Display device comprising at least one heat dissipation pattern

    公开(公告)号:US11963396B2

    公开(公告)日:2024-04-16

    申请号:US17409544

    申请日:2021-08-23

    CPC classification number: H10K50/87 H10K50/8426

    Abstract: A display device includes an encapsulating structure disposed on an array substrate, a bottom cover accommodating therein the array substrate and the encapsulating structure, and at least one heat dissipation pattern disposed between the encapsulating structure and the bottom cover. The heat dissipation pattern may include a porous framework layer and a heat emission layer composed of particles coated on the framework layer. This heat dissipation pattern may allow heat transfer from the encapsulating structure to the bottom cover to be performed more quickly and efficiently.

    Display Device
    3.
    发明申请

    公开(公告)号:US20220109124A1

    公开(公告)日:2022-04-07

    申请号:US17409544

    申请日:2021-08-23

    Abstract: A display device includes an encapsulating structure disposed on an array substrate, a bottom cover accommodating therein the array substrate and the encapsulating structure, and at least one heat dissipation pattern disposed between the encapsulating structure and the bottom cover. The heat dissipation pattern may include a porous framework layer and a heat emission layer composed of particles coated on the framework layer. This heat dissipation pattern may allow heat transfer from the encapsulating structure to the bottom cover to be performed more quickly and efficiently.

    Display device with piezoelectric actuator

    公开(公告)号:US12266643B2

    公开(公告)日:2025-04-01

    申请号:US17778707

    申请日:2021-05-17

    Abstract: The present disclosure relates to a display device including a piezoelectric film type actuator, the display device having a structure in which a groove is provided in a rear surface of a metal layer for supporting and encapsulate a rear surface of a display panel and the piezoelectric film type actuator is disposed in the groove. Accordingly, the display device may reduce the overall thickness and improve heat dissipation performance.

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