公开(公告)号：US07221045B2

公开(公告)日：2007-05-22

申请号：US11133613

申请日：2005-05-20

申请人： Kwang-suk Park ,  Jung-do Kim

发明人： Kwang-suk Park ,  Jung-do Kim

IPC分类号： H01L23/495

CPC分类号： H01L23/49582 ,  H01L23/49548 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/81024 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014

摘要： A flip chip semiconductor device having an improved structure and a method of manufacturing the flip chip semiconductor device, in which a semiconductor chip can be more securely joined to a lead frame while preventing contact defects between the two. The flip chip semiconductor device includes: a semiconductor chip having electrode pads formed on one side; conductive bumps formed on the electrode pads of the semiconductor chip; and a lead frame including a plurality of leads, the ends of which are electrically connected to the conductive bumps, wherein each of the leads has at least one groove formed thereon, and a solder plating layer is provided on the leads in and about the groove and melted to secure the connection with the conductive bumps.

摘要翻译： 具有改进的结构的倒装芯片半导体器件和制造倒装芯片半导体器件的方法，其中半导体芯片可以更牢固地接合到引线框架，同时防止两者之间的接触缺陷。 所述倒装芯片半导体器件包括：具有形成在一侧的电极焊盘的半导体芯片; 形成在半导体芯片的电极焊盘上的导电凸块; 以及引线框架，其包括多个引线，其端部电连接到所述导电凸块，其中每个所述引线具有形成在其上的至少一个沟槽，并且在所述引线中并且围绕所述沟槽设置焊料镀层 并熔化以固定与导电凸块的连接。

公开(公告)号：US20060049517A1

公开(公告)日：2006-03-09

申请号：US11133613

申请日：2005-05-20

申请人： Kwang-suk Park ,  Jung-do Kim

发明人： Kwang-suk Park ,  Jung-do Kim

IPC分类号： H01L21/48 ,  H01L23/52

CPC分类号： H01L23/49582 ,  H01L23/49548 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/81024 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014

摘要： A flip chip semiconductor device having an improved structure and a method of manufacturing the flip chip semiconductor device, in which a semiconductor chip can be more securely joined to a lead frame while preventing contact defects between the two. The flip chip semiconductor device includes: a semiconductor chip having electrode pads formed on one side; conductive bumps formed on the electrode pads of the semiconductor chip; and a lead frame including a plurality of leads, the ends of which are electrically connected to the conductive bumps, wherein each of the leads has at least one groove formed thereon, and a solder plating layer is provided on the leads in and about the groove and melted to secure the connection with the conductive bumps.

摘要翻译： 具有改进的结构的倒装芯片半导体器件和制造倒装芯片半导体器件的方法，其中半导体芯片可以更牢固地接合到引线框架，同时防止两者之间的接触缺陷。 所述倒装芯片半导体器件包括：具有形成在一侧的电极焊盘的半导体芯片; 形成在半导体芯片的电极焊盘上的导电凸块; 以及引线框架，其包括多个引线，其端部电连接到所述导电凸块，其中每个所述引线具有形成在其上的至少一个沟槽，并且在所述引线中并且围绕所述沟槽设置焊料镀层 并熔化以固定与导电凸块的连接。