公开(公告)号：US20140185274A1

公开(公告)日：2014-07-03

申请号：US14201315

申请日：2014-03-07

Applicant: LG CHEM, LTD.

Inventor： Sang Ki CHUN ,  In Seok HWANG ,  Dong-Wook LEE ,  Ji Young HWANG

IPC: H01L33/56 ,  G02F1/1335

CPC classification number: H01L33/56 ,  C08K3/017 ,  C08K3/18 ,  C08K3/30 ,  C08K5/17 ,  C08K5/3445 ,  C08K5/43 ,  C08K2003/2203 ,  C08K2201/001 ,  C08L83/04 ,  G02F1/1336 ,  H01B1/22 ,  H01L23/29 ,  H01L51/5253

Abstract: An encapsulating composition for a light emitting element, a light emitting diode (LED) and a liquid crystal display device (LCD) are provided. A silicone-cured product included as a main ingredient and a conductivity-providing agent having excellent compatibility and capable of providing superior conductivity can be used to significantly reduce the surface resistivity of the silicone-cured product. Therefore, the encapsulating composition for a light emitting element, the LED and the LCD can be useful in solving the problems regarding attachment of a foreign substance such as dust due to static electricity, and degradation of transparency since the composition has low surface resistivity when used as a semiconductor encapsulation material for an LED, and also in providing a cured product having excellent properties such as light resistance, heat resistance, durability and optical transparency.

Abstract translation: 本发明提供一种发光元件封装组合物，发光二极管（LED）和液晶显示装置（LCD）。 可以使用包含作为主要成分的硅酮固化产物和具有优异相容性并且能够提供优异导电性的导电性提供剂，以显着降低硅氧烷固化产物的表面电阻率。 因此，用于发光元件的封装组合物，LED和LCD可用于解决由于静电引起的诸如灰尘等异物的附着和透明度的降低的问题，因为组合物在使用时具有低的表面电阻率 作为LED的半导体封装材料，并且还提供具有优异性能如耐光性，耐热性，耐久性和光学透明性的固化产物。