Thin film transistor substrate having metal oxide semiconductor and manufacturing the same
    2.
    发明授权
    Thin film transistor substrate having metal oxide semiconductor and manufacturing the same 有权
    薄膜晶体管基板具有金属氧化物半导体并制造其

    公开(公告)号:US09324736B2

    公开(公告)日:2016-04-26

    申请号:US14550483

    申请日:2014-11-21

    Abstract: The present disclosure relates to a thin film transistor substrate having a metal oxide semiconductor for flat panel displays and a method for manufacturing the same. The present disclosure suggests a thin film transistor substrate including: a gate electrode on a substrate; a gate insulating layer covering the gate electrode; a source electrode overlapping with one side of the gate electrode on the gate insulating layer; a drain electrode being apart from the source electrode and overlapping with other side of the gate electrode on the gate insulating layer; an oxide semiconductor layer contacting an upper surface of the source electrode and the drain electrode, and extending from the source electrode to the drain electrode; and an etch stopper having the same shape with the oxide semiconductor layer, and contacting an upper surface of the oxide semiconductor layer.

    Abstract translation: 本公开涉及具有用于平板显示器的金属氧化物半导体的薄膜晶体管基板及其制造方法。 本公开提出一种薄膜晶体管衬底,其包括:衬底上的栅电极; 覆盖栅电极的栅极绝缘层; 源电极,与所述栅极绝缘层上的所述栅电极的一侧重叠; 漏电极与源极分离并与栅极绝缘层上的栅电极的另一侧重叠; 与源电极和漏电极的上表面接触并从源极延伸到漏电极的氧化物半导体层; 以及与氧化物半导体层具有相同形状并与氧化物半导体层的上表面接触的蚀刻停止层。

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