公开(公告)号：US08018036B2

公开(公告)日：2011-09-13

申请号：US11602098

申请日：2006-11-20

Applicant: Kim-yong Goh ,  Tong-yan Tee

Inventor： Kim-yong Goh ,  Tong-yan Tee

IPC: H01L23/24

CPC classification number: H01L23/3107 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An ultra-thin Quad Flat No-Lead (QFN) semiconductor chip package having a leadframe with lead terminals formed by recesses from both the top and bottom surfaces and substantially aligned contact areas formed on either the top or bottom surfaces. A die is electrically connected to the plurality of lead terminals and a molding compound encapsulates the leadframe and die together so as to form the ultra-thin QFN package. Accordingly, the substantially aligned contact areas are exposed on both the top and bottom surfaces of the package. The present disclosure also provides an ultra-thin Optical Quad Flat No-Lead (OQFN) semiconductor chip package, a stacked semiconductor module comprising at least two QFN semiconductor chip packages, and a method for manufacturing an ultra-thin Quad Flat No-Lead (QFN) semiconductor packages.

Abstract translation: 一种超薄四边形扁平无铅（QFN）半导体芯片封装，其具有引线框架，该引线框架具有由顶部和底部表面的凹部形成的引线端子和形成在顶部或底部表面上的基本上对准的接触区域。 模具电连接到多个引线端子，并且模制化合物将引线框封装在一起，以形成超薄QFN封装。 因此，基本对准的接触区域暴露在封装的顶表面和底表面上。 本公开还提供了一种超薄光学四方扁平无引线（OQFN）半导体芯片封装，包括至少两个QFN半导体芯片封装的堆叠半导体模块，以及用于制造超薄四面体扁平无铅 QFN）半导体封装。

公开(公告)号：US08642396B2

公开(公告)日：2014-02-04

申请号：US13196641

申请日：2011-08-02

Applicant: Kim-yong Goh ,  Tong-yan Tee

Inventor： Kim-yong Goh ,  Tong-yan Tee

IPC: H01L21/44

CPC classification number: H01L23/3107 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An ultra-thin Quad Flat No-Lead (QFN) semiconductor chip package having a leadframe with lead terminals formed by recesses from both the top and bottom surfaces and substantially aligned contact areas formed on either the top or bottom surfaces. A die is electrically connected to the plurality of lead terminals and a molding compound encapsulates the leadframe and die together so as to form the ultra-thin QFN package. Accordingly, the substantially aligned contact areas are exposed on both the top and bottom surfaces of the package. The present disclosure also provides an ultra-thin Optical Quad Flat No-Lead (OQFN) semiconductor chip package, a stacked semiconductor module comprising at least two QFN semiconductor chip packages, and a method for manufacturing an ultra-thin Quad Flat No-Lead (QFN) semiconductor packages.

Abstract translation: 一种超薄四边形扁平无铅（QFN）半导体芯片封装，其具有引线框架，该引线框架具有由顶部和底部表面的凹部形成的引线端子和形成在顶部或底部表面上的基本上对准的接触区域。 模具电连接到多个引线端子，并且模制化合物将引线框封装在一起，以形成超薄QFN封装。 因此，基本对准的接触区域暴露在封装的顶表面和底表面上。 本公开还提供了一种超薄光学四方扁平无引线（OQFN）半导体芯片封装，包括至少两个QFN半导体芯片封装的堆叠半导体模块，以及用于制造超薄四面体扁平无铅 QFN）半导体封装。

公开(公告)号：US20120028397A1

公开(公告)日：2012-02-02

申请号：US13196641

申请日：2011-08-02

Applicant: Kim-yong Goh ,  Tong-yan Tee

Inventor： Kim-yong Goh ,  Tong-yan Tee

IPC: H01L21/56

CPC classification number: H01L23/3107 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An ultra-thin Quad Flat No-Lead (QFN) semiconductor chip package having a leadframe with lead terminals formed by recesses from both the top and bottom surfaces and substantially aligned contact areas formed on either the top or bottom surfaces. A die is electrically connected to the plurality of lead terminals and a molding compound encapsulates the leadframe and die together so as to form the ultra-thin QFN package. Accordingly, the substantially aligned contact areas are exposed on both the top and bottom surfaces of the package. The present disclosure also provides an ultra-thin Optical Quad Flat No-Lead (OQFN) semiconductor chip package, a stacked semiconductor module comprising at least two QFN semiconductor chip packages, and a method for manufacturing an ultra-thin Quad Flat No-Lead (QFN) semiconductor packages.

Abstract translation: 一种超薄四边形扁平无铅（QFN）半导体芯片封装，其具有引线框架，该引线框架具有由顶部和底部表面的凹部形成的引线端子，以及形成在顶部或底部表面上的基本上对准的接触区域。 模具电连接到多个引线端子，并且模制化合物将引线框封装在一起，以形成超薄QFN封装。 因此，基本对准的接触区域暴露在封装的顶表面和底表面上。 本公开还提供了一种超薄光学四方扁平无引线（OQFN）半导体芯片封装，包括至少两个QFN半导体芯片封装的堆叠半导体模块，以及用于制造超薄四面体扁平无铅 QFN）半导体封装。

公开(公告)号：US20070114641A1

公开(公告)日：2007-05-24

申请号：US11602098

申请日：2006-11-20

Applicant: Kim-yong Goh ,  Tong-yan Tee

Inventor： Kim-yong Goh ,  Tong-yan Tee

IPC: H01L23/495

CPC classification number: H01L23/3107 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An ultra-thin Quad Flat No-Lead (QFN) semiconductor chip package having a leadframe with lead terminals formed by recesses from both the top and bottom surfaces and substantially aligned contact areas formed on either the top or bottom surfaces. A die is electrically connected to the plurality of lead terminals and a molding compound encapsulates the leadframe and die together so as to form the ultra-thin QFN package. Accordingly, the substantially aligned contact areas are exposed on both the top and bottom surfaces of the package. The present disclosure also provides an ultra-thin Optical Quad Flat No-Lead (OQFN) semiconductor chip package, a stacked semiconductor module comprising at least two QFN semiconductor chip packages, and a method for manufacturing an ultra-thin Quad Flat No-Lead (QFN) semiconductor packages.

Abstract translation: 一种超薄四边形扁平无铅（QFN）半导体芯片封装，其具有引线框架，该引线框架具有由顶部和底部表面的凹部形成的引线端子和形成在顶部或底部表面上的基本上对准的接触区域。 模具电连接到多个引线端子，并且模制化合物将引线框封装在一起，以形成超薄QFN封装。 因此，基本对准的接触区域暴露在封装的顶表面和底表面上。 本公开还提供了一种超薄光学四方扁平无引线（OQFN）半导体芯片封装，包括至少两个QFN半导体芯片封装的堆叠半导体模块，以及用于制造超薄四面体扁平无铅 QFN）半导体封装。