公开(公告)号：US20220238360A1

公开(公告)日：2022-07-28

申请号：US17614930

申请日：2020-05-29

Applicant: LAM RESEARCH CORPORATION

Inventor： Siyuan TIAN ,  Yuma OHKURA ,  Changyou JING ,  Matthew CLAUSSEN

IPC: H01L21/67 ,  H01L21/683 ,  H01J37/32 ,  G01K1/08 ,  G01K1/143

Abstract: A sensor probe includes an elongated body defining an inner cavity having an inner diameter. A printed circuit board is configured to be fitted within the inner cavity. A first temperature-sensing integrated circuit mounted at a first end of the printed circuit board. A cap is mounted to a first end of the elongated body adjacent to the first temperature-sensing integrated circuit. A housing is configured to receive a second end of the elongated body, wherein the housing is configured to be mounted to a baseplate of a substrate support.