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公开(公告)号：US11466378B2
公开(公告)日：2022-10-11
申请号：US16732099
申请日：2019-12-31
Applicant: LG Display Co., Ltd.
Inventor： Gotae Kim , ByeongSun Yoo , ByungChul Ahn , WooChan Kim , JuYoung Jeong , SangCheol Moon , Wook Kim , Changjun Choi
Abstract: Electroplating apparatus and electroplating method using the same. Provided is an electroplating apparatus. The electroplating apparatus includes a plating bath and a stage configured to support a substrate loaded into the plating bath to be disposed in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes disposed on both sides of the substrate and an anode configured to be movable above the substrate. The electroplating apparatus also includes a plurality of spray nozzles disposed on at least one side of the anode and configured to spray a plating solution. The electroplating apparatus further includes a shield which is disposed on both sides of the anode and whose one end is more adjacent to the substrate than the anode.
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公开(公告)号：US20200208289A1
公开(公告)日：2020-07-02
申请号：US16732099
申请日：2019-12-31
Applicant: LG Display Co., Ltd.
Inventor： Gotae Kim , ByeongSun Yoo , ByungChul Ahn , WooChan Kim , JuYoung Jeong , SangCheol Moon , Wook Kim , Changjun Choi
Abstract: Electroplating apparatus and electroplating method using the same. Provided is an electroplating apparatus. The electroplating apparatus includes a plating bath and a stage configured to support a substrate loaded into the plating bath to be disposed in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes disposed on both sides of the substrate and an anode configured to be movable above the substrate. The electroplating apparatus also includes a plurality of spray nozzles disposed on at least one side of the anode and configured to spray a plating solution. The electroplating apparatus further includes a shield which is disposed on both sides of the anode and whose one end is more adjacent to the substrate than the anode.
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公开(公告)号：US11530489B2
公开(公告)日：2022-12-20
申请号：US16730582
申请日：2019-12-30
Applicant: LG Display Co., Ltd.
Inventor： ByeongSun Yoo , WooChan Kim , Gotae Kim
IPC: C25D5/04 , C25D5/02 , H05K3/18 , B05D1/02 , C23C18/16 , C25D17/00 , C25D3/02 , C25D1/10 , C25D5/18
Abstract: Provided is an apparatus for electro-forming. The apparatus for electro-forming includes a plating bath which is a space where a substrate is plated and a clamp disposed within the plating bath and configured to grasp the substrate disposed in a horizontal direction. The apparatus for electro-forming further includes an assembly including an anode spaced above the substrate and connected to an external power supply and a plating solution supply unit spaced above the substrate and configured to supply a plating solution. The apparatus for electro-forming also includes a driving unit configured to reciprocate the assembly in a horizontal direction at a distance from the substrate. The assembly further includes an insulator between the anode and the plating solution supply unit.
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公开(公告)号：US20200208288A1
公开(公告)日：2020-07-02
申请号：US16730582
申请日：2019-12-30
Applicant: LG Display Co., Ltd.
Inventor： ByeongSun Yoo , WooChan Kim , Gotae Kim
Abstract: Provided is an apparatus for electro-forming. The apparatus for electro-forming includes a plating bath which is a space where a substrate is plated and a clamp disposed within the plating bath and configured to grasp the substrate disposed in a horizontal direction. The apparatus for electro-forming further includes an assembly including an anode spaced above the substrate and connected to an external power supply and a plating solution supply unit spaced above the substrate and configured to supply a plating solution. The apparatus for electro-forming also includes a driving unit configured to reciprocate the assembly in a horizontal direction at a distance from the substrate. The assembly further includes an insulator between the anode and the plating solution supply unit.
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