公开(公告)号：US20230416918A1

公开(公告)日：2023-12-28

申请号：US18035200

申请日：2021-11-09

Applicant: LAM RESEARCH CORPORATION

Inventor： Christopher GAGE

IPC: C23C16/458 ,  C23C16/455 ,  C23C16/44

CPC classification number: C23C16/4585 ,  C23C16/45544 ,  C23C16/4408 ,  C23C16/4409 ,  C23C16/4586

Abstract: A pedestal assembly for a substrate processing system includes a pedestal including a pedestal plate with a plurality of gas through holes and a stem extending downwardly from the pedestal plate. The plurality of gas through holes extend from a first surface of the pedestal plate to a second surface of the pedestal plate at a location radially outside of the stem. A collar is arranged around the stem of the pedestal and openings of the plurality of gas through holes are located on the second surface of the pedestal. The collar defines an annular volume between the collar and the stem of the pedestal. An upwardly facing surface of the collar makes a surface-to-surface seal with the second surface of the pedestal.

公开(公告)号：US20230073259A1

公开(公告)日：2023-03-09

申请号：US17799866

申请日：2021-02-17

Applicant: LAM RESEARCH CORPORATION

Inventor： Ramesh CHANDRASEKHARAN ,  Karl Frederick LEESER ,  Christopher GAGE ,  Seshu NIMMALA ,  Ramkishan Rao LINGAMPALLI ,  Joel HOLLINGSWORTH ,  Vincent BURKHART ,  William LAFFERTY ,  Sergey Georgiyevich BELOSTOTSKIY

IPC: H01J37/32

Abstract: A baseplate for a substrate support includes a heater layer configured to selectively heat the baseplate and a heat spreader disposed between the heater layer and an upper surface of the baseplate. The heat spreader is configured to distribute heat provided by the heater layer throughout the baseplate. The baseplate includes a first material that has a first coefficient of thermal expansion (CTE) and a first thermal conductivity. The heat spreader includes a second material that has a second CTE and a second thermal conductivity greater than the first thermal conductivity.

公开(公告)号：US20240200191A1

公开(公告)日：2024-06-20

申请号：US18287372

申请日：2022-04-15

Applicant: LAM RESEARCH CORPORATION

Inventor： Christopher GAGE ,  Ramesh CHANDRASEKHARAN ,  Eric H. LENZ ,  Karl Frederick LEESER

IPC: C23C16/458 ,  C23C16/04 ,  C23C16/455

CPC classification number: C23C16/4585 ,  C23C16/04 ,  C23C16/45521 ,  C23C16/45565 ,  C23C16/4586

Abstract: Various systems and methods are provided to prevent backside deposition on a substrate by using a combination of approaches. The approaches include clamping the substrate to a pedestal and/or supplying purge gases to an area where deposition is not desired. The clamping methods include electrostatic or vacuum clamping. In addition, various pedestal and edge ring designs are provided for supplying purge gases to the area where deposition is not desired. The use of clamping in conjunction with purging can further enhance the performance without affecting deposition of materials on front side of the substrate. The clamping along the edge of the substrate can be made more effective by machining an upper surface of the pedestal to have a slight dish or dome like shape (i.e., concave or convex, respectively).

公开(公告)号：US20210398829A1

公开(公告)日：2021-12-23

申请号：US17297666

申请日：2019-11-25

Applicant: LAM RESEARCH CORPORATION

Inventor： Christopher GAGE

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate support for a substrate processing system configured to perform a deposition process on a substrate includes a pedestal having an upper surface configured to support a substrate and N heating layers vertically-stacked within the pedestal below the upper surface. Each of the N heating layers includes a respective resistive heating element. A watt density of the resistive heating element in at least one of the N heating layers varies in at least one radial zone of the substrate support relative to other radial zones of the substrate support.