Method of fabricating a flash memory device

    公开(公告)号:US07303957B2

    公开(公告)日:2007-12-04

    申请号:US11517254

    申请日:2006-09-08

    IPC分类号: H01L21/336

    CPC分类号: H01L27/115 H01L27/11521

    摘要: A method of fabricating a flash memory device using a process for forming a self-aligned floating gate is provided. The method comprises forming mask patterns on a substrate, etching the substrate using the mask patterns as an etch mask to form a plurality of trenches, and filling the trenches with a first insulating layer, wherein sidewalls of the mask patterns remain exposed after filling the trenches with the first insulating layer. The method further comprises forming spacers on the exposed sidewalls of the mask patterns, filling upper insulating spaces with a second insulating layer thereby defining isolation layers, and removing the mask patterns and the spacers.

    Method of fabricating a flash memory device
    2.
    发明申请
    Method of fabricating a flash memory device 失效
    制造闪存器件的方法

    公开(公告)号:US20070059876A1

    公开(公告)日:2007-03-15

    申请号:US11517254

    申请日:2006-09-08

    IPC分类号: H01L21/8238

    CPC分类号: H01L27/115 H01L27/11521

    摘要: A method of fabricating a flash memory device using a process for forming a self-aligned floating gate is provided. The method comprises forming mask patterns on a substrate, etching the substrate using the mask patterns as an etch mask to form a plurality of trenches, and filling the trenches with a first insulating layer, wherein sidewalls of the mask patterns remain exposed after filling the trenches with the first insulating layer. The method further comprises forming spacers on the exposed sidewalls of the mask patterns, filling upper insulating spaces with a second insulating layer thereby defining isolation layers, and removing the mask patterns and the spacers.

    摘要翻译: 提供了一种使用用于形成自对准浮动栅极的工艺来制造闪速存储器件的方法。 该方法包括在衬底上形成掩模图案,使用掩模图案蚀刻衬底作为蚀刻掩模以形成多个沟槽,并用第一绝缘层填充沟槽,其中掩模图案的侧壁在填充沟槽之后保持暴露 与第一绝缘层。 该方法还包括在掩模图案的暴露的侧壁上形成间隔物,用第二绝缘层填充上绝缘空间,从而限定隔离层,以及去除掩模图案和间隔物。