公开(公告)号：US12031553B2

公开(公告)日：2024-07-09

申请号：US17650092

申请日：2022-02-07

Applicant: L3Harris Technologies, Inc.

Inventor： Charles Weirick ,  Voi Nguyen

IPC: F04D33/00 ,  H05K1/02 ,  F28F13/10 ,  H01F7/02 ,  H01F7/06 ,  H01F7/126 ,  H01F7/13 ,  H01F41/02 ,  H05K7/20

CPC classification number: F04D33/00 ,  H05K1/0209 ,  F28F13/10 ,  H01F7/0273 ,  H01F7/06 ,  H01F2007/068 ,  H01F7/126 ,  H01F7/13 ,  H01F41/0253 ,  H05K7/20172 ,  H05K2201/08

Abstract: An electronic device may include an electronic circuit, a heat sink thermally coupled to the electronic circuit, and spaced apart cooling fins extending from the heat sink. Each cooling fin includes a circuit board and a cooling device mounted thereon. The cooling device may have a conductive trace layer on the circuit board defining an electromagnet, a mounting member extending upwardly from the circuit board, a fan blade coupled to an upper end of the mounting member to be movable in a rocking motion about an axis defined by the mounting member, and a permanent magnet carried by the fan blade and responsive to the electromagnet.