公开(公告)号：US20150147832A1

公开(公告)日：2015-05-28

申请号：US14266767

申请日：2014-04-30

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Li-Cheng YANG ,  Chun-Ying HUANG

IPC: H01L33/00

CPC classification number: H01L33/0095 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27618 ,  H01L2224/27831 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83002 ,  H01L2224/83031 ,  H01L2224/83192 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2933/0066

Abstract: A method for producing a light-emitting diode is provided, including the following steps. First, a carrier is provided, wherein the carrier comprises a die bonding surface. Then, a die bonding adhesive layer is formed on the die bonding surface, wherein the die bonding adhesive layer has a photoresist property. Next, at least one lighting chip is disposed on the die bonding adhesive layer, and an uncovered portion of the die bonding adhesive layer is not covered by the lighting chip. Finally, the uncovered portion of the die bonding adhesive layer is removed.

Abstract translation: 提供了一种制造发光二极管的方法，包括以下步骤。 首先，提供载体，其中载体包括芯片接合表面。 然后，在芯片接合面上形成芯片接合粘合剂层，其中芯片粘合粘合剂层具有光致抗蚀剂性质。 接下来，在芯片粘合层上设置至少一个照明芯片，芯片粘合层的未覆盖部分未被照明芯片覆盖。 最后，除去芯片粘合层的未覆盖部分。