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公开(公告)号:US09313900B2
公开(公告)日:2016-04-12
申请号:US13638716
申请日:2010-04-02
申请人: Kwang Choon Chung , Young-Koo Han , Myung-Bong Yoo , Nam-Boo Cho , Young-Ho Han , Kyong-Min Lee , Kwang-Baek Yoon , Hee-Yong Ahn , Su-Han Kim
发明人: Kwang Choon Chung , Young-Koo Han , Myung-Bong Yoo , Nam-Boo Cho , Young-Ho Han , Kyong-Min Lee , Kwang-Baek Yoon , Hee-Yong Ahn , Su-Han Kim
CPC分类号: H05K3/427 , H05K3/0094 , H05K3/06 , H05K3/105 , H05K3/12 , H05K3/246 , H05K2203/121 , Y10T29/49155
摘要: Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.
摘要翻译: 公开了一种通过印刷导电浆料制造具有电路图案的双面印刷电路板(PCB)的方法。 根据本发明的方法,可以形成精确且高导电性的电路图案,并且可以减少原材料和简化工艺。 此外,由于导电膏的印刷,即使导电层弯曲或暴露于热或物理冲击,也可以防止短路。
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公开(公告)号:US20130056250A1
公开(公告)日:2013-03-07
申请号:US13638716
申请日:2010-04-02
申请人: Kwang Choon Chung , Young-Koo Han , Myung-Bong Yoo , Nam-Boo Cho , Young-Ho Han , Kyong-Min Lee , Kwang-Baek Yoon , Hee-Yong Ahn , Su-Han Kim
发明人: Kwang Choon Chung , Young-Koo Han , Myung-Bong Yoo , Nam-Boo Cho , Young-Ho Han , Kyong-Min Lee , Kwang-Baek Yoon , Hee-Yong Ahn , Su-Han Kim
CPC分类号: H05K3/427 , H05K3/0094 , H05K3/06 , H05K3/105 , H05K3/12 , H05K3/246 , H05K2203/121 , Y10T29/49155
摘要: Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.
摘要翻译: 公开了一种通过印刷导电浆料制造具有电路图案的双面印刷电路板(PCB)的方法。 根据本发明的方法,可以形成精确且高导电性的电路图案,并且可以减少原材料和简化工艺。 此外,由于导电膏的印刷,即使当导电层弯曲或暴露于热或物理冲击时也可以防止短路。
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