述了从电子设备散热的方法和装置。 该方法和装置为高发热电子部件提供了可扩展的，成本有效的，高效的，普遍应用的热解决方案。 在一个实施例中，壳体附接在用于电子设备的散热器上。 可以将各种冷却附件附接到该壳体以提供多种气流增强器。 冷却附件设计用于为热工程师或系统集成商提供多种冷却电子元件的选项。 冷却附件可以放置在多种配置中，以提供独特的热解决方案。 在另一个实施例中，提供了一套用于冷却系统的部件。 该套件包括一个外壳和各种冷却附件。
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