公开(公告)号：US20220288649A1

公开(公告)日：2022-09-15

申请号：US17467129

申请日：2021-09-03

Applicant: Kioxia Corporation

Inventor： Yosuke MARUYAMA

IPC: B08B3/02 ,  B08B13/00 ,  B05B13/04

Abstract: According to an embodiment, a substrate cleaning device includes a processing tank, at least one spray tube, and a scanning mechanism. The processing tank can accommodate a plurality of substrates arranged in a thickness direction of the substrates. The spray tube extends in the thickness direction and is configured to emit a cleaning liquid to each substrate accommodated in the processing tank. The scanning mechanism is configured to move the spray tube along an outer periphery of the substrate to perform a scan.

公开(公告)号：US20230072887A1

公开(公告)日：2023-03-09

申请号：US17691209

申请日：2022-03-10

Applicant: Kioxia Corporation

Inventor： Fuyuma ITO ,  Hiroyasu IIMORI ,  Shinsuke MURAKI ,  Yuya AKEBOSHI ,  Yosuke MARUYAMA ,  Satoshi NAKAOKA

IPC: H01L21/66 ,  H01L21/67

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a processor configured to process a film provided on an end portion of a substrate. The apparatus further includes a detector configured to detect information relating to a shape of the end portion of the substrate. The apparatus further includes a controller configured to control the processing of the film by the processor, based on the information relating to the shape of the end portion of the substrate.

公开(公告)号：US20240312802A1

公开(公告)日：2024-09-19

申请号：US18447702

申请日：2023-08-10

Applicant: Kioxia Corporation

Inventor： Yosuke MARUYAMA ,  Takahiro KAWATA ,  Satoshi NAKAOKA

IPC: H01L21/67 ,  H01L21/311 ,  H01L21/687

CPC classification number: H01L21/67086 ,  H01L21/31111 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/68771

Abstract: A substrate processing apparatus includes: a processing tank configured to store a solution capable of processing a substrate; a supply configured to supply the solution to the processing tank; a holding member having an openable and closable support portion capable of sandwiching the substrate, the holding member configured to hold the substrate in the processing tank; a first drive mechanism configured to move the holding member in a first direction along a substrate surface; and a guide disposed between the support portion and the supply in the processing tank and configured to guide a rotational movement of the substrate in the first direction.

公开(公告)号：US20240096659A1

公开(公告)日：2024-03-21

申请号：US18456652

申请日：2023-08-28

Applicant: Kioxia Corporation

Inventor： Fuyuma ITO ,  Jun TAKAGI ,  Ai MORI ,  Yosuke MARUYAMA ,  Yuya AKEBOSHI ,  Takashi WATANABE ,  Hiroyasu IIMORI

IPC: H01L21/67 ,  H01L21/311 ,  H01L21/3213

CPC classification number: H01L21/67086 ,  H01L21/31111 ,  H01L21/32134 ,  H01L21/67051

Abstract: A substrate processing apparatus includes: a plurality of roller pairs configured to place a plurality of substrates, respectively, wherein the substrates are arranged side by side in a horizontal direction with a predetermined interval, and rotate the plurality of substrates, respectively, in a circumferential direction; a first, second, and third circulation groove that are disposed along outer peripheral portions of each of the plurality of substrates; a chemical solution supplier configured to supply a chemical solution to the outer peripheral portions of the plurality of substrates through the first circulation groove; a rinse solution supplier configured to supply a rinse solution to the outer peripheral portions of the plurality of substrates through the second circulation groove; and a fluid supplier configured to supply a fluid for drying the rinse solution to the outer peripheral portions of the plurality of substrates through the third circulation groove.