公开(公告)号：US12101873B2

公开(公告)日：2024-09-24

申请号：US17660618

申请日：2022-04-25

Applicant: Microsoft Technology Licensing, LLC

Inventor： Jaejin Lee ,  Edward Charles Leacock ,  Charbel Khawand

IPC: G06F1/16 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0218 ,  G06F1/1681 ,  H05K1/0216 ,  H05K1/0393 ,  H05K1/18 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/08 ,  H05K2201/083

Abstract: An FPC cable assembly is provided that includes a first ground layer, a second ground layer, and at least one signal line sandwiched by the first and second ground layers. The FPC cable assembly further includes an electromagnetic shielding structure including a first magnetic layer at least partially covering and electrically grounded to the first ground layer, a second magnetic layer at least partially covering and electrically grounded to the second ground layer, and a plurality of magnetic rings magnetically engaged with and electrically contacting the first magnetic layer and the second magnetic layer so as to surround the first and second ground layers, the at least one signal line, and the first and second magnetic layers, thereby providing electromagnetic shielding of the at least one signal line.

公开(公告)号：US20230378687A1

公开(公告)日：2023-11-23

申请号：US18031086

申请日：2021-12-08

Applicant: LG Energy Solution, Ltd.

Inventor： Sang Ok Seon

IPC: H01R13/62 ,  H01R12/79 ,  H01R12/77 ,  H05K1/11

CPC classification number: H01R13/6205 ,  H01R12/79 ,  H01R12/771 ,  H05K1/117 ,  H05K2201/08

Abstract: A connection structure according to an embodiment disclosed in the present disclosure includes: a first connection part provided on a surface of a first member, the first member including at least one conductor pattern; and a second connection part provided on a surface of a second member, the second member having at least one conductive pad formed on a surface thereof and configured to be coupled to a surface of the first connection part by a magnetic force so that at least one conductor pattern and at least one conductive pad are electrically connected to each other.

公开(公告)号：US20190219542A1

公开(公告)日：2019-07-18

申请号：US16216858

申请日：2018-12-11

Applicant: Exxam Systems, LLC

Inventor： Paul Lott ,  Yuan Ji

IPC: G01N27/82 ,  H05K1/16 ,  G01M3/40 ,  G01R33/02 ,  G01R33/00

CPC classification number: G01N27/82 ,  G01M3/40 ,  G01R33/0094 ,  G01R33/02 ,  H05K1/165 ,  H05K2201/08

Abstract: Apparatuses and methods for inspecting a section of pipe are disclosed. The apparatuses includes a handheld pipeline inspection tool that includes a planar excitation coil within a pad and an array of magnetometers disposed within a box attached to the pad. The excitation coil is formed from a plurality of loops of conductive traces printed on printed circuit board within the pad and the excitation coil is energized with an alternating current received from a power source within the box. The energized excitation coil generates a magnetic field that interacts with the section of pipe and the magnetometer array is used to detect variations in the magnetic field due to the presence of defects within the section of pipe.

公开(公告)号：US20170350751A1

公开(公告)日：2017-12-07

申请号：US15240277

申请日：2016-08-18

Applicant: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： XIAO-HU TANG ,  PEI LIU

IPC: G01J1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K1/02

CPC classification number: G01J1/18 ,  G01V8/20 ,  H05K1/0274 ,  H05K1/0275 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10234

Abstract: A security device in an electronic device which protects against unauthorized disassembly includes light sources, a plurality of photosensitive elements, a detection unit, a storage unit, a processor, and light guiding devices. Light conducting channels are provided between the light sources and the induction elements. Barrier objects that block light are installed at certain first light guiding channels of the light guiding channels, and are removed from the first light conducting channels when the electronic device is disassembled, so that induction signals output by the photosensitive elements are changed from the model or original digitally-recorded signals.

公开(公告)号：US12031553B2

公开(公告)日：2024-07-09

申请号：US17650092

申请日：2022-02-07

Applicant: L3Harris Technologies, Inc.

Inventor： Charles Weirick ,  Voi Nguyen

IPC: F04D33/00 ,  H05K1/02 ,  F28F13/10 ,  H01F7/02 ,  H01F7/06 ,  H01F7/126 ,  H01F7/13 ,  H01F41/02 ,  H05K7/20

CPC classification number: F04D33/00 ,  H05K1/0209 ,  F28F13/10 ,  H01F7/0273 ,  H01F7/06 ,  H01F2007/068 ,  H01F7/126 ,  H01F7/13 ,  H01F41/0253 ,  H05K7/20172 ,  H05K2201/08

Abstract: An electronic device may include an electronic circuit, a heat sink thermally coupled to the electronic circuit, and spaced apart cooling fins extending from the heat sink. Each cooling fin includes a circuit board and a cooling device mounted thereon. The cooling device may have a conductive trace layer on the circuit board defining an electromagnet, a mounting member extending upwardly from the circuit board, a fan blade coupled to an upper end of the mounting member to be movable in a rocking motion about an axis defined by the mounting member, and a permanent magnet carried by the fan blade and responsive to the electromagnet.

公开(公告)号：US11764686B1

公开(公告)日：2023-09-19

申请号：US17580206

申请日：2022-01-20

Applicant: Vicor Corporation

Inventor： Patrizio Vinciarelli

IPC: H01H47/00 ,  H02M3/335 ,  H05K1/18 ,  H05K1/02 ,  H05K1/16 ,  H05K3/02 ,  H01F27/28 ,  H01F41/04 ,  H02M3/337 ,  H02M1/44 ,  H01F1/44 ,  H01F3/10 ,  H05K3/00 ,  H02M1/00

CPC classification number: H02M3/33523 ,  H01F1/44 ,  H01F3/10 ,  H01F27/2804 ,  H01F41/041 ,  H02M1/44 ,  H02M3/3376 ,  H02M3/33561 ,  H02M3/33592 ,  H05K1/0298 ,  H05K1/165 ,  H05K1/181 ,  H05K3/0011 ,  H05K3/02 ,  H01F1/447 ,  H01F2003/106 ,  H01F2027/2809 ,  H01F2027/2819 ,  H02M1/008 ,  H02M1/0058 ,  H05K1/0204 ,  H05K1/0265 ,  H05K2201/08 ,  H05K2201/086

Abstract: A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

公开(公告)号：US20170188455A1

公开(公告)日：2017-06-29

申请号：US14998263

申请日：2015-12-26

Applicant: Intel Corporation

Inventor： Yoshihiro Tomita ,  Joshua D. Heppner ,  Shawna M. Liff ,  Pramod Malatkar

IPC: H05K1/03 ,  H05K1/18 ,  A41D13/00 ,  H05K3/00 ,  A41D1/00 ,  A43B3/00 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K1/0393 ,  A41D1/002 ,  A41D13/0015 ,  A43B1/0054 ,  A43B3/0005 ,  H05K1/03 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/007 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/0203 ,  H05K2201/0215 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2203/0152 ,  H05K2203/104

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

公开(公告)号：US09544989B2

公开(公告)日：2017-01-10

申请号：US14945073

申请日：2015-11-18

Applicant: CYNTEC CO., LTD.

Inventor： Chih-Tse Chen ,  Joseph D. S. Deng ,  Shih-Hsien Tseng

IPC: H01H9/28 ,  H05K5/00 ,  H05K1/02 ,  H05K9/00 ,  H05K1/00 ,  H05K7/00 ,  H05K1/11 ,  H05K1/18 ,  H02B5/00

CPC classification number: H05K1/0216 ,  H05K1/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/111 ,  H05K1/181 ,  H05K5/00 ,  H05K5/0026 ,  H05K7/00 ,  H05K9/0022 ,  H05K2201/08 ,  H05K2201/1003

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.

Abstract translation: 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 任何两个相邻的以太网变压器分别布置有具有第二特定长度的间隙。

公开(公告)号：US20160007475A1

公开(公告)日：2016-01-07

申请号：US14771590

申请日：2014-03-04

Applicant: D.R.E.T. TECHNOLOGY SAGL

Inventor： Davide ZANESI

IPC: H05K3/00 ,  B41J2/01 ,  H05K1/18 ,  H05K1/09 ,  H05K1/03 ,  B41F15/00 ,  H05K1/02

CPC classification number: H05K3/0064 ,  B41F15/00 ,  B41J2/01 ,  H05K1/0271 ,  H05K1/0283 ,  H05K1/0326 ,  H05K1/038 ,  H05K1/09 ,  H05K1/189 ,  H05K3/1208 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/08 ,  H05K2203/1366

Abstract: The present invention relates to the very innovative field of smart textiles. More particularly the present invention discloses an innovative process for screen printing of textile substrates, by means of primers, for depositing on said substrates dielectric, conductive, resistive, magnetic, electroluminescent materials and many others.

Abstract translation: 本发明涉及智能纺织品非常创新的领域。 更具体地，本发明公开了一种用于通过底漆丝网印刷纺织品基底的创新方法，用于沉积在所述基底电介质，导电，电阻，磁性，电致发光材料等上。

公开(公告)号：US20150302964A1

公开(公告)日：2015-10-22

申请号：US14687040

申请日：2015-04-15

Applicant: Electroninks Writeables, Inc.

Inventor： Michael A. Bell ,  Analisa Russo

IPC: H01F7/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01F7/0252 ,  H05K1/0386 ,  H05K1/11 ,  H05K1/181 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/08 ,  H05K2201/10234 ,  H05K2201/10265 ,  H05K2203/104

Abstract: An electrical component for attachment to paper and other substrates comprises, according to one embodiment, a functional electronic part including one or more support pillars on an underside thereof. Each of the support pillars comprises: a channel extending therethrough from a top opening to a bottom opening, where the top opening of the channel is adjacent to the functional electronic part; and a magnet moveably positioned in the channel in electrical contact with the functional electronic part, where the bottom opening of the channel has a width smaller than a maximum lateral dimension of the magnet.

Abstract translation: 根据一个实施例，用于附接到纸和其它基底的电气部件包括在其下侧上包括一个或多个支撑柱的功能电子部件。 每个支撑柱包括：从顶部开口延伸到底部开口的通道，其中通道的顶部开口与功能电子部件相邻; 以及可移动地定位在所述通道中的与所述功能电子部件电接触的磁体，其中所述通道的底部开口具有小于所述磁体的最大横向尺寸的宽度。