公开(公告)号：US20170334933A1

公开(公告)日：2017-11-23

申请号：US15672145

申请日：2017-08-08

申请人： Kunio MORI ,  Yusuke MATSUNO ,  Katsuhito MORI ,  Takahiro KUDO ,  Shuukichi TAKII ,  Shigeru MICHIWAKI ,  Manabu MIYAWAKI ,  Masanori YANAI ,  Kouichi KAMIYAMA ,  Hitomi CHIBA ,  Yasuyuki MASUDA

发明人： Kunio MORI ,  Yusuke MATSUNO ,  Katsuhito MORI ,  Takahiro KUDO ,  Shuukichi TAKII ,  Shigeru MICHIWAKI ,  Manabu MIYAWAKI ,  Masanori YANAI ,  Kouichi KAMIYAMA ,  Hitomi CHIBA ,  Yasuyuki MASUDA

IPC分类号： C07F7/18

CPC分类号： C07F7/1804 ,  A61K31/53 ,  C07D251/70 ,  Y10T428/31678

摘要： A surface treatment agent including a compound (α) is provided. The compound (α) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.

公开(公告)号：US20130183406A1

公开(公告)日：2013-07-18

申请号：US13551783

申请日：2012-07-18

申请人： Yasuyuki MASUDA ,  Chifumi KAGA ,  Toshiaki ARIMURA

发明人： Yasuyuki MASUDA ,  Chifumi KAGA ,  Toshiaki ARIMURA

IPC分类号： A21D8/02

CPC分类号： A21D8/02 ,  A21D6/001 ,  A21D13/16

摘要： Provided is shaped frozen bread dough from which a baked bread product having favorable post-baked qualities (taste, texture, flavor, appearance (voluminousness), and the like) can be prepared using a commonly employed baking facility, without requiring a special facility for thawing and fermenting. A bread dough having a continuous, multi-layered structure is prepared by using a cereal flour composition containing yeast and an oil-and-fat composition (roll in oil-and-fat), the bread dough is formed into a desired shape, and then a dent is made on the surface of the thickest portion having the length which is 13% to 70% of the longitudinal length of the shaped article.

摘要翻译： 提供了一种成形冷冻面包面团，其中可以使用普遍使用的烘焙设备来制备具有良好后烘烤品质（味道，质地，风味，外观（体积）等）的烘烤面包产品，而不需要特殊设备 解冻和发酵。 通过使用包含酵母和油脂组合物（油脂中的卷）的谷物粉组合物制备具有连续多层结构的面团面团，将面包面团形成为期望的形状，并且 然后在长度为成形制品的纵向长度的13％至70％的最厚部分的表面上形成凹痕。

公开(公告)号：US20100006621A1

公开(公告)日：2010-01-14

申请号：US12564431

申请日：2009-09-22

申请人： Yasuyuki MASUDA ,  Yukio OZAKI ,  Jun MATSUEDA ,  Kazuyuki IKURA ,  Taizan KOBAYASHI ,  Toshinori KASUGA

发明人： Yasuyuki MASUDA ,  Yukio OZAKI ,  Jun MATSUEDA ,  Kazuyuki IKURA ,  Taizan KOBAYASHI ,  Toshinori KASUGA

IPC分类号： B23K3/00 ,  B23K20/10

CPC分类号： B23K20/10 ,  B23K2101/36 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/0401

摘要： An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.

摘要翻译： 一种用于制造电子装置的超声波接合装置，其包括填充在电子部件和基板之间的基板，电子部件和底部填充物，包括：头部，其包括构造成安装电子部件的工具表面;擦拭单元，其被配置为擦拭 通过在擦拭台上使用擦拭部件，将附着在头部的工具表面上的预固化底部填充物，超声波接合单元构造成将电子部件与基板超声波接合并将头部抵靠擦拭部件按压在 所述擦拭台被配置为当所述擦拭单元提供擦拭时检测施加在所述擦拭台上的擦拭构件和所述工具表面之间的第一压力;以及控制器，被配置为基于所述擦拭台控制由所述超声波接合单元施加的第二压力， 检测器的检测结果。

公开(公告)号：US20100038406A1

公开(公告)日：2010-02-18

申请号：US12564423

申请日：2009-09-22

申请人： Yasuyuki MASUDA ,  Yukio OZAKI ,  Jun MATSUEDA ,  Kazuyuki IKURA ,  Taizan KOBAYASHI ,  Toshinori KASUGA

发明人： Yasuyuki MASUDA ,  Yukio OZAKI ,  Jun MATSUEDA ,  Kazuyuki IKURA ,  Taizan KOBAYASHI ,  Toshinori KASUGA

IPC分类号： B23K1/06

CPC分类号： H01L24/75 ,  H01L24/12 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/0665 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.

摘要翻译： 超声波接合装置包括超声波接合单元和擦拭单元，其被构造成通过使用擦拭构件来擦拭已经粘附到头部的工具表面的预固化底部填充物。 超声波接合单元包括：第一驱动器，被配置为驱动头部将基板上的电子部件按压，以及超声波发生器。 擦拭单元包括用于擦除工具表面的擦拭台，用于将擦拭构件供给到擦拭台并卷起擦拭构件的进给机构，构造成容纳擦拭台和进给机构的盒，以及 第二驱动器，其被配置为在所述平面内驱动所述盒。 第一个驱动器被配置为将头部压在擦拭台上的擦拭构件上。

公开(公告)号：US20100006231A1

公开(公告)日：2010-01-14

申请号：US12564444

申请日：2009-09-22

申请人： Yasuyuki MASUDA ,  Yukio OZAKI ,  Jun MATSUEDA ,  Kazuyuki IKURA ,  Taizan KOBAYASHI ,  Toshinori KASUGA

发明人： Yasuyuki MASUDA ,  Yukio OZAKI ,  Jun MATSUEDA ,  Kazuyuki IKURA ,  Taizan KOBAYASHI ,  Toshinori KASUGA

IPC分类号： B32B37/00

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2224/7592 ,  H01L2224/81121 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/0401

摘要： An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

摘要翻译： 一种超声波接合装置，包括：头部，其包括被配置为安装电子部件的工具表面;超声波接合单元，其被配置为使所述电子部件与基板超声波结合;以及擦拭单元，其构造成擦除已经粘附到所述电子部件上的预固化底部填充物 通过在擦拭台上使用擦拭构件来使头部的工具表面。 擦拭单元包括：溶剂供给单元，被配置为将构成为将底部填充剂粉末化的溶剂供给到擦拭台上的擦拭部件;被配置为容纳擦拭台的密封盒;以及供给机构，其构造成将擦拭部件供给到擦拭部 并且从擦拭台卷起擦拭构件，以及盒支撑构件，其包括构造成驱动进给机构的马达，并且可拆卸地附接到卡盘。