Backside polish EUV mask and method of manufacture
    1.
    发明授权
    Backside polish EUV mask and method of manufacture 有权
    背面抛光EUV面膜和制造方法

    公开(公告)号:US06048652A

    公开(公告)日:2000-04-11

    申请号:US205791

    申请日:1998-12-04

    IPC分类号: G03F1/24 G03F1/50 G03F9/00

    摘要: A method (100) of forming a reflective reticle blank includes forming (106) a reflective layer (108) over a flat substrate (104) and coupling a low thermal expansion material (112) to the reflective layer (108). After coupling the low thermal expansion material (112) to the reflective layer (108), the flat substrate (104) is removed. By forming the reflective layer (108) on the flat substrate (104), a low-defect, high reflectivity reflective layer (108) is formed. In addition, by removing the flat substrate (104), the reticle blank uses the low thermal expansion material (112) as substrate and exhibits minimized distortion during processing due to its low thermal expansion material.

    摘要翻译: 形成反射标线坯料的方法(100)包括在平坦基板(104)上形成(106)反射层(108)并将低热膨胀材料(112)耦合到反射层(108)。 在将低热膨胀材料(112)耦合到反射层(108)之后,去除平坦基板(104)。 通过在平坦基板(104)上形成反射层(108),形成低缺陷高反射层(108)。 此外,通过去除平坦基板(104),掩模版坯料使用低热膨胀材料(112)作为基板,并且由于其低热膨胀材料而在加工过程中表现出最小的失真。

    Method for making shallow trench marks
    2.
    发明授权
    Method for making shallow trench marks 失效
    浅沟槽标记的制作方法

    公开(公告)号:US5963816A

    公开(公告)日:1999-10-05

    申请号:US982072

    申请日:1997-12-01

    摘要: The separate formation of alignment marks and manufacturing a semiconductor device comprising photolithographically printing circuit patterns is avoided by utilizing trenches formed when etching to form shallow isolation trenches, thereby increasing manufacturing throughput and reducing costs. Embodiments include utilizing alignment trenches having a depth of about 2,400.ANG. to less than about 4,000.ANG., e.g., 3,000.ANG., formed substantially simultaneously with forming isolation trenches having substantially the same depth as the alignment trenches.

    摘要翻译: 通过利用在蚀刻时形成的沟槽形成浅隔离沟槽,从而避免了制造包括光刻印刷电路图形的半导体器件的单独形成,从而提高了制造量并降低了成本。 实施例包括使用具有大约2,400安培的深度的对准沟槽,以小于约4,000安培,例如3,000安培,其基本上同时形成,形成具有与对准沟槽基本相同的深度的隔离沟槽。