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    Substrate processing apparatus
    2.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号：US08904955B2

    公开(公告)日：2014-12-09

    申请号：US12389431

    申请日：2009-02-20

    申请人： Makoto Nomura ,  Yukio Ozaki ,  Reizo Nunozawa ,  Satoru Takahata

    发明人： Makoto Nomura ,  Yukio Ozaki ,  Reizo Nunozawa ,  Satoru Takahata

    IPC分类号： C23C16/00 ,  H01L21/67

    CPC分类号： H01L21/67276

    摘要： A substrate processing apparatus includes a control unit executing a first recipe for substrate processing. After the substrate processing is completed through the execution of the first recipe, if a predetermined time is elapsed in a state that a next substrate to be processed is not carried into the process chamber, a second recipe is executed for maintaining a process chamber where the substrate is processed.

    摘要翻译： 基板处理装置包括执行用于基板处理的第一配方的控制单元。 在通过执行第一配方完成基板处理之后，如果在未处理下一个待处理基板的状态下经过预定时间，则执行第二配方以维持处理室 底物被处理。

    POSITION MEASURING APPARATUS AND COATING APPARATUS
    3.
    发明申请
    POSITION MEASURING APPARATUS AND COATING APPARATUS 审中-公开
    位置测量装置和涂装装置

    公开(公告)号：US20100174398A1

    公开(公告)日：2010-07-08

    申请号：US12651879

    申请日：2010-01-04

    申请人： Taizan Kobayashi ,  Yukio Ozaki ,  Toshinori Kasuga ,  Yasuyuki Masuda ,  Nobuaki Kawashima

    发明人： Taizan Kobayashi ,  Yukio Ozaki ,  Toshinori Kasuga ,  Yasuyuki Masuda ,  Nobuaki Kawashima

    IPC分类号： B25J13/08 ,  G01C3/00 ,  G06F17/00

    CPC分类号： H01L21/681 ,  H01L21/6715

    摘要： A position measuring apparatus includes a distance measuring part which obtains at least three pieces of distance information between at least three measurement points on a measured plane of an object and a displacement sensor, an imaging part which images a projection image on the measured plane of the object, and a calculating part which obtains tilt information of the measured plane based on the at least three distance information pieces and obtains position information of the object based on the tilt information and the projection image.

    摘要翻译： 一种位置测量装置，包括距离测量部分，其在物体的测量平面上的至少三个测量点与位移传感器之间获得至少三条距离信息，在所测量的平面上对投影图像进行成像的成像部件 对象和计算部分，其基于所述至少三个距离信息获取所测量的平面的倾斜信息，并且基于倾斜信息和投影图像获得对象的位置信息。

    SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    4.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    基板加工装置及制造半导体装置的方法

    公开(公告)号：US20100055808A1

    公开(公告)日：2010-03-04

    申请号：US12537455

    申请日：2009-08-07

    申请人： Yukio Ozaki ,  Reizo Nunozawa ,  Satoru Takahata

    发明人： Yukio Ozaki ,  Reizo Nunozawa ,  Satoru Takahata

    IPC分类号： H01L21/66 ,  B05C11/00

    CPC分类号： H01L22/34 ,  G05B19/418 ,  G05B2219/45031 ,  H01L21/67276 ,  H01L21/67288 ,  H01L22/26 ,  Y02P90/14 ,  Y02P90/20

    摘要： A substrate processing apparatus for executing a predetermined process on a substrate loaded into a process chamber by running a recipe containing a plurality of steps is provided. The recipe includes a process step of processing the substrate, and a leak check step executed before the process step to check whether a leak occurs inside the process chamber, and the substrate processing apparatus includes a main control unit configured to execute the process step while keeping an error that occurs in the leak check step.

    摘要翻译： 提供了一种用于通过运行包含多个步骤的配方在装载到处理室中的基板上执行预定处理的基板处理装置。 配方包括处理基板的处理步骤和在处理步骤之前执行的检查在处理室内是否发生泄漏的泄漏检查步骤，并且基板处理装置包括主控制单元，其被配置为在保持处理步骤的同时执行处理步骤 泄漏检查步骤中发生的错误。

    Digital radio broadcasting receiver and method of receiving digital radio broadcasting
    5.
    发明授权
    Digital radio broadcasting receiver and method of receiving digital radio broadcasting 失效
    数字无线电广播接收机和接收数字无线电广播的方法

    公开(公告)号：US07509103B2

    公开(公告)日：2009-03-24

    申请号：US11239015

    申请日：2005-09-30

    申请人： Yukio Ozaki

    发明人： Yukio Ozaki

    IPC分类号： H04B1/18

    CPC分类号： H04H40/18 ,  H04H20/28 ,  H04H60/47 ,  H04H60/73 ,  H04H60/74

    摘要： A digital radio broadcasting receiver capable of automatically setting an audio field of reproduced sound in response to a musical genre of an ongoing broadcasting composition is disclosed. Digital radio broadcasting receiver 1 is provided with tuner 2, audio data decoder 3, equalizer 4, parameter memory 5, additional program information decoder 7, genre data selector 8 and control CPU 6. Tuner 2 outputs audio data and additional program information and audio data decoder 3 decodes the audio data. Equalizer 4 adjusts frequency characteristics of the decoded audio data. Parameter memory 5 stores parameters for the frequency characteristics for each musical genre. Additional program data decoder 7 decodes additional program information. Genre data selector 8 selects musical genre data from the additional program information. Parameter memory 5 reads out the parameters to adjust frequency characteristics and provides the same to control CPU 6, which sends the same to equalizer 4.

    摘要翻译： 公开了一种数字无线电广播接收机，其能够响应于正在进行的广播组合的音乐风格自动设置再现的声音的音频场。 数字无线电广播接收机1设置有调谐器2，音频数据解码器3，均衡器4，参数存储器5，附加节目信息解码器7，类型数据选择器8和控制CPU 6.调谐器2输出音频数据和附加节目信息和音频数据 解码器3解码音频数据。 均衡器4调整解码音频数据的频率特性。 参数存储器5存储每个音乐类型的频率特性的参数。 附加节目数据解码器7解码附加节目信息。 类型数据选择器8从附加节目信息中选择音乐类型数据。 参数存储器5读出参数以调整频率特性，并将其提供给控制CPU 6，CPU6将其发送到均衡器4。

    Oscillating apparatus
    8.
    发明授权
    Oscillating apparatus 失效
    摆动装置

    公开(公告)号：US07218030B2

    公开(公告)日：2007-05-15

    申请号：US11182753

    申请日：2005-07-18

    申请人： Toshinori Kasuga ,  Yukio Ozaki

    发明人： Toshinori Kasuga ,  Yukio Ozaki

    IPC分类号： H01L41/09

    CPC分类号： B23K20/10 ,  B06B1/0253

    摘要： An oscillating apparatus includes a driver generating a waveform signal based on a stored data for specifying a waveform so as to output the waveform signal to a transducer. A detector detects a phase difference between electric voltage and current supplied to the transducer. A memory unit holds gain data reflecting a characteristic of the transducer. The gain data specify gains corresponding to respective phase differences. An arithmetic unit calculates the frequency of the waveform based on the phase difference detected at the detector and a gain included in the gain data. The oscillating apparatus enables determination of a gain suitable to the transducer in view of the characteristic of the transducer. The frequency of the waveform signal is allowed to follow the change in the resonant frequency in a shorter period. The oscillation can thus be kept well.

    摘要翻译： 振荡装置包括驱动器，基于用于指定波形的存储数据产生波形信号，以便将波形信号输出到换能器。 检测器检测提供给换能器的电压和电流之间的相位差。 存储单元保持反映换能器特性的增益数据。 增益数据指定对应于各个相位差的增益。 算术单元基于检测器检测到的相位差和增益数据中包含的增益来计算波形的频率。 考虑到换能器的特性，振荡装置能够确定适合换能器的增益。 允许波形信号的频率在较短的时间内跟随谐振频率的变化。 因此振荡可以保持良好。

    Ultrasonic head
    9.
    发明申请
    Ultrasonic head 审中-公开
    超声波头

    公开(公告)号：US20060113351A1

    公开(公告)日：2006-06-01

    申请号：US11105437

    申请日：2005-04-14

    申请人： Yukio Ozaki ,  Toshinori Kasuga

    发明人： Yukio Ozaki ,  Toshinori Kasuga

    IPC分类号： B23K20/12

    CPC分类号： B23K20/106 ,  B23K2101/40 ,  H01L24/75 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： An ultrasonic head 10a, which is used in an ultrasonic bonder for bonding an LSI chip and a substrate by using the ultrasonic vibration, includes: a protrusion 13a constituting a resonating apparatus 15 for contacting with the LSI chip and carrying out the ultrasonic vibration; a thermal conductive elastic body 17a placed on a surface of a main shaft 12 constituting the resonating apparatus 15; and a heater 16a which is placed on a surface of the thermal conductive elastic body 17a and produces a heat and gives the heat through the thermal conductive elastic body 17a and the main shaft 12 and protrusion 13a constituting the resonating apparatus 15 to a vicinity of a bonding portion between the LSI chip and the substrate.

    摘要翻译： 超声波头10a用于通过使用超声波振动来连接LSI芯片和基板的超声波焊接机中，包括：突起13a，其构成用于与LSI芯片接触并进行超声波振动的谐振装置15 ; 布置在构成谐振装置15的主轴12的表面上的导热弹性体17a; 以及加热器16a，其放置在导热性弹性体17a的表面上，并产生热量，并且通过导热弹性体17a和构成谐振装置15的主轴12和突起13a产生热量至 在LSI芯片和基板之间的接合部分附近。

    Method of flip-chip bonding
    10.
    发明申请
    Method of flip-chip bonding 审中-公开
    倒装芯片接合方法

    公开(公告)号：US20060097029A1

    公开(公告)日：2006-05-11

    申请号：US11062959

    申请日：2005-02-23

    申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Yukio Ozaki

    发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Yukio Ozaki

    IPC分类号： B23K1/06

    CPC分类号： B23K20/10 ,  B23K1/0016 ,  B23K2101/40

    摘要： A method of flip-chip bonding can favorably activate the bonding surfaces and remove oxide films when bonding pads and bumps of a semiconductor chip and a substrate and avoids problems such as the bumps being excessively flattened and the bonds between connection terminals being destroyed by subsequent ultrasonic vibration. The method includes an aligning step 2 that aligns and places in contact bumps or pads of a semiconductor chip and pads or bumps of a substrate, a leveling step 4 that levels the shapes of the bumps by pressing together the semiconductor chip and the substrate with a first predetermined load, a bonding preparation step 6 that applies ultrasonic vibration to the semiconductor chip and/or the substrate so that the amplitude of the ultrasonic vibration gradually increases while the first predetermined load weakens, and a bonding step 8 that bonds the bumps and pads by applying ultrasonic vibration to the semiconductor chip and/or the substrate in a state where the semiconductor chip and the substrate are pressed together with a second predetermined load that is smaller than the first predetermined load.

    摘要翻译： 倒装芯片接合的方法可以有利地激活接合表面并且在接合半导体芯片和基板的焊盘和凸点时去除氧化膜，并且避免诸如凸块过度平坦的问题，并且连接端子之间的接合被随后的超声波破坏 振动。 该方法包括：对准步骤2，其对准和放置在半导体芯片的接触凸块或焊盘以及衬底的焊盘或凸块;调平步骤4，其通过将半导体芯片和衬底压在一起来调整凸块的形状 第一预定负载，对半导体芯片和/或基板施加超声波振动的接合准备步骤6，使得当第一预定负载变弱时超声波振动的幅度逐渐增加;以及接合步骤8，其将凸块和焊盘 通过在半导体芯片和基板以比第一预定负载小的第二预定负载被压在一起的状态下，向半导体芯片和/或基板施加超声波振动。