公开(公告)号：US07601289B2

公开(公告)日：2009-10-13

申请号：US10589666

申请日：2005-02-15

申请人： Koji Hamano ,  Naoto Toyooka ,  Haruki Adachi

发明人： Koji Hamano ,  Naoto Toyooka ,  Haruki Adachi

IPC分类号： B29C45/14 ,  B29C45/18

CPC分类号： B29C45/14467 ,  B29C33/0038 ,  B29C45/0025 ,  B29C45/14016 ,  B29C45/14827 ,  B29C45/2673 ,  B29C45/27 ,  B29C2045/14532

摘要： The two-sides in-mold decoration molding die includes a first mold on which the first decoration film is lengthwise movably disposed, and a second mold on which the second decoration film is laterally movably disposed and provided with a sprue and a runner, and a protruding section set higher than a region where the second decoration film passes is provided in a portion surrounding at least the runner, in an area directly confronting the first decoration film when the molds are clamped.

摘要翻译： 两面模内装饰成型模具包括：第一装饰膜纵向可移动地设置在其上的第一模具和第二装饰膜，第二装饰膜横向移动地设置在该第二模具上，并且设置有浇道和浇道， 在第二装饰膜通过的区域上设置的突出部设置在至少围绕流道的部分中，在模具被夹紧时，直接面对第一装饰膜的区域。

公开(公告)号：US20070120289A1

公开(公告)日：2007-05-31

申请号：US10589666

申请日：2005-02-15

申请人： Koji Hamano ,  Naoto Toyooka ,  Haruki Adachi

发明人： Koji Hamano ,  Naoto Toyooka ,  Haruki Adachi

IPC分类号： B32B37/00

CPC分类号： B29C45/14467 ,  B29C33/0038 ,  B29C45/0025 ,  B29C45/14016 ,  B29C45/14827 ,  B29C45/2673 ,  B29C45/27 ,  B29C2045/14532

摘要： The two-sides in-mold decoration molding die includes a first mold on which the first decoration film is lengthwise movably disposed, and a second mold on which the second decoration film is laterally movably disposed and provided with a sprue and a runner, and a protruding section set higher than a region where the second decoration film passes is provided in a portion surrounding at least the runner, in an area directly confronting the first decoration film when the molds are clamped.

摘要翻译： 两面模内装饰成型模具包括：第一装饰膜纵向可移动地设置在其上的第一模具和第二装饰膜，第二装饰膜横向移动地设置在该第二模具上，并且设置有浇道和浇道， 在第二装饰膜通过的区域上设置的突出部设置在至少围绕流道的部分中，在模具被夹紧时，直接面对第一装饰膜的区域。

公开(公告)号：US20060222826A1

公开(公告)日：2006-10-05

申请号：US10564833

申请日：2004-07-15

申请人： Koji Hamano ,  Naoto Toyooka

发明人： Koji Hamano ,  Naoto Toyooka

IPC分类号： B28B7/22

CPC分类号： B29C45/14467 ,  B29C45/0025 ,  B29C45/14827 ,  B29C2045/14532 ,  B29K2995/0026 ,  Y10T428/24802

摘要： An in-mold decorated molded article wherein a coating layer is formed on a top surface of a transparent molded resin body which is flattened in a thickness direction of the body, thereby covering an edge part of the top surface adjacent to a side face on with a side gate mark formed, in order for the side gate mark not to be seen from the top surface of the molded resin body, and a decorative layer is formed on a bottom surface of a decorative layer of the transparent molded resin body. According to an in-mold decorated molded article, even when the transparent molding resin is employed with the result that an agreeable appearance is not achieved despite of a treatment for the side gate mark, the design property of the in-mold decorated molded article can be maintained, the gate mark of unacceptable appearance being not seen from the top surface.

摘要翻译： 一种模内装饰成型制品，其中在透明模制树脂体的顶表面上形成涂层，该透明​​模塑树脂体在主体的厚度方向上被压平，从而覆盖与侧面相邻的顶表面的边缘部分， 形成侧门标记，以便从模制树脂体的顶表面看不到侧栅标记，并且在透明模制树脂体的装饰层的底表面上形成装饰层。 根据模内装饰成型品，即使使用了透明模塑树脂，结果即使对侧浇口标记进行了处理也没有达到令人满意的外观，因此模内装饰成型品的设计性能可以 要保持，从顶面看不到不可接受的外观的门标。

公开(公告)号：US20050116386A1

公开(公告)日：2005-06-02

申请号：US10507631

申请日：2003-03-14

申请人： Koji Hamano ,  Isao Yamamoto

发明人： Koji Hamano ,  Isao Yamamoto

IPC分类号： B29C45/14 ,  B29C45/26 ,  B29C51/00

CPC分类号： B29C45/14827 ,  B29C45/14836 ,  B29C45/26 ,  B29C51/00 ,  B29L2031/3431 ,  B29L2031/3437

摘要： An injection molded article (15) which has a transfer layer (29) bonded onto and integrated with a surface thereof and in which a sectional shape of a part of a corner of a top surface of the injection molded article where a radius r of curvature is the smallest satisfies conditions of R

摘要翻译： 一种注射成型制品（15），其具有结合到其表面并与其一体化的转印层（29），其中注射成型制品的顶表面的角部的一部分的截面形状的曲率半径 是R = D和0.2 <= rR / D <= 30或0.01 <= RRR 2 A的最小满足条件 其中，R是上表面的角部的曲率半径，D是上表面与基准面的距离，A是分割角处的拉拔角，R 2 = SUB>是分离角处的曲率半径，H是凹部的上表面与基准面的距离。

公开(公告)号：US08159820B2

公开(公告)日：2012-04-17

申请号：US12215491

申请日：2008-06-26

申请人： Satoshi Ibori ,  Koji Hamano ,  Jiangming Mao ,  Tomoya Kamezawa ,  Masayuki Hirota ,  Masahiro Hiraga

发明人： Satoshi Ibori ,  Koji Hamano ,  Jiangming Mao ,  Tomoya Kamezawa ,  Masayuki Hirota ,  Masahiro Hiraga

IPC分类号： H05K7/20

CPC分类号： H02M7/003 ,  H01L23/4006 ,  H01L23/467 ,  H01L23/642 ,  H01L25/072 ,  H01L2924/0002 ,  H05K7/20909 ,  H01L2924/00

摘要： In the present invention, miniaturization of an electric power conversion system is made possible while the reduction of a rise in temperature is achieved through a cooling operation by a cooling fan. The electric power conversion system is provided with a casing for covering cooling fins for cooling power semiconductors, a main circuit board having a driver circuit for driving the power semiconductors, and a cover for covering up the main circuit board. The system includes a first airflow hole provided at a part of the main circuit board, on the upper side of an air-intake provided in the cover, and a second airflow hole provided on the lower side of the first airflow hole, and on the lower side of the cooling fins, wherein air from the second airflow hole is driven to the cooling fins by a cooling fan.

摘要翻译： 在本发明中，通过冷却风扇的冷却运转，可实现电力转换系统的小型化，同时降低温度上升。 该电力转换系统设置有用于覆盖用于冷却功率半导体的冷却片的壳体，具有用于驱动功率半导体的驱动电路的主电路板和用于覆盖主电路板的盖。 该系统包括设置在主电路板的一部分上的第一气流孔，设置在盖中的进气口的上侧，以及设置在第一气流孔的下侧的第二气流孔， 冷却翅片的下侧，其中来自第二气流孔的空气通过冷却风扇被驱动到冷却翅片。

公开(公告)号：US20090034309A1

公开(公告)日：2009-02-05

申请号：US12215491

申请日：2008-06-26

申请人： Satoshi Ibori ,  Koji Hamano ,  Jiangming Mao ,  Tomoya Kamezawa ,  Masayuki Hirota ,  Masahiro Hiraga

发明人： Satoshi Ibori ,  Koji Hamano ,  Jiangming Mao ,  Tomoya Kamezawa ,  Masayuki Hirota ,  Masahiro Hiraga

IPC分类号： H05K7/20

CPC分类号： H02M7/003 ,  H01L23/4006 ,  H01L23/467 ,  H01L23/642 ,  H01L25/072 ,  H01L2924/0002 ,  H05K7/20909 ,  H01L2924/00

摘要： In the present invention, miniaturization of an electric power conversion system is made possible while the reduction of a rise in temperature is achieved through a cooling operation by a cooling fan. The electric power conversion system is provided with a casing for covering cooling fins for cooling power semiconductors, a main circuit board having a driver circuit for driving the power semiconductors, and a cover for covering up the main circuit board. The system includes a first airflow hole provided at a part of the main circuit board, on the upper side of an air-intake provided in the cover, and a second airflow hole provided on the lower side of the first airflow hole, and on the lower side of the cooling fins, wherein air from the second airflow hole is driven to the cooling fins by a cooling fan.

摘要翻译： 在本发明中，通过冷却风扇的冷却运转，可实现电力转换系统的小型化，同时降低温度上升。 该电力转换系统设置有用于覆盖用于冷却功率半导体的冷却片的壳体，具有用于驱动功率半导体的驱动电路的主电路板和用于覆盖主电路板的盖。 该系统包括设置在主电路板的一部分上的第一气流孔，设置在盖中的进气口的上侧，以及设置在第一气流孔的下侧的第二气流孔， 冷却翅片的下侧，其中来自第二气流孔的空气通过冷却风扇被驱动到冷却翅片。