DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT EMITTING ELEMENT

    公开(公告)号:US20240186473A1

    公开(公告)日:2024-06-06

    申请号:US18285192

    申请日:2022-03-31

    CPC classification number: H01L33/62 H01L25/167 H01L27/124

    Abstract: A display device including a semiconductor light emitting device according to an embodiment includes a substrate, first assembly wiring and second assembly wiring alternately arranged on the substrate and spaced apart from each other, a planarization layer disposed on the first assembly wiring and the second assembly wiring and having a first opening, a semiconductor light emitting device disposed inside the first opening and having a first electrode overlapping the first assembled wiring and the second assembled wiring, and an assembly wiring connection pattern that electrically connects the first assembly wiring and the second assembly wiring. And first electrode can be electrically connected to one of the first assembly wiring and the second assembly wiring.

    DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENT

    公开(公告)号:US20240258480A1

    公开(公告)日:2024-08-01

    申请号:US18290644

    申请日:2022-07-22

    CPC classification number: H01L33/62 H01L25/167 H01L33/54

    Abstract: A display device according to the embodiment includes a substrate, a first assembly wiring and a second assembly wiring alternately arranged on the substrate and spaced apart from each other, a planarization layer disposed on the first assembly wiring and the second assembly wiring and having an opening and a contact portion, a light emitting device disposed inside the opening and having a first electrode overlapping the first assembly wiring and the second assembly wiring, and a pixel electrode disposed on the planarization layer and in contact with the second electrode of the light emitting device through a contact portion, and the plurality of contact units may overlap a portion of at least one side of the area where the light emitting device is disposed.

    DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT EMITTING ELEMENT

    公开(公告)号:US20250048816A1

    公开(公告)日:2025-02-06

    申请号:US18717888

    申请日:2022-11-28

    Abstract: A display device according to an embodiment includes a substrate, first assembly wiring and second assembly wiring spaced apart from each other on the substrate, a first insulating layer disposed between the first assembly wiring and the second assembly wiring, a first planarization layer disposed on the second assembly wiring and having an opening overlapping the second assembly wiring, a light emitting device disposed inside the opening and including a first semiconductor layer and a second semiconductor layer on the first semiconductor layer, and contact electrode electrically connecting the second assembly wiring and the first semiconductor layer, and the contact electrode is in contact with the second assembly wiring that overlaps the side surface of the first semiconductor layer and the first planarization layer.

    DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENT

    公开(公告)号:US20250023002A1

    公开(公告)日:2025-01-16

    申请号:US18713565

    申请日:2022-10-11

    Abstract: A display device including a semiconductor light emitting device according to an embodiment may include a substrate, a first assembly wiring and a second assembly wiring arranged to be spaced apart from each other on the substrate, a planarization layer disposed on the first assembly wiring and the second assembly wiring and having an opening overlapping the first assembly wiring and the second assembly wiring, a light emitting device including a first electrode placed inside the opening and electrically connected to the first assembly wiring, and wherein the opening includes a main opening and one or more auxiliary openings that are connected to the main opening and are smaller than the main opening.

Patent Agency Ranking