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1.
公开(公告)号:US20150003903A1
公开(公告)日:2015-01-01
申请号:US13930659
申请日:2013-06-28
Applicant: Lam Research Corporation
Inventor: Neal Newton
IPC: F16B2/06
CPC classification number: H01L21/68785 , H01L21/67126 , Y10T29/4987 , Y10T403/67
Abstract: An apparatus and method adapted to mount an elastomer band in a mounting groove around a semiconductor substrate support used for supporting a semiconductor substrate in a plasma processing chamber, which includes an installation unit having a top ring, a clamp ring, and a base ring, and upon tightening of the top ring onto the base ring, the elastomer band is clamped between the clamp ring and the base ring, and a clamping surface adapted to release the elastomer band on at least one of a lower surface of the clamp ring and/or an upper surface of the base ring. A latch and release mechanism, which releases the elastomer band into the mounting groove by declamping the elastomer band from between the clamp ring and the base ring.
Abstract translation: 一种适于将弹性体带安装在用于在等离子体处理室中支撑半导体衬底的半导体衬底支架周围的安装槽中的装置和方法,其包括具有顶环,夹环和基环的安装单元, 并且在将顶环紧固到基座环上时,弹性带被夹紧在夹紧环和基座环之间,并且夹紧表面适于将弹性体带释放在夹紧环的下表面和/ 或基座的上表面。 一种闩锁和释放机构,其通过从夹紧环和基座环之间伸出弹性体带将弹性体带释放到安装槽中。
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2.
公开(公告)号:US09502279B2
公开(公告)日:2016-11-22
申请号:US13930659
申请日:2013-06-28
Applicant: Lam Research Corporation
Inventor: Neal Newton
IPC: H01L21/67 , H01L21/687
CPC classification number: H01L21/68785 , H01L21/67126 , Y10T29/4987 , Y10T403/67
Abstract: An apparatus and method adapted to mount an elastomer band in a mounting groove around a semiconductor substrate support used for supporting a semiconductor substrate in a plasma processing chamber, which includes an installation unit having a top ring, a clamp ring, and a base ring, and upon tightening of the top ring onto the base ring, the elastomer band is clamped between the clamp ring and the base ring, and a clamping surface adapted to release the elastomer band on at least one of a lower surface of the clamp ring and/or an upper surface of the base ring. A latch and release mechanism, which releases the elastomer band into the mounting groove by declamping the elastomer band from between the clamp ring and the base ring.
Abstract translation: 一种适于将弹性体带安装在用于在等离子体处理室中支撑半导体衬底的半导体衬底支架周围的安装槽中的装置和方法,其包括具有顶环,夹环和基环的安装单元, 并且在将顶环紧固到基座环上时,弹性带被夹紧在夹紧环和基座环之间,并且夹紧表面适于将弹性体带释放在夹紧环的下表面和/ 或基座的上表面。 一种闩锁和释放机构,其通过从夹紧环和基座环之间伸出弹性体带将弹性体带释放到安装槽中。
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3.
公开(公告)号:US09105676B2
公开(公告)日:2015-08-11
申请号:US13624822
申请日:2012-09-21
Applicant: LAM RESEARCH CORPORATION
Inventor: Hong Shih , Tuochuan Huang , Yan Fang , Cliff LaCroix , Neal Newton , Rish Chhatre
IPC: B08B7/00 , H01L21/683 , B08B1/00 , B08B5/00 , B08B5/02
CPC classification number: H01L21/6833 , B08B1/00 , B08B5/00 , B08B5/02 , B08B7/00 , B08B7/0071
Abstract: A method of removing an epoxy band from an electrostatic chuck includes securing the electrostatic chuck in a servicing fixture, applying a thermal source to the epoxy band to breakdown a plurality of adhesive bonds securing the epoxy band to the electrostatic chuck, forming a hole in the epoxy band and pulling the epoxy band from the electrostatic chuck. A system for removing an epoxy band from an electrostatic chuck is also described.
Abstract translation: 从静电卡盘去除环氧树脂带的方法包括将静电卡盘固定在维修夹具中,将热源施加到环氧树脂带上,以将多个粘合剂固定到静电卡盘上,从而在环形带中形成孔 环氧树脂带,并从静电吸盘拉环氧树脂带。 还描述了用于从静电卡盘除去环氧树脂带的系统。
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4.
公开(公告)号:US20140083461A1
公开(公告)日:2014-03-27
申请号:US13624822
申请日:2012-09-21
Applicant: LAM RESEARCH CORPORATION
Inventor: Hong Shih , Tuochuan Huang , Yan Fang , Cliff LaCroix , Neal Newton , Rish Chhatre
IPC: B08B7/00
CPC classification number: H01L21/6833 , B08B1/00 , B08B5/00 , B08B5/02 , B08B7/00 , B08B7/0071
Abstract: A method of removing an epoxy band from an electrostatic chuck includes securing the electrostatic chuck in a servicing fixture, applying a thermal source to the epoxy band to breakdown a plurality of adhesive bonds securing the epoxy band to the electrostatic chuck, forming a hole in the epoxy band and pulling the epoxy band from the electrostatic chuck. A system for removing an epoxy band from an electrostatic chuck is also described.
Abstract translation: 从静电卡盘去除环氧树脂带的方法包括将静电卡盘固定在维修夹具中,将热源施加到环氧树脂带上,以将多个粘合剂固定到静电卡盘上,从而在环形带中形成孔 环氧树脂带,并从静电吸盘拉环氧树脂带。 还描述了用于从静电卡盘除去环氧树脂带的系统。
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