公开(公告)号：US20220246560A1

公开(公告)日：2022-08-04

申请号：US17408756

申请日：2021-08-23

Applicant: KIOXIA CORPORATION

Inventor： Noriyuki MORIYASU

IPC: H01L23/00 ,  H01L21/66 ,  H01L25/065

Abstract: A semiconductor device includes a substrate, a semiconductor chip, a plurality of bonding pads on a surface of the semiconductor chip, a plurality of probe pads on a surface of the semiconductor chip, a plurality of connection pads on a surface of the substrate, and a plurality of bonding wires that electrically connect the bonding pads and the connection pads. The plurality of bonding pads include a first bonding pad and a second bonding pad, the plurality of probe pads include a first probe pad and a second probe pad, and a part of the first probe pad is disposed between the second bonding pad and the second probe pad.

公开(公告)号：US20240193080A1

公开(公告)日：2024-06-13

申请号：US18454265

申请日：2023-08-23

Applicant: Kioxia Corporation

Inventor： Noriyuki MORIYASU ,  Masaru OGAWA ,  Kenji SAKAUE

IPC: G06F12/02

CPC classification number: G06F12/0246 ,  G06F2212/7203

Abstract: A memory system including a plurality of nonvolatile memories and a controller. The controller is connected to the plurality of nonvolatile memories via a plurality of channels. The nonvolatile memory stores a first parameter indicating a delay value. The controller acquires the first parameter from the nonvolatile memory. The controller delays start timing of data transfer to the nonvolatile memory via a channel among the plurality of channels by a delay value according to the first parameter.