公开(公告)号：US20130135758A1

公开(公告)日：2013-05-30

申请号：US13687098

申请日：2012-11-28

Applicant: Korea Institute of Science and Technology

Inventor： Seong Il KIM ,  Young Hwan KIM ,  Won Jun CHOI ,  Young Tae KIM

IPC: G02B3/08

CPC classification number: G02B3/08 ,  F24S23/00 ,  F24S23/31 ,  F24S40/52 ,  F24S50/80 ,  H01L31/054 ,  H01L31/0543 ,  Y02E10/43 ,  Y02E10/44 ,  Y02E10/52

Abstract: Provided is a concentration ratio controlling apparatus for concentration type solar cells that may adjust an opened area by mounting, to a lower portion of a solar simulator, a concentration ratio controlling apparatus combined with an adjustment unit capable of controlling the opened area and thereby adjusting the adjustment unit, and as a result, may adjust the quantity of light, that is, a concentration ratio, that is irradiated toward the surface of a solar cell disposed below a condenser by varying the quantity of light incident through a Fresnel lens disposed in a lower portion of the condenser.

Abstract translation: 提供了一种浓缩型太阳能电池的浓度比控制装置，其可以通过将太阳能模拟器的下部安装到与能够控制开放面积的调节单元组合的浓度比控制装置来调节开放面积，从而调整开度 调节单元，结果可以通过改变通过布置在一个电容器中的菲涅耳透镜入射的光量来调节照射到设置在电容器下方的太阳能电池的表面的光量，即浓度比 冷凝器的下部。

公开(公告)号：US20130214411A1

公开(公告)日：2013-08-22

申请号：US13659345

申请日：2012-10-24

Applicant: Korea Institute of Science and Technology

Inventor： Young Hwan KIM ,  Yong Tae KIM ,  Seong Il KIM ,  Chun Keun KIM

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L23/53238 ,  H01L21/76814 ,  H01L21/76826 ,  H01L21/76831 ,  H01L21/7684 ,  H01L21/76843 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is a method of manufacturing a metal interconnect of a semiconductor device including: forming a interconnect hole by patterning an interlayer insulating film formed on a substrate; performing a nitriding treatment on a surface of the interlayer insulating film by injecting a gas including nitrogen into a deposition apparatus in which the substrate is disposed; forming a diffusion preventing film by injecting the gas including nitrogen and a metal source gas into the deposition apparatus together; filling the interconnect hole with a metal; and removing the metal formed on a part other than the interconnect hole by a chemical mechanical polishing (CMP) process. Accordingly, the mechanical strength of the interlayer insulating film is increased, thereby preventing scratches or defects that are generated during the chemical mechanical polishing process.

Abstract translation: 提供一种制造半导体器件的金属互连的方法，包括：通过图案化形成在衬底上的层间绝缘膜来形成互连孔; 通过将包含氮气的气体注入到其中设置所述基板的沉积设备中来对所述层间绝缘膜的表面进行氮化处理; 通过将包含氮气和金属源气体的气体注入沉积设备来形成扩散防止膜; 用金属填充互连孔; 以及通过化学机械抛光（CMP）工艺除去形成在互连孔以外的部分上的金属。 因此，层间绝缘膜的机械强度增加，从而防止在化学机械抛光过程中产生的划痕或缺陷。