公开(公告)号：US12213335B2

公开(公告)日：2025-01-28

申请号：US17539637

申请日：2021-12-01

Applicant: LG Display Co., Ltd.

Inventor： Minjoo Kang ,  Joohwan Shin ,  Jin-Hoo Kim

IPC: H10K59/127 ,  H10K50/84 ,  H10K50/842 ,  H10K59/131 ,  H10K77/10

Abstract: A display device includes a first substrate having a thin-film transistor; a second substrate spaced apart from the first substrate; a dam disposed between the first substrate and the second substrate and disposed on an edge area of the first substrate; and a gap-maintaining film disposed between the first substrate and the second substrate and disposed on a central area of the first substrate surrounded with the edge area, wherein the dam contains an UV curable resin and a curing retarder. Thus, a sufficient time duration required for a bonding process after UV irradiation for curing the dam is secured.

公开(公告)号：US11963396B2

公开(公告)日：2024-04-16

申请号：US17409544

申请日：2021-08-23

Applicant: LG Display Co., Ltd.

Inventor： Minjoo Kang ,  Dohyung Kim ,  Jaeho Choi

IPC: H10K50/87 ,  H10K50/842

CPC classification number: H10K50/87 ,  H10K50/8426

Abstract: A display device includes an encapsulating structure disposed on an array substrate, a bottom cover accommodating therein the array substrate and the encapsulating structure, and at least one heat dissipation pattern disposed between the encapsulating structure and the bottom cover. The heat dissipation pattern may include a porous framework layer and a heat emission layer composed of particles coated on the framework layer. This heat dissipation pattern may allow heat transfer from the encapsulating structure to the bottom cover to be performed more quickly and efficiently.

公开(公告)号：US20220173355A1

公开(公告)日：2022-06-02

申请号：US17539637

申请日：2021-12-01

Applicant: LG Display Co., Ltd.

Inventor： Minjoo Kang ,  Joohwan Shin ,  Jin-Hoo Kim

IPC: H01L51/52 ,  H01L27/32

Abstract: A display device includes a first substrate having a thin-film transistor; a second substrate spaced apart from the first substrate; a dam disposed between the first substrate and the second substrate and disposed on an edge area of the first substrate; and a gap-maintaining film disposed between the first substrate and the second substrate and disposed on a central area of the first substrate surrounded with the edge area, wherein the dam contains an UV curable resin and a curing retarder. Thus, a sufficient time duration required for a bonding process after UV irradiation for curing the dam is secured.

公开(公告)号：US20220131107A1

公开(公告)日：2022-04-28

申请号：US17511287

申请日：2021-10-26

Applicant: LG DISPLAY CO., LTD.

Inventor： Joohwan Shin ,  Dohyung Kim ,  Minjoo Kang ,  Jinho Kim ,  Heechul Lim ,  Eunjin Kim ,  Kitaek Cho ,  Hongdae Shin ,  Sinwoo Lee ,  Minho Oh ,  Jaeho Choi ,  Kyounghoon Kim

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/56

Abstract: Discussed is a display device including an array substrate having a display area, a non-display area positioned outside the display area, a light-emitting array, and a sealing structure disposed on the array substrate, wherein the sealing structure seals the light-emitting array, and fixes a plate-shaped reinforcing substrate facing toward the sealing structure to the array substrate, wherein the sealing structure includes a first adhesive layer facing toward the array substrate, a second adhesive layer facing toward the reinforcing substrate, and a barrier layer disposed between the first adhesive layer and the second adhesive layer.

公开(公告)号：US20220109124A1

公开(公告)日：2022-04-07

申请号：US17409544

申请日：2021-08-23

Applicant: LG Display Co., Ltd.

Inventor： Minjoo Kang ,  Dohyung Kim ,  Jaeho Choi

IPC: H01L51/52

Abstract: A display device includes an encapsulating structure disposed on an array substrate, a bottom cover accommodating therein the array substrate and the encapsulating structure, and at least one heat dissipation pattern disposed between the encapsulating structure and the bottom cover. The heat dissipation pattern may include a porous framework layer and a heat emission layer composed of particles coated on the framework layer. This heat dissipation pattern may allow heat transfer from the encapsulating structure to the bottom cover to be performed more quickly and efficiently.