公开(公告)号：US20210296143A1

公开(公告)日：2021-09-23

申请号：US17119431

申请日：2020-12-11

Applicant: Kioxia Corporation

Inventor： Shinsuke MURAKI ,  Satoshi NAKAOKA

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/311

Abstract: A semiconductor manufacturing apparatus according to the present embodiment includes a tank, a heater, a bubble supplier, a sensor and a controller. The tank stores a chemical solution for processing a substrate. The heater heats the chemical solution. The bubble supplier supplies bubbles to the chemical solution in the tank. The sensor detects at least one of a concentration of the chemical solution, a water concentration of the chemical solution, specific gravity of the chemical solution and a vapor concentration of a gas discharged from the tank. The controller controls the supply of bubbles by the bubble supplier based on a detection result of the sensor.

公开(公告)号：US20230092336A1

公开(公告)日：2023-03-23

申请号：US17652986

申请日：2022-03-01

Applicant: Kioxia Corporation

Inventor： Shinsuke MURAKI

IPC: H01L21/306 ,  H01L21/67 ,  H01L21/683

Abstract: A semiconductor manufacturing apparatus for processing an object having a first surface and a second surface opposite to the first surface, includes: a first processor having a chuck in a first chamber, the chuck having a chuck surface configured to chuck the object, the chuck surface having protrusions adjacent to each other along one direction of the chuck surface, the protrusions being configured to be pressed against the second surface to form depressions adjacent to each other along one direction on the second surface; and a second processor configured to expose the second surface to a chemical solution in a second chamber to process the depressions into a trench, the trench extending along the one direction on the second surface.

公开(公告)号：US20230072887A1

公开(公告)日：2023-03-09

申请号：US17691209

申请日：2022-03-10

Applicant: Kioxia Corporation

Inventor： Fuyuma ITO ,  Hiroyasu IIMORI ,  Shinsuke MURAKI ,  Yuya AKEBOSHI ,  Yosuke MARUYAMA ,  Satoshi NAKAOKA

IPC: H01L21/66 ,  H01L21/67

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a processor configured to process a film provided on an end portion of a substrate. The apparatus further includes a detector configured to detect information relating to a shape of the end portion of the substrate. The apparatus further includes a controller configured to control the processing of the film by the processor, based on the information relating to the shape of the end portion of the substrate.