公开(公告)号：US08276280B2

公开(公告)日：2012-10-02

申请号：US12539423

申请日：2009-08-11

申请人： Kyung Suk Lee ,  Hyo Cher Kim ,  Hye Seon Chae ,  U Suk Park ,  Kyung Ran Kim ,  Ki Hwan Jin ,  Kwan Woo Kim ,  Yoon Jeong Baek ,  Dae Sop Lim ,  Soon Yean Jung

发明人： Kyung Suk Lee ,  Hyo Cher Kim ,  Hye Seon Chae ,  U Suk Park ,  Kyung Ran Kim ,  Ki Hwan Jin ,  Kwan Woo Kim ,  Yoon Jeong Baek ,  Dae Sop Lim ,  Soon Yean Jung

IPC分类号： B26B13/00 ,  B26B15/00 ,  H01H3/02 ,  H01H9/00

CPC分类号： A01G3/037

摘要： The present invention provides electric pruning shears which can improve operation convenience by increasing the operating speed and eliminating hand fatigue during pruning of fruit trees.For this purpose, the present invention provides electric pruning shears which can improve safety during handling by implementing a new type of switching means having a separate safety switch capable of being separated from a main body and put on a user's finger and reduce the volume and weight by reducing the number of parts associated with the safety switch. Moreover, the present invention provides electric pruning shears which control a motor to be reversely rotated when there is an abnormality in blades of the electric pruning shears during a pruning operation, thus escaping from the overall abnormality including motor damage.

摘要翻译： 本发明提供电动修枝剪，其可以通过提高果树的修剪时的操作速度和消除手部疲劳来提高操作方便性。 为此目的，本发明提供电动修枝剪，其可通过实施具有独立安全开关的新型开关装置来提高处理过程中的安全性，该安全开关能够与主体分离并放置在使用者的手指上并减小体积和重量 通过减少与安全开关相关联的部件数量。 此外，本发明提供一种电动修枝剪，其在修剪操作期间当电动修枝剪的叶片发生异常时，控制马达反向旋转，从而脱离包括马达损坏的整体异常。

公开(公告)号：US20110139347A1

公开(公告)日：2011-06-16

申请号：US12992079

申请日：2009-05-14

申请人： Se Ra Kim ,  Yoon Jeong Baek ,  Jang Soon Kim ,  Jae Kwan Lee ,  Hyun Woo Park

发明人： Se Ra Kim ,  Yoon Jeong Baek ,  Jang Soon Kim ,  Jae Kwan Lee ,  Hyun Woo Park

IPC分类号： C08F220/28 ,  C09J7/02 ,  B32B33/00 ,  B32B38/00

CPC分类号： C09J7/22 ,  C08F220/14 ,  C08F220/18 ,  C09J4/06 ,  C09J7/38 ,  C09J133/04 ,  C09J133/08 ,  C09J133/10 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2423/006 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2475/006 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/1476 ,  Y10T428/264 ,  Y10T428/266 ,  Y10T428/2891 ,  C08F2220/1808 ,  C08F2220/1825 ,  C08F2220/281

摘要： The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobonyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobonyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

摘要翻译： 本发明涉及一种压敏粘合剂组合物，其包含含有（甲基）丙烯酸异冰片的单体混合物的聚合物，压敏粘合片和半导体晶片背景研磨法。 在本发明中，通过使用作为硬质单体的（甲基）丙烯酸异冰片酯，亲水性低的粘合剂组合物，相对于晶片具有优异的脱模性，再脱离性和润湿性， 优异的防ing ing性能; 使用该压敏粘合剂组合物制备的压敏粘合片; 并且可以提供使用该压敏粘合片的背面研磨方法。