公开(公告)号：US20200369925A1

公开(公告)日：2020-11-26

申请号：US16959625

申请日：2019-01-11

Applicant: LG CHEM, LTD.

Inventor： Mi Seon YOON ,  Se Ra KIM ,  Kwang Joo LEE ,  Bora YEON ,  Sung Chan PARK ,  Eun Yeong KIM

IPC: C09J7/30 ,  C09J133/08 ,  C09J133/10 ,  C09J7/22 ,  H01L21/683

Abstract: The present invention relates to a back grinding tape including a polymer substrate and an adhesive layer, wherein the adhesive layer includes a (meth)acrylate resin containing 30 to 60% by weight of a repeating unit derived from a monomer or an oligomer having a glass transition temperature of 0° C. or higher, and wherein the adhesive layer has a glass transition temperature of −20° C. to 10° C., and a method of grinding wafers using the back grinding tape.

公开(公告)号：US20210002518A1

公开(公告)日：2021-01-07

申请号：US16969255

申请日：2019-03-07

Applicant: LG CHEM, LTD.

Inventor： Eun Yeong KIM ,  Sera KIM ,  Kwang Joo LEE ,  Sang Hwan KIM ,  Sung Chan PARK ,  Mi Seon YOON

IPC: C09J7/29 ,  C09J133/08 ,  H01L21/683

Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.