公开(公告)号：US11706948B2

公开(公告)日：2023-07-18

申请号：US16875765

申请日：2020-05-15

申请人： LG Display Co., Ltd.

发明人： JooHwan Shin ,  Dohyung Kim ,  MinJoo Kang ,  Sungsoo Gil ,  MinHo Oh ,  TaeJin Choi

IPC分类号： H10K50/87 ,  H10K50/844 ,  H10K50/84 ,  H10K59/131

CPC分类号： H10K50/87 ,  H10K50/844 ,  H10K50/846 ,  H10K59/131

摘要： An organic light emitting display apparatus is disclosed, which comprises a substrate, a thin film transistor provided on the substrate, a planarization film provided on the thin film transistor, a light emitting diode provided on the planarization film and electrically connected with the thin film transistor, an encapsulation layer covering the light emitting diode, and an encapsulation substrate provided on the encapsulation layer, wherein the encapsulation substrate may include a first portion that includes a first member and a second portion that includes a second member.

公开(公告)号：US11737315B2

公开(公告)日：2023-08-22

申请号：US17672611

申请日：2022-02-15

申请人： LG Display Co., Ltd.

发明人： MinJoo Kang ,  JooHwan Shin ,  Dohyung Kim ,  MinHo Oh

IPC分类号： H10K50/87 ,  H10K50/842

CPC分类号： H10K50/87 ,  H10K50/8426

摘要： The disclosure relates to display panel and display apparatus including the same. The display panel includes a substrate including a display part displaying an image, an adhesive layer covering the display part, on the substrate, and a heat dissipation member on the adhesive layer. The heat dissipation member includes a first metal layer, a middle layer including an organic layer and a plurality of partition walls provided on the first metal layer, and a second metal layer provided on the middle layer.

公开(公告)号：US11283056B2

公开(公告)日：2022-03-22

申请号：US16886614

申请日：2020-05-28

申请人： LG Display Co., Ltd.

发明人： MinJoo Kang ,  JooHwan Shin ,  Dohyung Kim ,  MinHo Oh

IPC分类号： H01L51/52

摘要： The disclosure relates to display panel and display apparatus including the same. The display panel includes a substrate including a display part displaying an image, an adhesive layer covering the display part, on the substrate, and a heat dissipation member on the adhesive layer. The heat dissipation member includes a first metal layer, a middle layer including an organic layer and a plurality of partition walls provided on the first metal layer, and a second metal layer provided on the middle layer.