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公开(公告)号：US20200208289A1
公开(公告)日：2020-07-02
申请号：US16732099
申请日：2019-12-31
Applicant: LG Display Co., Ltd.
Inventor： Gotae Kim , ByeongSun Yoo , ByungChul Ahn , WooChan Kim , JuYoung Jeong , SangCheol Moon , Wook Kim , Changjun Choi
Abstract: Electroplating apparatus and electroplating method using the same. Provided is an electroplating apparatus. The electroplating apparatus includes a plating bath and a stage configured to support a substrate loaded into the plating bath to be disposed in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes disposed on both sides of the substrate and an anode configured to be movable above the substrate. The electroplating apparatus also includes a plurality of spray nozzles disposed on at least one side of the anode and configured to spray a plating solution. The electroplating apparatus further includes a shield which is disposed on both sides of the anode and whose one end is more adjacent to the substrate than the anode.
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公开(公告)号：US11530489B2
公开(公告)日：2022-12-20
申请号：US16730582
申请日：2019-12-30
Applicant: LG Display Co., Ltd.
Inventor： ByeongSun Yoo , WooChan Kim , Gotae Kim
IPC: C25D5/04 , C25D5/02 , H05K3/18 , B05D1/02 , C23C18/16 , C25D17/00 , C25D3/02 , C25D1/10 , C25D5/18
Abstract: Provided is an apparatus for electro-forming. The apparatus for electro-forming includes a plating bath which is a space where a substrate is plated and a clamp disposed within the plating bath and configured to grasp the substrate disposed in a horizontal direction. The apparatus for electro-forming further includes an assembly including an anode spaced above the substrate and connected to an external power supply and a plating solution supply unit spaced above the substrate and configured to supply a plating solution. The apparatus for electro-forming also includes a driving unit configured to reciprocate the assembly in a horizontal direction at a distance from the substrate. The assembly further includes an insulator between the anode and the plating solution supply unit.
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Patent Agency Ranking
公开(公告)号：US11649555B2
公开(公告)日：2023-05-16
申请号：US16573905
申请日：2019-09-17
Applicant: LG Display Co., Ltd.
Inventor： Gotae Kim , WooChan Kim , Changjun Choi , SangCheol Moon , Wook Kim
Abstract: An electroplating apparatus includes a plating bath and a substrate in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate, and an anode above the substrate, the anode being spaced apart from the substrate and configured to be movable in the first direction.
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公开(公告)号：US20200208288A1
公开(公告)日：2020-07-02
申请号：US16730582
申请日：2019-12-30
Applicant: LG Display Co., Ltd.
Inventor： ByeongSun Yoo , WooChan Kim , Gotae Kim
Abstract: Provided is an apparatus for electro-forming. The apparatus for electro-forming includes a plating bath which is a space where a substrate is plated and a clamp disposed within the plating bath and configured to grasp the substrate disposed in a horizontal direction. The apparatus for electro-forming further includes an assembly including an anode spaced above the substrate and connected to an external power supply and a plating solution supply unit spaced above the substrate and configured to supply a plating solution. The apparatus for electro-forming also includes a driving unit configured to reciprocate the assembly in a horizontal direction at a distance from the substrate. The assembly further includes an insulator between the anode and the plating solution supply unit.
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公开(公告)号：US20250076931A1
公开(公告)日：2025-03-06
申请号：US18802669
申请日：2024-08-13
Applicant: LG Display Co., Ltd.
Inventor： Gotae Kim , JungHyun Kim
IPC: G06F1/16
Abstract: A display device includes a display panel comprising a plurality of non-bending areas, and a bending area between the plurality of non-bending areas; and a support member on a rear surface of the display panel, wherein a first end of the support member in the bending area and a second end of the support member in the non-bending area have different shapes.
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公开(公告)号：US11466378B2
公开(公告)日：2022-10-11
申请号：US16732099
申请日：2019-12-31
Applicant: LG Display Co., Ltd.
Inventor： Gotae Kim , ByeongSun Yoo , ByungChul Ahn , WooChan Kim , JuYoung Jeong , SangCheol Moon , Wook Kim , Changjun Choi
Abstract: Electroplating apparatus and electroplating method using the same. Provided is an electroplating apparatus. The electroplating apparatus includes a plating bath and a stage configured to support a substrate loaded into the plating bath to be disposed in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes disposed on both sides of the substrate and an anode configured to be movable above the substrate. The electroplating apparatus also includes a plurality of spray nozzles disposed on at least one side of the anode and configured to spray a plating solution. The electroplating apparatus further includes a shield which is disposed on both sides of the anode and whose one end is more adjacent to the substrate than the anode.
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公开(公告)号：US20200208290A1
公开(公告)日：2020-07-02
申请号：US16573905
申请日：2019-09-17
Applicant: LG Display Co., Ltd.
Inventor： Gotae Kim , WooChan Kim , Changjun Choi , SangCheol Moon , Wook Kim
Abstract: An electroplating apparatus includes a plating bath and a substrate in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate, and an anode above the substrate, the anode being spaced apart from the substrate and configured to be movable in the first direction.
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