MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME
    1.
    发明申请
    MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME 有权
    包括其的存储器件和存储器系统

    公开(公告)号:US20120042116A1

    公开(公告)日:2012-02-16

    申请号:US13210591

    申请日:2011-08-16

    IPC分类号: G06F12/00 G06F12/02

    CPC分类号: G06F13/4086

    摘要: A memory device includes an interface unit and a memory unit. The interface unit receives a clock signal, a command signal and a data signal, internally adjusts input impedance based upon at least one of the command signal and the clock signal, and generates internal control signal of the memory device based upon the command signal and data signal. The memory unit performs read/write operations based upon the internal control signal.

    摘要翻译: 存储装置包括接口单元和存储单元。 接口单元接收时钟信号,命令信号和数据信号,根据命令信号和时钟信号中的至少一个在内部调整输入阻抗,并根据命令信号和数据产生存储器件的内部控制信号 信号。 存储单元基于内部控制信号执行读/写操作。

    Memory device and memory system including the same
    2.
    发明授权
    Memory device and memory system including the same 有权
    存储器件和存储器系统包括相同的

    公开(公告)号:US09218312B2

    公开(公告)日:2015-12-22

    申请号:US13210591

    申请日:2011-08-16

    IPC分类号: G06F12/00 G06F13/40

    CPC分类号: G06F13/4086

    摘要: A memory device includes an interface unit and a memory unit. The interface unit receives a clock signal, a command signal and a data signal, internally adjusts input impedance based upon at least one of the command signal and the clock signal, and generates internal control signal of the memory device based upon the command signal and data signal. The memory unit performs read/write operations based upon the internal control signal.

    摘要翻译: 存储装置包括接口单元和存储单元。 接口单元接收时钟信号,命令信号和数据信号,根据命令信号和时钟信号中的至少一个在内部调整输入阻抗,并根据命令信号和数据产生存储器件的内部控制信号 信号。 存储单元基于内部控制信号执行读/写操作。

    Semiconductor packages
    3.
    发明授权
    Semiconductor packages 有权
    半导体封装

    公开(公告)号:US08618540B2

    公开(公告)日:2013-12-31

    申请号:US13118948

    申请日:2011-05-31

    IPC分类号: H01L23/58

    摘要: Provided are a semiconductor package, a semiconductor memory module including the semiconductor package, and a system including the semiconductor memory module. The semiconductor package may include a plurality of main terminals arranged on a surface of the semiconductor package with constant intervals, and the plurality of main terminals may include terminals of a first set including a plurality of input/output terminals to which test signals may be input, and terminals of a second set including a plurality of input/output terminals to/from which signals other than the test signals may be input/output.

    摘要翻译: 提供半导体封装,包括半导体封装的半导体存储器模块和包括半导体存储器模块的系统。 半导体封装可以包括以恒定间隔布置在半导体封装的表面上的多个主端子,并且多个主端子可以包括包括可以输入测试信号的多个输入/输出端子的第一组的端子 ,以及可以输入/输出除了测试信号之外的信号的多个输入/输出端子的第二组的端子。

    Method of multi-processing object using polygon mirror
    4.
    发明授权
    Method of multi-processing object using polygon mirror 有权
    使用多面镜的多处理对象的方法

    公开(公告)号:US07713780B2

    公开(公告)日:2010-05-11

    申请号:US11902602

    申请日:2007-09-24

    IPC分类号: H01L21/44

    摘要: A method of multi-processing an object using a polygon mirror according to an embodiment of the invention includes setting processing parameters for individual layers of an object having a multilayer structure, performing laser processing on exposed layers in a region to be processed of the object according to the processing parameters using a polygon mirror, determining whether or not all of the layers of the object having a multilayer structure are processed, and if it is determined in the determining that not all of the layers are processed, progressing the performing of laser processing. Therefore, efficiency in processing the object can be increased, and cracks that occur in the object during laser processing using a polygon mirror can be minimized.

    摘要翻译: 根据本发明的实施例的使用多面镜对物体进行多处理的方法包括设置具有多层结构的物体的各层的处理参数,对待处理的物体的区域中的暴露层进行激光处理, 涉及使用多面镜的处理参数,确定是否处理具有多层结构的对象的所有层,并且如果确定不是所有的层都被处理,则进行激光加工的执行 。 因此,能够提高加工对象物的效率,能够使使用多面镜的激光加工时的物体发生的裂缝最小化。

    Laser processing apparatus
    6.
    发明授权
    Laser processing apparatus 有权
    激光加工设备

    公开(公告)号:US07688492B2

    公开(公告)日:2010-03-30

    申请号:US11578373

    申请日:2004-06-02

    IPC分类号: G02B26/08

    摘要: Disclosed is a laser processing apparatus for minimizing generation of sludge and enhancing the processing efficiency while processing an object. The laser processing apparatus includes a beam irradiator for emitting a laser beam from a laser light source, a beam scanner for operating the laser beam emitted from the beam scanner, to be irradiated on a predetermined interval of a processing position of the object repeatedly on the straight, and a condensing lens for regulating a focus of the laser beam emitted from the beam irradiator. The object is movable at least once along a processing direction during processing the object. According to the present invention, it is able to improve the processing efficiency and to work an object with a uniform morphology by using a mask filtering a laser beam irradiated at a rotation turning point of a beam scanning mirror, capable of continuously irradiating a laser beam by deforming the laser beam into an elliptical pattern.

    摘要翻译: 公开了一种用于在处理物体的同时最小化污泥的产生和提高处理效率的激光加工装置。 激光加工装置包括用于从激光源发射激光束的光束照射器,用于操作从光束扫描器发射的激光束的光束扫描器,以在物体的反复处理位置的预定间隔上照射 以及用于调节从光束照射器发射的激光束的焦点的聚光透镜。 该物体在处理物体期间沿着处理方向可移动至少一次。 根据本发明,通过使用照射在光束扫描镜的旋转转折点处的激光束进行掩模过滤,能够提高处理效率并且对具有均匀形态的物体进行加工,能够连续照射激光束 通过使激光束变形为椭圆形图案。