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    Manufacturing method of acoustic sensor
    6.
    发明申请
    Manufacturing method of acoustic sensor 失效
    声传感器制造方法

    公开(公告)号：US20050251995A1

    公开(公告)日：2005-11-17

    申请号：US11185775

    申请日：2005-07-21

    申请人： Takao Kawamura ,  Yoshiaki Ohbayashi ,  Mamoru Yasuda

    发明人： Takao Kawamura ,  Yoshiaki Ohbayashi ,  Mamoru Yasuda

    IPC分类号： H04R19/00 ,  H04R19/01 ,  H04R19/04 ,  H04R25/00 ,  H04R31/00

    CPC分类号： H04R19/005 ,  H04R19/016 ,  H04R31/00 ,  H04R31/006 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798

    摘要： The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

    摘要翻译： 本发明涉及能够减小尺寸的半导体驻极体电容麦克风，包括用于容纳声传感器100的声传感器100和壳体200，声传感器100具有形成必要的电子电路111A至111的半导体芯片110 C，并且从电子电路111A至111C离开通孔112，形成在半导体芯片110的远离通孔112的表面上的电极层120，与电极的一部分层叠的驻极体部件130 层120和通孔112以及设置有与驻极体构件130间隔160的隔膜140，其中从驻极体构件130露出的电极层120通过壳体连接到电子电路111A的电极111a 200（图6）。

    Manufacturing method of acoustic sensor
    7.
    发明授权
    Manufacturing method of acoustic sensor 失效
    声传感器制造方法

    公开(公告)号：US07204009B2

    公开(公告)日：2007-04-17

    申请号：US11185775

    申请日：2005-07-21

    申请人： Takao Kawamura ,  Yoshiaki Ohbayashi ,  Mamoru Yasuda

    发明人： Takao Kawamura ,  Yoshiaki Ohbayashi ,  Mamoru Yasuda

    IPC分类号： H04R31/00

    CPC分类号： H04R19/005 ,  H04R19/016 ,  H04R31/00 ,  H04R31/006 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798

    摘要： The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

    摘要翻译： 本发明涉及能够减小尺寸的半导体驻极体电容麦克风，包括用于容纳声传感器100的声传感器100和壳体200，声传感器100具有形成必要的电子电路111A至111的半导体芯片110 C，并且从电子电路111A至111C离开通孔112，形成在半导体芯片110的远离通孔112的表面上的电极层120，与电极的一部分层叠的驻极体部件130 层120和通孔112以及设置有与驻极体构件130间隔160的隔膜140，其中从驻极体构件130露出的电极层120通过壳体连接到电子电路111A的电极111a 200（图6）。

    Manufacturing method of acoustic sensor
    8.
    发明授权
    Manufacturing method of acoustic sensor 失效
    声传感器制造方法

    公开(公告)号：US07080442B2

    公开(公告)日：2006-07-25

    申请号：US10274198

    申请日：2002-10-21

    申请人： Takao Kawamura ,  Yoshiaki Ohbayashi ,  Mamoru Yasuda

    发明人： Takao Kawamura ,  Yoshiaki Ohbayashi ,  Mamoru Yasuda

    IPC分类号： H04R31/00

    CPC分类号： H04R19/005 ,  H04R19/016 ,  H04R31/00 ,  H04R31/006 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798

    摘要： The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

    摘要翻译： 本发明涉及能够减小尺寸的半导体驻极体电容麦克风，包括用于容纳声传感器100的声传感器100和壳体200，声传感器100具有形成必要的电子电路111A至111的半导体芯片110 C，并且从电子电路111A至111C离开通孔112，形成在半导体芯片110的远离通孔112的表面上的电极层120，与电极的一部分层叠的驻极体部件130 层120和通孔112以及设置有与驻极体构件130间隔160的隔膜140，其中从驻极体构件130露出的电极层120通过壳体连接到电子电路111A的电极111a 200（图6）。

    Quick heat roller
    9.
    发明授权
    Quick heat roller 失效
    快速加热辊

    公开(公告)号：US06289198B1

    公开(公告)日：2001-09-11

    申请号：US09509916

    申请日：2000-04-04

    申请人： Takao Kawamura ,  Tsuyoshi Nishi

    发明人： Takao Kawamura ,  Tsuyoshi Nishi

    IPC分类号： G03G1520

    CPC分类号： G03G15/2053 ,  G03G15/2057

    摘要： A temperature-controlled quick heat roller having an electrical resistance heater sheet provided on an inner surface of the cylinder. The electrical resistance heater is made of at least a high-temperature-coefficient resistance layer so that when the high-temperature-coefficient resistance layer is heated by an electric current, the cylinder is set to a prescribed fixing temperature. Also, the heat roller has a property in which heating electrical power drops as the temperature thereof rises.

    摘要翻译： 一种温度控制的快速加热辊，其具有设置在气缸的内表面上的电阻加热片。 电阻加热器由至少高温系数电阻层构成，当高温系数电阻层被电流加热时，​​将气缸设定在规定的定影温度。 此外，加热辊具有随着其升温而加热电力下降的性质。