公开(公告)号：US20210035847A1

公开(公告)日：2021-02-04

申请号：US16964364

申请日：2019-06-04

Applicant: LG CHEM, LTD.

Inventor： Mi Seon YOON ,  Sera KIM ,  Kwang Joo LEE ,  Bora YEON ,  Sang Hwan KIM ,  Eun Yeong KIM

IPC: H01L21/683 ,  H01L21/304 ,  C09J7/29

Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of −30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.

公开(公告)号：US20210002518A1

公开(公告)日：2021-01-07

申请号：US16969255

申请日：2019-03-07

Applicant: LG CHEM, LTD.

Inventor： Eun Yeong KIM ,  Sera KIM ,  Kwang Joo LEE ,  Sang Hwan KIM ,  Sung Chan PARK ,  Mi Seon YOON

IPC: C09J7/29 ,  C09J133/08 ,  H01L21/683

Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.

公开(公告)号：US20230151123A1

公开(公告)日：2023-05-18

申请号：US17917101

申请日：2021-07-22

Applicant: LG CHEM, LTD.

Inventor： Sang Hwan KIM ,  Jung Woo CHOI ,  Ki Seung SEO ,  Kwang Su SEO ,  Jun Beom PARK ,  Won Seup CHO

IPC: C08F2/50 ,  C08F222/10 ,  C08G18/44 ,  C08G18/10 ,  C08G18/62 ,  C08F220/18 ,  C08G18/24 ,  C08F220/20 ,  C08F220/30 ,  C08J7/04 ,  C08J7/046 ,  H01L21/683

CPC classification number: C08F2/50 ,  C08F222/1065 ,  C08G18/44 ,  C08G18/10 ,  C08G18/6229 ,  C08F220/1811 ,  C08G18/246 ,  C08F220/20 ,  C08F220/1808 ,  C08F220/301 ,  C08J7/042 ,  C08J7/046 ,  H01L21/6836 ,  C08G2150/00 ,  C08J2375/14

Abstract: The present disclosure provides a photocurable composition, which has excellent coatability and is capable of providing a coating layer having excellent surface quality and thickness uniformity, a coating layer including a cured product of the photocurable composition, and a substrate for a semiconductor process including the coating layer.