公开(公告)号：US08287670B2

公开(公告)日：2012-10-16

申请号：US12702190

申请日：2010-02-08

申请人： Kyung-Soo Kim ,  Taeyoung Jang ,  Chang-Wan Ha

发明人： Kyung-Soo Kim ,  Taeyoung Jang ,  Chang-Wan Ha

IPC分类号： B32B37/00

CPC分类号： B32B37/10 ,  B23K20/10 ,  B23K2101/42 ,  B32B37/00 ,  B32B37/12 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2309/12 ,  B32B2457/00 ,  C09J5/06 ,  C09J2203/326 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L41/0906 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/2989 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83095 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/19043 ,  H05K3/323 ,  H05K2203/0285 ,  H05K2203/0292 ,  H01L2924/00 ,  H01L2224/0401

摘要： Disclosed is an electronic component bonding method which interposes a bonding resin between first and second electronic components to bond the first and second electronic components to each other. The electronic component bonding method includes providing the bonding resin between the first and second electronic components, aligning the first and second electronic components with each other, pre-curing the bonding resin to generate elasticity in the bonding resin, performing a main curing operation to apply vibration energy to the bonding resin, which has elasticity according to pre-curing, to securely fix the first and second electronic component to each other, and control the amplitude of the vibration energy applied during the main curing operation to be restricted within an elastic region of the bonding resin.

摘要翻译： 公开了一种电子部件接合方法，其将第一和第二电子部件之间的接合树脂插入以将第一和第二电子部件彼此接合。 电子部件接合方法包括在第一和第二电子部件之间设置接合树脂，使第一和第二电子部件彼此对准，预先固化接合树脂以在接合树脂中产生弹性，执行主要固化操作以应用 对于根据预固化具有弹性的粘合树脂的振动能量将第一和第二电子部件彼此牢固地固定，并且控制在主固化操作期间施加的振动能量的幅度被限制在弹性区域内 的粘合树脂。