公开(公告)号：US11466378B2

公开(公告)日：2022-10-11

申请号：US16732099

申请日：2019-12-31

Applicant: LG Display Co., Ltd.

Inventor： Gotae Kim ,  ByeongSun Yoo ,  ByungChul Ahn ,  WooChan Kim ,  JuYoung Jeong ,  SangCheol Moon ,  Wook Kim ,  Changjun Choi

IPC: C25D5/04 ,  C25D5/02 ,  C25D17/10 ,  H01L51/56 ,  H01L51/00 ,  C25D17/06

Abstract: Electroplating apparatus and electroplating method using the same. Provided is an electroplating apparatus. The electroplating apparatus includes a plating bath and a stage configured to support a substrate loaded into the plating bath to be disposed in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes disposed on both sides of the substrate and an anode configured to be movable above the substrate. The electroplating apparatus also includes a plurality of spray nozzles disposed on at least one side of the anode and configured to spray a plating solution. The electroplating apparatus further includes a shield which is disposed on both sides of the anode and whose one end is more adjacent to the substrate than the anode.

公开(公告)号：US20200208289A1

公开(公告)日：2020-07-02

申请号：US16732099

申请日：2019-12-31

Applicant: LG Display Co., Ltd.

Inventor： Gotae Kim ,  ByeongSun Yoo ,  ByungChul Ahn ,  WooChan Kim ,  JuYoung Jeong ,  SangCheol Moon ,  Wook Kim ,  Changjun Choi

IPC: C25D5/02 ,  C25D5/04 ,  C25D17/10 ,  C25D17/06 ,  H01L51/00 ,  H01L51/56

Abstract: Electroplating apparatus and electroplating method using the same. Provided is an electroplating apparatus. The electroplating apparatus includes a plating bath and a stage configured to support a substrate loaded into the plating bath to be disposed in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes disposed on both sides of the substrate and an anode configured to be movable above the substrate. The electroplating apparatus also includes a plurality of spray nozzles disposed on at least one side of the anode and configured to spray a plating solution. The electroplating apparatus further includes a shield which is disposed on both sides of the anode and whose one end is more adjacent to the substrate than the anode.