Forming method of thin layer
    1.
    发明授权

    公开(公告)号:US11780728B2

    公开(公告)日:2023-10-10

    申请号:US16896864

    申请日:2020-06-09

    CPC classification number: B81C1/00396 G02B1/115

    Abstract: A forming method of a thin layer with a pore is provided. The method includes forming a thin layer on a substrate, stacking a first mask and a second mask on the thin layer in this order, and forming a pore in the thin layer by dry etching. The first mask includes at least a self-assembling material. The second mask is more resistant to reactive etching or physical etching than the first mask.

    Method for producing piezoelectric element, and piezoelectric element

    公开(公告)号:US11623247B2

    公开(公告)日:2023-04-11

    申请号:US16076011

    申请日:2017-02-15

    Abstract: There is provided a method for producing a piezoelectric element, which allows for forming a columnar microstructure with a small width and a high aspect ratio. The method is intended to produce a piezoelectric element 102 including a three-dimensional structure group 20 having a plurality of the three-dimensional structures 21 and 321 formed in a plate-like or columnar shape with a width of 30 μm or less and a height of 80 μm or more. The production method includes a first process of fabricating a plurality of plate-like or columnar precursor shapes 82a on a bulk material 81 formed of a Pb-based piezoelectric material, and a second process of reducing the width of the precursor shapes 82a to a predetermined value using an etching liquid.

    Piezoelectric element manufacturing method

    公开(公告)号:US11081639B2

    公开(公告)日:2021-08-03

    申请号:US16302817

    申请日:2017-04-25

    Abstract: The present invention provides a piezoelectric element manufacturing method. The manufacturing method is a method of manufacturing a piezoelectric element comprising a piezoelectric body composite in which a piezoelectric body configured from a Pb-based piezoelectric material and a resin are alternately arranged, and comprises a step of etching, using an etching liquid, a plurality of parallel piezoelectric body segments formed by dicing. The etching liquid comprises a liquid which contains 0.1 to 20 mass % of hexafluorosilicic acid.

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