Serial interface for semiconductor package

    公开(公告)号:US11281603B2

    公开(公告)日:2022-03-22

    申请号:US16054755

    申请日:2018-08-03

    Abstract: A system for serial communication includes a controller, a semiconductor package comprising a plurality of semiconductor die, and a serial interface configured to connect the plurality of semiconductor die to the controller. The serial interface includes a controller-to-package connection and a package-to-controller connection, and the serial interface is configured to employ a signaling protocol using differential data signaling with no separate clock signals.

    System and method for serial interface memory using switched architecture

    公开(公告)号:US11256634B2

    公开(公告)日:2022-02-22

    申请号:US16859957

    申请日:2020-04-27

    Abstract: A memory system for storing and retrieving data may include a controller, a first switch, a second switch connected to the first switch via an interconnecting bus, and a plurality of memory devices. The controller may have a first serial interface. The first switch may have one or more serial interfaces and one or more memory ports. The first serial interface of the controller may be communicatively connected to a first serial interface of the one or more serial interfaces of the first switch via a first serial bus. Each of the one or more memory ports of the first switch may be communicatively connected to a subset of the plurality of memory devices via a memory bus. The first switch may transfer data between the controller and the subsets of the plurality of memory devices via the one or more memory ports.

Patent Agency Ranking