DISPLAY DEVICE
    2.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20240224712A1

    公开(公告)日:2024-07-04

    申请号:US18303242

    申请日:2023-04-19

    CPC classification number: H10K59/80523 H10K59/873 H10K59/131

    Abstract: A display device includes a substrate; an organic light-emissive layer disposed on the substrate; and a cathode electrode layer disposed on the organic light-emissive layer, wherein the cathode electrode layer includes: a first electrode layer disposed on the organic light-emissive layer; a second electrode layer disposed on the first electrode layer; and a third electrode layer disposed on the second electrode layer, wherein the second electrode layer is a conductive organic material layer. The second electrode layer can absorb heat from laser to reduce damage to the third electrode layer. Thus, penetration of external defect-causing factors into the organic light-emissive layer through the third electrode layer can be reduced.

    METHOD OF FORMING LOW-RESISTANCE WIRE AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR USING THE SAME
    3.
    发明申请
    METHOD OF FORMING LOW-RESISTANCE WIRE AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR USING THE SAME 有权
    形成低电阻线的方法及使用其制造薄膜晶体管的方法

    公开(公告)号:US20140073094A1

    公开(公告)日:2014-03-13

    申请号:US13728709

    申请日:2012-12-27

    Abstract: This document relates to a method of forming low-resistance metal gate and data wirings and a method of manufacturing a thin film transistor using the same. The method of the wiring includes depositing a metal layer on a base layer; exposing a portion of the base layer by removing a portion of the metal layer; forming grooves in the base layer; forming a seed layer in the grooves of the base layer; and forming a wire consisting of the seed layer and a plated layer by plating a plating material on the seed layer formed in the grooves of the base layer.

    Abstract translation: 本文件涉及形成低电阻金属栅极和数据布线的方法以及使用其制造薄膜晶体管的方法。 布线方法包括在基层上沉积金属层; 通过去除金属层的一部分来暴露基底层的一部分; 在基层中形成凹槽; 在基层的槽中形成种子层; 以及通过在形成在所述基底层的沟槽中的种子层上镀覆电镀材料来形成由种子层和镀层组成的线。

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