摘要:
Disclosed is a nozzle for cold spray and a cold spray apparatus using the same. The nozzle for cold spray includes a hollow-type nozzle section. The nozzle section includes a convergence inlet section in which the cross-sectional area is converging, a throat area connected to the convergence end point of the inlet section, and an outlet section connected to the end point of the throat area. The nozzle for cold spray is provided with a spray tube located inside the convergence inlet section, the spray tube having a spray hole formed at its end point in such a way as to be placed at the throat area or the outlet section beyond the throat area. The speed of the powder flow at the outlet end point of the outlet section reaches 300-1,200 m/s.
摘要:
The present invention relates to an electro-static chuck with non-sintered AlN and a method of preparing the same. Especially, the present invention relates to the electro-static chuck with non-sintered AlN which having coated aluminum nitride (AlN) layer as a dielectric one on the purpose of chucking the wafers in the process of wafers and a method of preparing the same. The electro-static chuck of the present invention has excellent dielectric characteristics, bonding strength and thermal conductivity by forming an AlN layer as a dielectric one without sintering process or bonding process with binders.
摘要:
Graphene electronic devices may include a gate electrode on a substrate, a first gate insulating film covering the gate electrode, a plurality of graphene channel layers on the substrate, a second gate insulating film between the plurality of graphene channel layers, and a source electrode and a drain electrode connected to both edges of each of the plurality of graphene channel layers.
摘要:
A semiconductor probe having an embossed resistive tip and a method of fabricating the semiconductor probe are provided. The semiconductor probe includes a protrusion portion protruded to a predetermined height on a cantilever in a first direction crossing a length direction of the cantilever, an embossed resistive tip formed on the protrusion portion, and first and second semiconductor electrode regions formed at opposite sides of the embossed resistive tip at the protrusion portion, wherein the cantilever is doped with a first dopant, the first and second semiconductor electrode regions and the embossed resistive tip are doped with a second dopant having a different polarity from the first dopant, and the embossed resistive tip is doped with a concentration lower than the first and second semiconductor electrode regions.
摘要:
In a semiconductor device including graphene, a gate insulating layer may be formed between a gate electrode and a graphene layer, and an interlayer insulating layer may be formed under a portion of the graphene layer under which the gate insulating layer is not formed. The gate insulating layer may include a material that has higher dielectric permittivity than the interlayer insulating layer.
摘要:
In a semiconductor device including graphene, a gate insulating layer may be formed between a gate electrode and a graphene layer, and an interlayer insulating layer may be formed under a portion of the graphene layer under which the gate insulating layer is not formed. The gate insulating layer may include a material that has higher dielectric permittivity than the interlayer insulating layer.
摘要:
Graphene electronic devices may include a gate electrode on a substrate, a first gate insulating film covering the gate electrode, a plurality of graphene channel layers on the substrate, a second gate insulating film between the plurality of graphene channel layers, and a source electrode and a drain electrode connected to both edges of each of the plurality of graphene channel layers.
摘要:
A method and an apparatus are provided for generating an (4,20) RLL modulation code having a decreased detectible window width and an increased recording density ratio. The code's spectrum is concentrated in the low-frequency band, thereby improving the signal-to-noise ratio. In addition, the hardware of an encoder and a decoder can be easily implemented since the modulation code has a fixed codeword length.