公开(公告)号：US5826325A

公开(公告)日：1998-10-27

申请号：US890897

申请日：1997-07-10

申请人： Kirk B. Price ,  Brad J. Kriehn ,  Roy J. Flowers ,  Brad V. Johnson ,  Eric Eckberg

发明人： Kirk B. Price ,  Brad J. Kriehn ,  Roy J. Flowers ,  Brad V. Johnson ,  Eric Eckberg

IPC分类号： G11B5/105 ,  G11B5/40 ,  G11B5/48 ,  G11B25/04 ,  G11B5/42

CPC分类号： G11B25/043 ,  G11B5/4813 ,  G11B5/105 ,  G11B5/40 ,  Y10T29/49025 ,  Y10T29/53165

摘要： A head disk assembly file has a tub-type basecasting with side walls, a floor and a pack of hard disks. The file also comprises an actuator having a set of head gimbal assemblies with magnetic heads. The actuator is secured to the file and is rotatable from a pre-merge position outside of the disks to an inner diameter position near the centers of the disks. A head merge tool comprising a merge comb with fingers interfaces with the file at a home position. In the home position, the merge comb is surrounded by but free of contact with the side walls, the floor and the head gimbal assemblies. The floor has a recess located beneath the merge comb. The recess extends from one side wall to the inner diameter of the disks and provides a clearance for a lowermost finger of the merge comb. A flexible cable extends from the actuator to the floor. A depression in the floor adjacent to the recess accommodates the flexible cable. The depression is located beneath the path of and free of contact with the merge comb and actuator. During assembly, the merge comb is placed in the file at the home position and rotated so that the fingers engage and move the head gimbal assemblies to merge the heads. The lowermost finger moves beneath the lowermost disk in the recess free of contact with the lowermost disk and a floor surface of the recess. The merge comb then returns to the home position and disengages the file.

摘要翻译： 头盘组件文件具有带有侧壁，地板和一堆硬盘的盆式底座。 该文件还包括具有一组具有磁头的磁头万向架组件的致动器。 致动器被固定到文件并且可以从盘外部的预合并位置旋转到靠近盘的中心的内径位置。 一种头部合并工具，其包括具有手指的合并梳子，该文件与原始位置处的文件接合。 在起始位置，合并梳被四周围绕，但不与侧壁，地板和头部万向节组件接触。 地板在合并梳下面有一个凹槽。 凹部从一个侧壁延伸到盘的内径，并为合并梳的最下部手指提供间隙。 柔性电缆从致动器延伸到地板。 靠近凹槽的地板上的凹陷容纳柔性电缆。 凹陷位于与合并梳和致动器的路径下方并且不接触的位置。 在组装期间，合并梳被放置在原始位置的文件中并旋转，使得手指接合并移动头部万向节组件以合并头部。 最下面的手指在凹槽中的最下面的盘下方移动，与最下面的盘和凹槽的地板表面接触。 合并梳然后返回到原始位置并脱离文件。

公开(公告)号：US20070070610A1

公开(公告)日：2007-03-29

申请号：US11239599

申请日：2005-09-29

申请人： Lee Cleveland ,  Eric Eckberg ,  Jeffery Gathje ,  Michael Good ,  Herbert Jensen ,  Mark Pfeifer ,  John Skurdalsvold

发明人： Lee Cleveland ,  Eric Eckberg ,  Jeffery Gathje ,  Michael Good ,  Herbert Jensen ,  Mark Pfeifer ,  John Skurdalsvold

IPC分类号： H05K5/00

CPC分类号： G06F1/263 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/188 ,  G06F11/1666 ,  G06F11/2015

摘要： A low profile auto docking multi-battery pack system and an in place service PCI storage controller card system with redundant cache and concurrently maintainable redundant battery backup are provided. A first battery and a second battery are disposed in line to provide a low profile battery pack. The first battery and second battery are shrink-wrapped together inside a frame and are slideably removable through an opening in a PCI tailstock and are hot swappable. The PCI storage controller card system is defined by a two card assembly that includes an internal connector, such as a SCSI connector to connect the two cards together.

摘要翻译： 提供了一个低调的自动对接多电池组系统和一个就绪的服务PCI存储控制器卡系统与冗余缓存和同时可维护的冗余电池备份。 第一电池和第二电池被排列成一行以提供低轮廓的电池组。 第一个电池和第二个电池在一个框架内收缩包装在一起，并且可以通过PCI尾座的开口可滑动地拆卸，并且是可热插拔的。 PCI存储控制器卡系统由包括内部连接器的两个卡组件来定义，诸如将两个卡连接在一起的SCSI连接器。

公开(公告)号：US20070236888A1

公开(公告)日：2007-10-11

申请号：US11279266

申请日：2006-04-11

申请人： Eric Eckberg ,  Michael Good ,  Mark Pfeifer

发明人： Eric Eckberg ,  Michael Good ,  Mark Pfeifer

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.

摘要翻译： 本文公开了一种模块冷却系统，包括：与电路板可操作地连通的模块，邻接电路板的加强件，邻近模块的散热器，朝向模块偏置散热器的第一偏置构件，多个不影响 紧固件位置地固定散热器;以及第二偏置构件，将电路板和模块朝向散热器偏置。 本文进一步公开的是一种安装模块冷却系统的方法，包括：将模块电连接到电路板，将加强件邻接到电路板，将散热器邻接到模块，用偏置构件偏置散热器朝向 模块，用不影响紧固件固定散热器，并且用电路板和模块朝向散热器的第二偏置构件偏置。

公开(公告)号：US20070247813A1

公开(公告)日：2007-10-25

申请号：US11379417

申请日：2006-04-20

申请人： John Colbert ,  John Corbin ,  Eric Eckberg ,  James Gerken ,  Roger Hamilton ,  Maurice Holahan

发明人： John Colbert ,  John Corbin ,  Eric Eckberg ,  James Gerken ,  Roger Hamilton ,  Maurice Holahan

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L2224/16225 ,  Y10T24/44017 ,  Y10T24/44026

摘要： A load frame has an open region exposing a surface of an electronic component. A heat sink is disposed on the load frame and has a surface in thermal contact with the surface of the electronic component. A non-influencing fastener is disposed within a bore in the heat sink and threaded into the load frame for securing the heat sink to the load frame. The non-influencing fastener includes a screw with a head; a tapered ring disposed below the head of the screw and having a tapered lower peripheral surface; a sealing ring engaging the tapered lower peripheral surface of the tapered ring; and a load washer disposed between the sealing ring and the load frame. Compression of the rings by turning of the screw into the load frame causes the sealing ring to expand against the bore of the heatsink. Preferably, the sealing ring has a curved outer surface.

摘要翻译： 负载框架具有暴露电子部件的表面的开放区域。 散热器设置在负载框架上并且具有与电子部件的表面热接触的表面。 不影响的紧固件设置在散热器的孔内并且拧入负载框架中，以将散热器固定到负载框架上。 非影响性紧固件包括具有头部的螺钉; 锥形环设置在螺钉的头部下方并具有锥形的下外周表面; 与锥形环的锥形下周面接合的密封环; 以及设置在密封环和负载框架之间的负载垫圈。 通过将螺钉转入负载框架来压缩环使得密封环相对于散热器的孔膨胀。 优选地，密封环具有弯曲的外表面。

公开(公告)号：US20070084588A1

公开(公告)日：2007-04-19

申请号：US11249912

申请日：2005-10-13

申请人： Eric Eckberg ,  James Gerken ,  Cary Huettner ,  Roger Schmidt

发明人： Eric Eckberg ,  James Gerken ,  Cary Huettner ,  Roger Schmidt

IPC分类号： H05K7/20

CPC分类号： H05K7/20272 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a system for liquid cooling of electronics, where the electronics are subject to rotation in space, a liquid coolant storage tank includes a degassing and vortex-preventing structure to allow bubbles to float to the surface of the liquid inside the tank, and also to prevent vortices from forming near the outlet from the tank. The structure includes nested tubes or conduits. An inner conduit extends from the inlet into the tank, and its open end is covered by a second conduit with a baffle across its end, so that the flow is directed by the baffle to flow back along the outside of the inner conduit, and inside of the outer conduit. Especially at the inlet, a third conduit with large perforations surrounds the open end of the outer conduit. Smaller perforations on the inner conduit at the outlet side discourage any vortex from forming there. Reversal of the liquid flow, and the gradual increase in flow cross section prevent surging inside the tank.

摘要翻译： 在电子设备的液体冷却系统中，电子设备在空间中旋转，液体冷却剂储存箱包括脱气和防涡旋结构，以允许气泡漂浮到罐内的液体表面，并且还包括 防止涡流在罐的出口附近形成。 该结构包括嵌套管或导管。 内部导管从入口延伸到罐中，其开口端被第二导管覆盖，第二导管在其端部上具有挡板，使得流动被挡板引导以沿着内部管道的外部向后流动，并且内部 的外管。 特别是在入口处，具有大穿孔的第三导管围绕外导管的开口端。 出口侧内管上较小的穿孔阻止任何涡流形成。 液体流动的反转，流动横截面的逐渐增加可以防止罐内涌动。

公开(公告)号：US20070035937A1

公开(公告)日：2007-02-15

申请号：US11201972

申请日：2005-08-11

申请人： John Colbert ,  Eric Eckberg ,  Roger Hamilton ,  Mark Hoffmeyer ,  Amanda Mikhail ,  Arvind Sinha

发明人： John Colbert ,  Eric Eckberg ,  Roger Hamilton ,  Mark Hoffmeyer ,  Amanda Mikhail ,  Arvind Sinha

IPC分类号： H05K7/04 ,  H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

摘要翻译： 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。