公开(公告)号：US11649555B2

公开(公告)日：2023-05-16

申请号：US16573905

申请日：2019-09-17

Applicant: LG Display Co., Ltd.

Inventor： Gotae Kim ,  WooChan Kim ,  Changjun Choi ,  SangCheol Moon ,  Wook Kim

IPC: C25D5/04 ,  C25D17/02

CPC classification number: C25D5/04 ,  C25D17/02

Abstract: An electroplating apparatus includes a plating bath and a substrate in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate, and an anode above the substrate, the anode being spaced apart from the substrate and configured to be movable in the first direction.

公开(公告)号：US20200208289A1

公开(公告)日：2020-07-02

申请号：US16732099

申请日：2019-12-31

Applicant: LG Display Co., Ltd.

Inventor： Gotae Kim ,  ByeongSun Yoo ,  ByungChul Ahn ,  WooChan Kim ,  JuYoung Jeong ,  SangCheol Moon ,  Wook Kim ,  Changjun Choi

IPC: C25D5/02 ,  C25D5/04 ,  C25D17/10 ,  C25D17/06 ,  H01L51/00 ,  H01L51/56

Abstract: Electroplating apparatus and electroplating method using the same. Provided is an electroplating apparatus. The electroplating apparatus includes a plating bath and a stage configured to support a substrate loaded into the plating bath to be disposed in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes disposed on both sides of the substrate and an anode configured to be movable above the substrate. The electroplating apparatus also includes a plurality of spray nozzles disposed on at least one side of the anode and configured to spray a plating solution. The electroplating apparatus further includes a shield which is disposed on both sides of the anode and whose one end is more adjacent to the substrate than the anode.

公开(公告)号：US11466378B2

公开(公告)日：2022-10-11

申请号：US16732099

申请日：2019-12-31

Applicant: LG Display Co., Ltd.

Inventor： Gotae Kim ,  ByeongSun Yoo ,  ByungChul Ahn ,  WooChan Kim ,  JuYoung Jeong ,  SangCheol Moon ,  Wook Kim ,  Changjun Choi

IPC: C25D5/04 ,  C25D5/02 ,  C25D17/10 ,  H01L51/56 ,  H01L51/00 ,  C25D17/06

Abstract: Electroplating apparatus and electroplating method using the same. Provided is an electroplating apparatus. The electroplating apparatus includes a plating bath and a stage configured to support a substrate loaded into the plating bath to be disposed in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes disposed on both sides of the substrate and an anode configured to be movable above the substrate. The electroplating apparatus also includes a plurality of spray nozzles disposed on at least one side of the anode and configured to spray a plating solution. The electroplating apparatus further includes a shield which is disposed on both sides of the anode and whose one end is more adjacent to the substrate than the anode.

公开(公告)号：US20200208290A1

公开(公告)日：2020-07-02

申请号：US16573905

申请日：2019-09-17

Applicant: LG Display Co., Ltd.

Inventor： Gotae Kim ,  WooChan Kim ,  Changjun Choi ,  SangCheol Moon ,  Wook Kim

IPC: C25D5/04 ,  C25D17/02

Abstract: An electroplating apparatus includes a plating bath and a substrate in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate, and an anode above the substrate, the anode being spaced apart from the substrate and configured to be movable in the first direction.