Miniature fuse of surface-mount type
    2.
    发明授权
    Miniature fuse of surface-mount type 有权
    表面贴装型微型保险丝

    公开(公告)号:US06798330B2

    公开(公告)日:2004-09-28

    申请号:US10068954

    申请日:2002-02-11

    Abstract: A miniature fuse of surface mount type having a stable pre-arcing time-current characteristic and a strong time lag characteristic The fuse is easy to produce, and provides a constant pre-arcing time. The main body of the fuse is of rectangular ceramic construction of split type. A fusible member (60) wound around a ceramic rod (58) and is rested on a recessed portion (62) of the lower ceramic casing (54). The end portion (76) of the fusible member (60) is engaged with the side surface of the casing. The upper ceramic casing (52) is laid on the lower casing, so that the caps (56) are fit onto the opposite ends of the main body. The end portion (76) of the fusible member (60) and the cap (56) are connected by welding. At the time of welding, projections (74) to be fit in the recessed portions (72) provided at the main body, is formed at the cap (56), so that the cap (56) can be fixed to the main body.

    Abstract translation: 一种具有稳定的预电弧时间电流特性和强时滞特性的表面贴装型微型保险丝熔断器易于生产,并提供恒定的预电弧时间。 保险丝的主体是分体式的矩形陶瓷结构。 缠绕在陶瓷棒(58)上的可熔部件(60),并放在下陶瓷壳体(54)的凹部(62)上。 可熔构件(60)的端部(76)与壳体的侧表面接合。 上陶瓷壳体(52)被放置在下壳体上,使得盖(56)装配到主体的相对端。 可熔构件(60)的端部(76)和盖(56)通过焊接连接。 在焊接时,在盖(56)上形成有配合在主体上的凹部(72)上的突起(74),从而能够将盖(56)固定在主体上。

    Microchip fuse with a casing constructed from upper and lower members
and a hollow portion in the casing
    3.
    发明授权
    Microchip fuse with a casing constructed from upper and lower members and a hollow portion in the casing 失效
    Microchip保险丝与由上部和下部构件构成的外壳和外壳中的中空部分

    公开(公告)号:US5617069A

    公开(公告)日:1997-04-01

    申请号:US466977

    申请日:1995-06-06

    CPC classification number: H01H85/0411 H01H2085/383 H01H85/0082

    Abstract: A microchip fuse is disclosed which includes a casing constructed from box-like upper and lower members. On the end surfaces of both members, electrode sections are provided which are formed by plating metal onto a sintered conductive paste on the end surfaces. Grooves are provided on the members and filled with insulating material. A fusible element extends through the insulating material and the inner surface as formed when the both members are jointed together. The end portions of the fusible element are soldered to the electrode sections. A hollow portion is provided in the casing adjacent to the inner space by way of a thin wall to dampen the pressure of a gas generated during the interruption process.

    Abstract translation: 公开了一种微芯片保险丝,其包括由盒状上部和下部构件构成的壳体。 在两个构件的端面上,设置通过将金属电镀在端面上的烧结导电糊上形成的电极部。 在构件上提供槽,并填充绝缘材料。 可熔元件延伸穿过绝缘材料和当两个构件接合在一起时形成的内表面。 可熔元件的端部焊接到电极部分。 中空部分通过薄壁设置在与内部空间相邻的壳体中,以抑制在中断过程中产生的气体的压力。

    Fuse
    4.
    发明申请
    Fuse 审中-公开
    保险丝

    公开(公告)号:US20090027155A1

    公开(公告)日:2009-01-29

    申请号:US12219267

    申请日:2008-07-18

    CPC classification number: H01H85/38 H01H2085/381

    Abstract: A small-sized fuse is provided that has a large breaking capability and is easy to manufacture. When a fusible element 18 melts and turns into metal vapor, arc discharge occurs in a large space 40 across which the fusible element 18 extends, of an inner space 26, and a pressure in the large space 40 rises instantaneously to an extremely large degree. Due to this pressure rise, the breaking member 24 moves from a position shown in FIG. 5A to a position shown in FIG. 5B. With the movement of the breaking member 24, the breaking member 24 closes instantaneously link holes 36 and 38 in a main body, whereby a flow of electrons is interrupted and the arc discharge is extinguished instantaneously.

    Abstract translation: 提供小型熔断器,具有较大的断路能力,易于制造。 当可熔元件18熔化并变成金属蒸气时,电弧放电发生在内部空间26中可熔元件18延伸的大空间40中,并且大空间40中的压力瞬间上升到非常大的程度。 由于该压力上升,破坏构件24从图1所示的位置移动。 图5A所示的位置。 5B。 随着断开构件24的移动,断开构件24瞬间闭合主体中的连接孔36和38,由此中断电子流并且瞬间熄灭电弧放电。

    Micro-chip fuse and method of manufacturing the same
    5.
    发明授权
    Micro-chip fuse and method of manufacturing the same 失效
    微芯片保险丝及其制造方法相同

    公开(公告)号:US5606301A

    公开(公告)日:1997-02-25

    申请号:US314287

    申请日:1994-09-30

    Applicant: Koh Ishimura

    Inventor: Koh Ishimura

    CPC classification number: H01H85/0411 H01H85/046 Y10T29/49107

    Abstract: A micro-chip fuse and a method of manufacturing the fuse is disclosed which includes a fusible element made of a metallic film that is formed by a depositioning process. Through-bores are provided through a first substrate and filled with a photosensitive resist to make smooth the surface of the first substrate. After curing the resist, metal is deposited on the surface of the first substrate to form a metallic film. A photosensitive resist is applied to the metallic film and a photomask is placed on the resist to effect an exposure and a development. The metallic film is etched and the resists are removed to form the fusible elements made of the metallic film extending over the through-bores. A second substrate is placed under the first substrate, and a third substrate including recesses for cover the through-bores is placed on the first substrate to laminate them. Electrodes are provided on the ends of the substrates. The laminated substrates are divided into individual micro-chip fuses.

    Abstract translation: 公开了一种微型晶片保险丝和制造保险丝的方法,其包括由通过沉积工艺形成的金属膜制成的可熔元件。 穿孔通过第一基底提供并填充有光敏抗蚀剂以使第一基底的表面光滑。 在固化抗蚀剂之后,金属沉积在第一衬底的表面上以形成金属膜。 将光敏抗蚀剂施加到金属膜上,并将光掩模放置在抗蚀剂上以进行曝光和显影。 金属膜被蚀刻并且去除抗蚀剂以形成由穿过通孔延伸的金属膜制成的可熔元件。 将第二基板放置在第一基板下方,并且将包括用于覆盖通孔的凹部的第三基板放置在第一基板上以层压它们。 电极设置在基板的端部。 层压基板分为单独的微芯片保险丝。

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