摘要:
A pressure sensor for detecting pressure includes: a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip. Each semiconductor chip is mounted on the diaphragm.
摘要:
A pressure sensor for detecting pressure includes: a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip. Each semiconductor chip is mounted on the diaphragm.
摘要:
A pressure sensor includes a metal housing and a semiconductor chip. The housing has a diaphragm unitary with the housing and an inlet for introducing fluid to the diaphragm. The inlet has a first end exposed to the diaphragm and a second end exposed to an outside of the housing. The housing has a thin-wall portion at the first end of the inlet and the thin-wall portion serves as the diaphragm. The chip is mounted on the diaphragm. The area and thickness of the chip are set so that separation between the chip and diaphragm can be prevented. Since the separation is prevented based on the area and thickness of the chip, there is no need that the diaphragm is made of a material having a thermal expansion coefficient similar to that of the chip.
摘要:
A pressure sensor includes a metal housing and a semiconductor chip. The housing has a diaphragm unitary with the housing and an inlet for introducing fluid to the diaphragm. The inlet has a first end exposed to the diaphragm and a second end exposed to an outside of the housing. The housing has a thin-wall portion at the first end of the inlet and the thin-wall portion serves as the diaphragm. The chip is mounted on the diaphragm. The area and thickness of the chip are set so that separation between the chip and diaphragm can be prevented. Since the separation is prevented based on the area and thickness of the chip, there is no need that the diaphragm is made of a material having a thermal expansion coefficient similar to that of the chip.
摘要:
An RFID-tag fabricating apparatus for fabricating an RFID tag provided with an IC circuit, including a substrate-accommodating device for accommodating a first substrate in the form of a tape having a printable surface and a second substrate in the form of a tape to be bonded to the first substrate, a printing device operable to form a predetermined printed indicium on the printable surface of the first substrate, a tag-tape forming device operable to form a tag tape, by bonding together the first and second substrates such that a plurality of IC circuit portions are interposed between the first and second substrates, a tag-tape cutting device operable to cut the tag tape formed by the tag-tape forming device, and a tag-tape cutting control portion operable to change a length of a segment of the tag tape to be obtained as the RFID tag by cutting of the tag tape by the tag-tape cutting device, on the basis of a length of the printed indicium formed on the first substrate, and such that the segment includes at least one of the IC circuit portions, whereby the dimensions of the RFID tag can be changed depending upon the dimensions of the printed indicium formed on the first substrate.
摘要:
An RFID-tag fabricating apparatus for fabricating an RFID tag provided with an IC circuit, including a substrate-accommodating device for accommodating a first substrate in the form of a tape having a printable surface and a second substrate in the form of a tape to be bonded to the first substrate, a printing device operable to form a predetermined printed indicium on the printable surface of the first substrate, a tag-tape forming device operable to form a tag tape, by bonding together the first and second substrates such that a plurality of IC circuit portions are interposed between the first and second substrates, a tag-tape cutting device operable to cut the tag tape formed by the tag-tape forming device, and a tag-tape cutting control portion operable to change a length of a segment of the tag tape to be obtained as the RFID tag by cutting of the tag tape by the tag-tape cutting device, on the basis of a length of the printed indicium formed on the first substrate, and such that the segment includes at least one of the IC circuit portions, whereby the dimensions of the RFID tag can be changed depending upon the dimensions of the printed indicium formed on the first substrate.
摘要:
Systems and methods provide an image formation apparatus in which an image formation apparatus main body, an image reading portion, and an operation panel portion can be efficiently assembled by mounting a joint cover to a printer main body, an operation panel unit and a scanner unit are mounted to the joint cover. By so doing, the operation panel unit and the scanner unit can be reliably assembled to the printer main body via the joint cover, the joint cover is held, and a combined machine can be lifted and carried.