摘要:
A data storage system that uses a magnetic head assembly having a write head and a read head mounted on a slider to write on and read from a disk. A portion of the coil of the write head is used as a wear sensor for detecting wear on the surface of the slider. A head IC monitors the coil voltage and, when it goes lower than a reference voltage, detects the occurrence of a fault in the write head due to excessive wear on the slider surface. In response to the detection of the fault in the write head by the head IC, a control driver prohibits a write operation and saves data already recorded on the disk.
摘要:
The dimension ratio t/H of the thickness t of a flexure spring to the height (thickness) H of a slider 17 is set at 0.047 or less in order to reduce the variation in crown amount due to a temperature variation. As the ratio of the thickness t of the flexure spring to the height H of the slider decreases, the stress acting in the slider due to a difference in linear expansion coefficient between itself and the flexure spring decreases and the rigidity of the slider increases relative to the flexure spring. The dimension ratio H/L of the height H of the slider to the length L thereof is set at 0.245 or more. As the dimension ratio H/L increases, the rigidity of the slider increases and the amount of deformation of the slider due to a difference in linear expansion coefficient between itself and the flexure spring decreases. In addition, the ratio A2/A1 of an actual adhesion area A2 between the slider and a slider fixing portion of the flexure spring to a possible adhesion area A1 therebetween is reduced to 0.42 or less. Moreover, a temperature compensation member is adhered to the slider or the flexure spring.
摘要:
A head suspension assembly includes an arm and a suspension extending from the arm. The arm has an opening portion penetrating the arm. A trace is located on the arm and the suspension and extends opposite the opening portion. A radiator plate is attached to an outer surface of the trace and extends at least opposite the opening portion. A head IC is located in the opening portion and connected electrically to a wiring pattern of the trace.