SERIAL INTERFACE FOR SEMICONDUCTOR PACKAGE

    公开(公告)号:US20230092000A1

    公开(公告)日:2023-03-23

    申请号:US17699942

    申请日:2022-03-21

    Abstract: A system for serial communication includes a controller, a semiconductor package comprising a plurality of semiconductor die, and a serial interface configured to connect the plurality of semiconductor die to the controller. The serial interface includes a controller-to-package connection and a package-to-controller connection, and the serial interface is configured to employ a signaling protocol using differential data signaling with no separate clock signals.

    Serial interface for semiconductor package

    公开(公告)号:US11281603B2

    公开(公告)日:2022-03-22

    申请号:US16054755

    申请日:2018-08-03

    Abstract: A system for serial communication includes a controller, a semiconductor package comprising a plurality of semiconductor die, and a serial interface configured to connect the plurality of semiconductor die to the controller. The serial interface includes a controller-to-package connection and a package-to-controller connection, and the serial interface is configured to employ a signaling protocol using differential data signaling with no separate clock signals.

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